What Is Rogers PCB?
Rogers PCB is a high frequency board, which is different from traditional FR4 PCB boards. It has no glass fiber in the middle, and the high frequency material uses a ceramic base.
Rogers materials have excellent dielectric constant and temperature stability. Its dielectric constant and thermal expansion coefficient are very consistent with copper foil, which can be used to improve the deficiencies of PTFE based materials.
It is ideal for high-speed electronic design, commercial microwave and RF applications.
Advantages of Rogers PCB
The Advantages of using Rogers PCB are as below:
1) Rogers PCB has low moisture absorption, low thermal expansion and solid dimensional stability suitable for different conditions.
2) The material of RogersPCB is compatible, and the PCB is as thin as 0.1mm, which is easy to manufacture.
3) Rogers PCB has excellent thermal management capability, ideal for electronic devices and circuits that generate overheating.
4.)Outgassing in space applications can be reduced when Using Rogers PCB.
5)Rogers PCB matches trace location and size for enhanced impedance control.
6)Rogers PCB provides stable high frequency performance.
Why Choose Venture as Your Rogers PCB Supplier?
Venture is a PCB prototype manufacturer specializing in Rogers high frequency PCB boards, which can meet various high frequency PCB needs of customers.
At present, 4~10 layers of ceramic pure pressing and 4~12 layers of mixed pressing can be realized. We will use automated optical inspection and X-ray inspection for final testing before shipment. There will be strict impedance control and test reports for your confirmation.
We continually strive to create high quality Rogers PCB products and want to be the best partner with you.
Venture Rogers Materials
Venture offers Rogers materials designed with a low-loss dielectric that brings greater performance. Venture Roger laminates are one of the popular PCB materials for high-frequency PCB we offer.
As a leading manufacturer and supplier, we can offer you our Rogers laminate series such as Rogers 4350b, RO4350, RO4003C, RO4360, RO4233, RO3003, RO3006, RO3010, RO3035, etc.
No matter what you need for your project, we can provide a wide range of Rogers material series.
Venture Rogers laminates can provide a fundamental standard for PCB substrates. It keeps a widely effective balance between durability, cost, performance, manufacturability, and electrical properties.
Venture: Your Best Rogers Materials Supplier in China
Venture specializes in PCB materials manufacturing for more than 10 years. We are experts in most Roger materials that suit your project design.
Venture recommends Rogers laminates as electrical properties and performance is very important in your design. Venture Rogers laminates have advantages as follows:
- Effective-cost PCB fabrication
- Low electrical signal loss
- Better thermal management
- Lower dielectric loss
- Improve impedance control
- Low outgassing for space applications
We can provide Rogers materials that can withstand conditions. Our Rogers materials have high-speed and high-frequency performance mostly categorized under Thermoset materials and PTFE-based materials.
Venture Rogers materials or Rogers laminates are widely used for military, wireless, automotive, defense, and telecommunication industries.
A few application examples of PCBs manufactured from Rogers materials are:
- Power Amplifiers
- Cellular Base Station Antennas
- Automotive Radar and Sensors
- RF identification (RFID) Tags
- Direct Broadcast Satellites
Through the years as an industry leader, Venture is the top PCB assembly manufacturer that offers high-quality Rogers materials in China.
At Venture, we highly specialized in PCB assembly and quick-turn PCB prototype. Apart from it, we also specialize in small and medium volume PCB fabrication.
Venture is the best place to fabricate your PCB with high-quality Rogers material to meet your demands. Also, we are committed to adhering to the strict PCB assembly and fabrication standards.
For your inquiries, please don’t hesitate to contact us directly.
Rogers PCB Material: The Ultimate FAQs Guide
In this guide, you will find all information you’re looking for about Rogers PCB material.
Whether you want to learn about the properties, benefits, applications, or available laminate material, you will find all information here.
So, if you want to be an expert in Rogers PCB material, read this guide.
- What is Rogers Material?
- What are the Benefits of Rogers PCB Material?
- What are RF/Microwave Rogers Laminates?
- What are the Differences Between Rogers Material vs. FR-4 Material?
- Which are the Different Types of Rogers Materials?
- Which are the Various Series of Rogers Laminates?
- What are the Advantages of Rogers Prepreg and Bondply materials?
- What are the Main Rogers Material Properties to Consider During Selection?
- What is the relation between Wavelength and Dielectric Constant of Rogers Laminates?
- Why is Insertion Loss Important in Rogers’s Material?
- Which are the Types of Foil Claddings Used in Rogers’s material?
- At what Frequency is it Important to Move from FR-4 Materials to Rogers Material?
- Can you Mix High-frequency Rogers Material with FR-4 Material in Hybrid Multilayer PCBs?
- Is it Difficult to Fabricate High-Frequency Rogers Material than Standard FR-4 Material?
- Which are the Different Types of Rogers Prepreg and Bondplys?
- Which are the Key Rogers Material Selection Guide?
- Which are the methods Used in the Electrical Characterization of Rogers PCB Materials?
- How do You Choose the Right Substrate for High-Frequency Rogers PCB?
- How Do you Test Quality of Rogers PCB Material?
- What is the Difference Between Pure Build and Hybrid Build when working with Rogers materials?
- Why is Controlled Impedance Critical in Rogers Materials?
- Which are the Common Transmission Line Formats Used in RF/Microwave Rogers materials?
- Which are the Two methods of Producing Blind Vias in Rogers PCB Materials?
- Why is Balanced Structure Essential When Fabricating Rogers PCB Material?
- Which are the Methods of Copper Plating on Rogers PCB Material?
- Why is Edge Plating Crucial in High-frequency Rogers Materials?
- What are the Applications of Rogers PCB Material?
- What are the Advantages of PTFE-Based Rogers Laminate material?
- What Determines Rogers Substrate Price?
- Which are the Quality Standards for Rogers PCB Material?
What is Rogers Material?
Rogers material refers to high-frequency PCB material produced by Rogers Corporation.
The PCB material features excellent temperature stability and dielectric constant, in addition to low moisture absorption.
The coefficient of thermal expansion of Rogers laminates and copper foil are consistent.
Consequently, improving the performance of PTFE Rogers substrate.
These materials are perfect for RF/microwave products and high-frequency PCB applications.
Rogers PCB material
What are the Benefits of Rogers PCB Material?
Electrical properties and performance reliability play a crucial purpose in your high-frequency PCB design.
For that matter, let’s look at the main advantages of Rogers laminate materials:
- Ensures low signal loss
- Lower dielectric loss
- Facilitates cost-effective PCB manufacturing
- Features broad range of dielectric constant values (2.55 to 10.2)
- Better thermal management
- Enhanced impedance control
- Low outgassing thus best for space applications
What are RF/Microwave Rogers Laminates?
In Semiconductor industry, RF material is any high-frequency Rogers laminate that functions above 100MHz.
On the other hand microwave material is any high-frequency Rogers laminate that functions above 2GHz.
What are the Differences Between Rogers Material vs. FR-4 Material?
The main differences between Rogers PCB laminates and FR-4 laminate materials include:
FR 4 Laminate
Although type of substrate material used in PCB fabrication is very important, price of the material equally matters.
There is big difference in Rogers substrate price and that of FR-4 materials.
FR-4 substrate is relatively cheaper in comparison to Rogers laminate material.
FR-4 is among the cheapest PCB materials, commonly preferred due to its low processing costs.
However, their low cost comes with low-performance qualities, which makes Rogers PCB materials the better choice.
Though relatively expensive, Rogers laminates enable you to manufacture high-performance printed circuit boards.
Rogers PCB Material
· High Frequencies
Circuit boards constructed using Rogers laminate materials are very popular because of their application in high-performance boards.
PCB manufacturers prefer FR-4 materials due to their well understood mechanical and electrical properties, low cost, and reliability.
However, FR-4 laminates are not suitable for high-frequency circuit board applications.
Rogers laminates are among the most popular high-frequency PCB materials in the market.
Compared to boards manufactured using FR-4 substrates, Rogers PCB substrates exhibit nearly 20 percent reduction in values of dielectric constant.
High-frequency laminates are the best for PCB projects with very broad mechanical and electrical variations.
· Dissipation Factor (Df)
FR-4 substrates exhibit a higher dissipation factor in comparison to Rogers PCB materials, particularly at high frequencies.
The typical Df value of Rogers laminates is about 0.004 compared to 0.020 for FR-4.
High-frequency PCB materials such as Rogers substrates exhibit a steady dissipation factor with a change in frequency.
Nevertheless, the Df of FR-4 substrates increases with increasing frequency.
Additionally, the low Df is instrumental in reducing signal losses in printed circuit boards constructed utilizing Rogers materials.
· Impedance Stability
Impedance refers to the opposition or obstruction to the flow of energy when you apply voltage to the circuit board.
Steady impedance is critical in most PCB constructions, and this forms one aspect where Rogers laminates and FR-4 laminates differ.
Though FR-4 PCB materials cost is low, they are extremely prone to broad dielectric constant variations across X and Y axis.
The Dk variations also take place with adjustments in temperature.
On the other hand, Rogers laminates display a more extensive dielectric constant range, experiencing negligible Dk variations across wide temperature changes.
Therefore, high-frequency Rogers PCB materials are the best if your PCB applications entail operating in high-temperature conditions.
· Dielectric Constant
The dielectric constant of PCB substrate determines its capacity to store electrical charge in the electrical field.
FR-4 materials feature lower Dk values compared to Rogers substrates.
Although PCB materials having greater dielectric constant can produce small printed circuit boards, they are not desirable.
Therefore, in terms of Dk, FR-4 is better off than Rogers laminate.
PCBs having high dielectric constant are prone to rapid break down, particularly if exposed to the most extreme electrical fields.
· Space Applications
The material used in the fabrication of PCB intended for space application is exceptionally crucial.
Due to this fact, Roger’s laminate vs. FR-4 laminate significantly differs with regard to their applicability in space.
Not all materials employed in the construction of PCBs intended for space application will guarantee excellent performance.
Some material might fail to perform as expected due to outgassing and harsh conditions in space.
Outgassing happens when the PCB material releases trapped gases into the powder layer during curing process.
Moisture or corrosive substances can as well successfully permeate the surface through pinholes to damage internal components.
FR-4 laminates offer an outstanding balance for manufacturability, electrical stability, cost and durability.
Nonetheless, Rogers PCB laminates are one of the best in relation to space applications.
· Temperature Management
By now you know that FR-4 substrates experience substantial variations with adjustment in temperatures.
This is different with Rogers laminates that exhibit negligible variations over a broad range of temperature.
For this reason, Rogers materials are better in thermal management than FR-4 materials.
High-frequency Rogers laminates are popular because of their excellent temperature management properties.
Which are the Different Types of Rogers Materials?
Here are the various types of Rogers PCB materials available in the market:
1) Metal Claddings
You can find a number of metal claddings models in the form of the following type of foil:
- Electrodeposited copper
- Resistive Copper Foil
- Rolled Copper
- Electrodeposited Reverse Treated Copper
- Aluminum metal clad
There are a variety of Rogers laminates featuring different reinforcements including:
- Woven Fiberglass Strengthened Modified Epoxy Laminates
- PTFE Random Fiberglass
- PTFE Ceramic
- Woven Fiberglass Strengthened PTFE Antenna Grade Rogers Laminates
- Woven Glass Strengthened Modified Epoxy IMS
- Cross-Plied Woven Fiberglass Reinforced PTFE
- Ceramic/Woven fiberglass/Hydrocarbon / Ceramic UL 94 V-0 Laminates
- Filled PTFE Composite
- Ceramic/ Hydrocarbon/Woven fiberglass
3) Bonding Materials
Rogers PCB bonding materials include
- TECA Film
- Woven fiberglass/ Ceramic/ Prepreg
- Ceramic PTFE Bondply
Which are the Various Series of Rogers Laminates?
There is a number of Rogers laminate series, but here are the most popular types:
· RO4000® Series
These hydrocarbon ceramic Rogers laminates and prepregs boast as the best in the industry.
The low loss PCB material is ideal for millimeter-wave and microwave frequencies.
RO4000 laminates offer streamlined properties and easier application in PCB fabrication over conventional PTFE materials.
There are different versions of Rogers RO4000 laminate materials including:
- RO4000 LoPro laminates
- RO4003C materials
- RO4350B laminates
- RO4360G2 laminates
- RO4500 high frequency laminates
- RO4700 antenna grade laminates
- RO4830 thermoset laminates
- RO4835 laminates
- RO4835T laminates
· RT/duroid® Series
These types of Rogers laminates are filled PTFE (ceramic/random glass) for utilization in high-reliability defense and aerospace applications.
RT/duroid laminates are PCB materials that offer superior performance and high reliability.
The various versions of RT/duroid laminates include:
- RT/duroid® 5870 Laminates
- RT/duroid® 5880 Laminates
- RT/duroid® 5880LZ Laminates
- RT/duroid® 6002 Laminates
- RT/duroid® 6006 and 6010.2LM Laminates
- RT/duroid® 6035HTC Laminates
- RT/duroid® 6202 Laminates
- RT/duroid® 6202PR Laminates
· TMM® Series
These thermoset microwave laminates blend uniform dielectric constant (Dk), copper matched CTE and reduced thermal coefficient of Dk.
Rogers PCB Material
- 2929 Bondply Series
Rogers 2929 bond ply refers to a non-strengthened, thermoset-based slim film adhesive system.
- CuClad 6250
CuClad 6250 is a Rogers bonding film manufactured using ethylene-acrylic acid thermoplastic copolymer, with a dielectric constant of 2.32.
- CuClad 6700
CuClad 6700 refers to Rogers bonding film made utilizing chlorotrifluoroethylene thermoplastic copolymer. The bonding film has a Dk of 2.35.
- RO4400T/RO4400 Series Bondply
This is a Rogers prepreg family from the RO4000 series of Rogers core materials.
The bond ply is lead-free soldering and sequential lamination compatible.
Moreover, there are thinner alternatives for enhanced flexibility of multilayer Rogers PCB design.
- SpeedWave 300P Prepreg
SpeedWave 300P prepreg represents a low Dk, ultra-low loss resin system. You can apply it to bond different types of Rogers laminates.
- 92ML Materials
92ML Materials refer to ceramic-filled, multifunctional epoxy Rogers laminate and prepreg systems. Further, they are thermally conductive and flame retardant in addition to being halogen-free.
- COOLSPAN TECA Film
COOLSPAN TECA refers to a silver-filled, epoxy-based adhesive film.
The thermosetting Rogers bonding material helps in the adhesion of high power PCBs.
- XtremeSpeed RO1200 Series
These are low Dk, low loss Rogers laminates, and bonds materials.
XtremeSpeed RO1200 Series design allows them to satisfy the unique, mechanical, thermal and electrical specifications of high-speed circuit boards.
What are the Advantages of Rogers Prepreg and Bondply materials?
Here are the 3 key benefits of Rogers bonding and adhesion materials:
- Thickness span from 0.0015 to 0.005 inches
- Have a dielectric constant of 2.99 and Dissipation factor as reduced as 0.0009 at 10 GHz
- Come having or lacking glass reinforcement
What are the Main Rogers Material Properties to Consider During Selection?
There are several properties of Rogers substrates that you should consider before selecting any PCB material including:
· Decomposition Temperature (Td)
PCB material decomposes when subjected to a temperature exceeding a specific temperature threshold.
This temperature range represents the decomposition temperature when the material losses approximately 5 percent of its general mass.
Therefore, you should use Rogers laminate capable of managing your operating temperature, usually between 200 to 350 degrees Celsius.
Essentially, the Td ought to be above the operating temperature where you will perform soldering.
· Co-Efficient Of Thermal Expansion (CTE)
CTE refers to the expansion rate of PCB material when subjected to temperatures beyond the glass transition temperature. Its measurement unit is parts per million (ppm).
Copper has a CTE of 18 which implies that its expansion occurs by 18 ppm/degrees Celsius increase.
Issues emerge when there is a mismatch between the CTE of Rogers substrate and copper.
Higher CTE of the substrate means more substrate expansion compared to copper, leading to failure of solder joints or de-lamination.
Due to this fact, the right CTE for Rogers laminates should be 70 ppm or below.
· Dielectric Constant (Dk)
Also referred to as relative permittivity, dielectric constant describes the quantity of charge that Rogers substrate can store.
Higher Dk values will imply higher capacitance and thus greater storage of charge, which causes the higher voltage across PCB material.
The dielectric constant of Rogers material varies with frequency, normally reduce with increasing frequency.
Materials having higher Dk produce smaller printed circuit boards for a specific working frequency and vice versa.
Rogers laminates are the best for PCB applications involving high working frequencies.
This is because they maintain a steady Dk over the working frequencies ranges applied in the application.
· Loss Tangent
The key concern here is the degree of loss the specific Rogers PCB design can withstand.
That is the quantity of power against the quantity of power out.
With an unlimited power supply, the loss is non-essential.
Figure 5 Rogers PCB Material
Using filled PTFE substrate significantly improves the CTE and ensures easier process of plated thru-hole preparation.
Therefore, woven fiberglass strengthened ceramic-filled PTFE material is the best to ensure easy fabrication.
It provides exceptionally superior electrical performance and is comparatively friendly for circuit board manufacturing.
The various varieties of filled hydrocarbon Rogers laminates can differ to some extent.
But, you can process them in similar manner as FR-4 laminate.
Although you will use similar fabrication equipment, it will be necessary to employ different parameters for the processes.
Some of the different parameter crucial to mention include need for:
- Different feeds/speed at drill
- Different parameters for preparation of plated through-hole using permanganate or plasma
- Potentially reduced drill life
- Lamination parameters that significantly differ with those for FR-4 prepreg.
What is the relation between Wavelength and Dielectric Constant of Rogers Laminates?
Requirement for varying dielectric constant associates more with RF applications compared to digital applications.
In the microwave frequencies range (300 MHz-30GHz), the circuit patterns of PCB are usually the microwave circuit element.
For instance, a band pass filter may not be an element soldered onto the board but is actually the PCB conductor pattern.
At microwave frequencies, you can uses edge-coupled sequence of conductors and spacing as band pass filter.
Filter function relies on a wavelength that is associated with the Rogers material’s dielectric constant.
Wavelength is a feature of electromagnetic wave which travels on the PCB.
As the name suggests, wavelength refers to the wave’s physical length.
It depends on the frequency and dielectric constant of Rogers laminate.
Most microwave components’ size depends on a portion of wavelength; usually, ¼ or ½ wavelength helps in defining circuit properties.
The length of every conductor pair is a quarter of the wavelength at the desired frequency.
With this length, the circuit will encounter too much electrical energy radiation on one of the components.
This energy links to its surrounding component (line segment).
At the correct frequency, the propagating wave energy will transfer from one element to the other, traveling across the circuit.
However, you will have different wavelengths when you introduce at a different frequencies, energy into the circuit pattern.
As a result, there will be no coupling of energy from one component to the next, hence no propagation of electrical energy.
There is a relation between the bandpass filter physical size and wavelength at the desired frequency.
If the dielectric constant of Rogers laminate is higher, the circuit size would shrink to retain similar wavelength properties.
Material with high Dk can minimize the microwave circuit board size.
Generally, microwave PCBs greatly rely on the material’s dielectric constant since the technology applies wavelength features to produce various PCB functions.
Therefore, there is an exceptional relation between wavelength and dielectric constant of high-frequency Rogers material.
A higher Dk produces shorter wavelength.
Why is Insertion Loss Important in Rogers’s Material?
Nowadays, both microwave and digital applications pay much focus on insertion loss, which is a very complex subject.
Insertion loss refers to the overall electrical loss of a high-speed/high-frequency circuit board.
It constitutes a mix of several losses which include dielectric loss.
Normally, there is a relation between dielectric loss and dissipation factor (loss tangent) of the Rogers PCB material.
As the name hints, dielectric loss describes the feature of the circuit board where losses happen because of the Rogers substrate.
Furthermore, conductor losses also constitute an insertion loss.
Conductor loss defines loss related to the copper conductor and surface finish.
Though there exists no perfect conductor, copper offers very good conductivity.
If you add another metal to the copper, there will be an overall decrease in conductivity which leads to more loss.
The various finishes employed in the PCB industry generally have lower conductivity compared to copper.
For that matter, more loss happens when you add a certain plated metal finish onto the copper conductor.
Additionally, the copper conductor surface roughness can result in loss, where you will have more loss in rougher copper surface.
Conductor losses depend on frequency because of skin depth.
The conductor losses are minimal at some frequencies, while significant at other frequencies.
Thermal management concern can be an issue if insertion loss leads to PCB heat up when you apply RF power.
A circuit board featuring reduced insertion loss will experience less heat up when you introduce power.
In high-frequency digital Rogers laminate applications, there is distortion possibility due to insertion loss, which causes a decrease in digital pulse amplitude.
Having a PCB featuring low insertion loss will enable the digital pulse to retain the excellent integrity required.
Which are the Types of Foil Claddings Used in Rogers’s material?
Types of Rogers laminate foil cladding include ½, 1, and 2 oz. rolled copper and ¼, ½, 1, and 2 oz. electrodeposited copper.
RO4000 series laminates do not come with ¼ oz. rolled or electrodeposited copper foil.
You can always compensate for the conductors or Rogers’s material losses.
However, the return losses and heat produced by the conductor is the exception, but luckily this is rarely a reality.
· Moisture Absorption
Basically, the Rogers laminate should absorb nearly no moisture when immersed in liquid.
Materials with higher moisture absorption percentages will encounter greater negative impacts on their electrical and thermal properties.
At what Frequency is it Important to Move from FR-4 Materials to Rogers Material?
This is quite challenging since different technologies may withstand more or less functioning from a PCB laminate.
There has been serious advancement in signal processing in semiconductor technology.
It is currently possible to use FR-4 material at greater frequencies and speed than was previously thought practical.
However, often when high-speed digital PCB applications hit 10 GHz or higher, you will require high-frequency Rogers laminate.
Exceptions are there, and in certain situations, PCB of lower data rate will as well need high-frequency laminate.
High-frequency RF boards that are least worried about insertion loss can utilize FR-4.
Nonetheless, Rogers laminates provide greater than just reduced loss; they offer a highly controlled dielectric constant.
In a number of RF applications, dielectric constant control might be as crucial as control of substrate thickness.
Generally, you should not use FR-4 materials beyond 3 GHz because of concerns about insertion loss.
Nevertheless, if control of Dk is a crucial concern, you should use high-frequency Rogers laminates rather than FR-4 materials.
Can you Mix High-frequency Rogers Material with FR-4 Material in Hybrid Multilayer PCBs?
Yes, you can do this often, and you will experience minimal compatibility problems than you might presume.
There are several different reasons for using a few Rogers laminate layers and several FR-4 layers in multilayer hybrid PCB.
In certain situations, cost is the main reason.
You use the more costly Rogers materials when there is a need for superior electrical performance.
In other applications, using a blend of materials ensure enhanced PCB reliability.
Certain PTFE-based Rogers laminates feature high CTE.
This may be a worry if you construct a board with several layers of the material.
It is possible to build hybrid multilayers using low CTE, extremely thermally steady FR-4.
You can integrate the material within non-electrically vital layers to aid in balancing the greater CTE of certain PTFE laminates.
Nevertheless, not all Rogers PTFE laminates exhibit high CTE.
Those incorporating ceramic fillers feature superior and low values of CTE.
Moreover, in other cases, it is essential to use materials having substantially different Dk in a multilayer circuit board.
Here, you may mix together high-frequency Rogers materials to attain the goal.
With most hybrid constructions, the PCB materials are commonly compatible, though you will require special PCB fabrication processing.
Is it Difficult to Fabricate High-Frequency Rogers Material than Standard FR-4 Material?
It depends on the type of material you are using in the high-frequency board.
There exist various different Rogers substrate types you can use in high-frequency applications.
Filled hydrocarbon and PTFE-based Rogers laminates are the two most popular PCB materials utilized in high-performance applications.
Unfilled or almost pure PTFE materials are generally more troublesome during PCB fabrication.
This is due to its softness and high CTE in addition to dimensional stability problems.
Also, they present special challenges in plated through-hole processing.
However, Rogers PTFE laminates reinforced using woven fiberglass solve most of the issues with handling, dimensional stability, and softness.
Because of their mechanical and electrical stability, high frequency Rogers TMM laminates are suitable for high reliability micro-strip and strip-line applications.
- TMM® 10 Laminates
- TMM® 10i Laminates
- TMM® 13i Laminates
- TMM® 3 Laminates
- TMM® 4 Laminates
- TMM® 6 Laminates
· IsoClad® Series
These are non-woven fiberglass strengthened PTFE laminates used in high-frequency PCB applications.
Rogers IsoClad laminates have a low dissipation factor spanning from 0.0009 to 0.0018 and low dielectric constants spanning from 2.17 to 2.33.
The stabilized, cross plied fabricated laminates come in sizes as far as 48” x 54”, and feature low moisture absorption.
There are two versions of Rogers IsoClad laminates:
- IsoClad® 917 Laminates
- IsoClad® 933 Laminates
· DiClad® Series
These are fiberglass strengthened PTFE-based laminates for use as PCB substrates in RF applications.
Rogers DiClad laminates provide low dielectric constant values range due to their controlled PTFE and fiberglass content ratio.
Greater PTFE content offers a lower dissipation factor and Dk, whilst greater fiberglass content gives better registration and dimensional stability.
DiClad series laminates don’t incorporate cross plied constructions.
Here are the versions of Rogers DiClad laminates:
- DiClad® 527 Laminates
- DiClad® 870/880 Laminates
· CuClad® Series
These represent woven fiberglass strengthened PTFE-based laminates for utilization as radomes and substrates in high-frequency PCB applications.
Rogers CuClad laminates have a low dissipation factor in the 0.0009 to 0.0018 range and low Dk in the 2.17 to 2.60 range.
They are stabilized cross plied fabricated laminates available in sizes as much as 36” x 48” and feature low moisture absorption.
These are the different versions of Rogers CuClad laminates:
- CuClad® 217 Laminates
- CuClad® 233 Laminates
- CuClad® 250 Laminates
· CLTE Series
These are woven-glass, ceramic-filled PTFE laminate materials with loss dissipation factor, low insertion loss, low out-gassing, tight thickness tolerance, and dielectric constant.
Rogers CLTE laminates also feature greater thermal conductivity and are perfect for thin multi-layer PCBs.
The higher thermal conductivity gives the alternative of the greatest level of embedded resistor constancy in the PCB semiconductor industry.
The various versions of Rogers CLTE laminates include:
- CLTE-AT™ Laminates
- CLTE™ Laminates
- CLTE-MW™ Laminates
- CLTE-XT™ Laminates
Which are the Different Types of Rogers Prepreg and Bondplys?
The design of Rogers prepreg and bondplys guarantees consistent performance and reliability for highly demanding multilayer PCB applications.
They have their mechanical and electrical features excellently matched to those of high-frequency Rogers laminates.
They offer you a wide choice of glass-reinforced and non-reinforced adhesion and bonding materials for a complete Rogers solution.
Moreover, the various Rogers bonding materials families with varying technologies.
This leads to a scope of solutions from traditional to highly challenging capability techniques.
TMM Rogers laminates come with electrodeposited copper foil only, and certain materials grades may come unclad.
Thick brass and aluminum claddings are common on the majority of TMM laminates.
Thick copper, brass and aluminum claddings are popular on Rogers duroid/RT laminates.
However, RO4000 laminates do not feature thick metal cladding.
Thick copper, brass and aluminum claddings are as well available in a variety of thickness tolerances and thicknesses.
Moreover, you can find other types of Rogers thick metal claddings upon request.
Which are the Key Rogers Material Selection Guide?
Here is a typical procedure of selecting the Rogers material to buy and putting an order:
Step 1: Establishing the Rogers Laminate Grade to Utilize
There are a wide variety of specialty Rogers material types (LCP, hydrocarbon, PTFE, ceramic, among others) to select from.
They provide unique blends of mechanical, electrical and thermal properties for demanding PCB applications.
Performance requirements normally dictate Rogers Product Grade that is best for the application.
For instance, if you require material having high Dk combined with lowest Df, then Rogers PTFE laminate is the best choice.
Similarly, when mechanical strength is the primary concern, then a thermoset material like RO4000 laminate is the perfect fit.
Common types of Rogers laminates comprise of: CLTE-XT™, RO3003™, RO4350B™, RT/duroid® 5880, and TMM®.
Always ensure to choose the right material type when placing your order.
To make the right selection, consult your Rogers material supplier before making the determination.
Step 2: Selecting Thickness of Laminate and Thickness Tolerance
Adhering to IPC guidelines, Rogers laminate thickness entails dielectric thickness and doesn’t constitute copper foil thickness or extra metal claddings.
Typically, the product thickness and grade defines the thickness tolerance.
Nevertheless, you can request for custom tolerances for certain high-reliability Rogers materials (for example CLTE and RT/duroid Series laminates).
You may incur special charges when ordering non-standard tolerances or thicknesses.
Step 3: Choosing Cladding Type
There are several cladding options by Rogers including:
- ½, 1, and 2 oz. rolled copper
- ½, 1, and 2 oz. RTF, and
- ¼, ½, 1, and 2 oz. ED copper foil.
However, not all Rogers laminate systems incorporate all types of copper foil claddings.
For instance, RO4000 series and TMM laminates do not come with ¼ oz. rolled copper or electrodeposited foil.
Thick metal claddings like brass, aluminum and copper are available on Rogers CLTE™, CuClad®, DiClad®, IsoClad® and RT/duroid laminates.
The claddings may be dependent on dielectric thickness.
Moreover, the thick metal claddings come in various thickness rage and thickness tolerances.
Also, some Rogers materials can come unclad.
Step 4: Choosing Panel Size*
Ultimately, you need to choose your desired panel size dimensions.
For instance, a very popular panel size utilized in the PCB sector is 24” x 18”.
Remember that different Rogers laminate grades might have varying available panel sizes because of unique fabrication procedures.
Furthermore, you will often incur special charges foe non-standard sizes of panels.
Which are the methods Used in the Electrical Characterization of Rogers PCB Materials?
There are multiple test techniques used for characterizing electrical properties of Rogers substrate including:
- Full Sheet Resonance
- Split Post Dielectric Resonator
- Ring Resonators
- Clamped Stripline Resonator
- Waveguide Perturbation
How do You Choose the Right Substrate for High-Frequency Rogers PCB?
There are various best practices instrumental in choosing suitable Roger laminate and copper foil to use in high-frequency PCB applications:
Rogers PCB Material
· Match Dielectric Constants
The dielectric constant match is very important in high-frequency PCB design.
If a Rogers PCB substrate consists of woven material and resin, they might exhibit different Dks.
Non-uniform dielectric constants in a laminate material may result in problems.
Therefore, you should work with your Rogers material supplier to ensure a close Dk match in the entire substrates.
· Match CTE
Coefficient of Thermal Expansion is essential by itself, though it can as well affect the PCB performance.
Varying CTEs of the layers of Rogers substrate will have different expansion rates during manufacturing or operation.
This causes reliability concerns and functional failures.
· Tight Substrate Weave
The woven features of Rogers laminate should mesh firmly, and might directly affect the dielectric constant.
Therefore, it is essential working with your PCB material supplier to avoid selecting substrate that might adversely affect performance.
· Smooth Foil
Based on skin effect, using smooth copper foil ensures minimal resistive losses at exceptionally high frequencies.
· FR-4 Laminate
It is possible to use FR-4 material for high-frequency PCB applications.
Nevertheless, it won’t ensure a similar level of accurate thickness control and dielectric constant as specially-designed Rogers laminate material.
How Do you Test Quality of Rogers PCB Material?
The most popular method of checking the quality of Rogers laminate material is a visual inspection.
You perform the inspection the process of manufacturing the PCB materials.
This form of PCB material inspection is vital since it supports certain automatic manufacturing and assembly operations.
Nonetheless, you require comprehensive testing and complex equipment to achieve high-level quality analysis.
Below are the key quality analysis tests for Rogers substrate materials and information they give about the board:
PCB Testing Lab
· Peel Test
The test is instrumental in determining the quantity of strength needed to cause laminate peeling from PCB.
· Solder Pot Test
This quality test establishes the plated thru-holes solderability.
· Solder Float Test
Measures the extent of thermal strain that Rogers laminate hole can endure.
· X-ray Inspection
The test helps in observing the internal construction of the Rogers substrate; consisting of vias and layers.
You can as well use it to view component packages interior to confirm types of device and authenticity.
· Automated Optical Inspection (AOI)
You perform AOI to check the quality of solder and verify trace and pad connections.
· Time Domain Reflectometry (TDR)
This quality test for Rogers laminate help in measuring characteristic impedances.
It makes it possible to establish matching of differential traces for superior signal integrity.
· Resistivity of Solvent Extract (ROSE) Test
ROSE testing makes sure that your Rogers laminate doesn’t have considerable surface debris left from fabrication operations or excessive conductive material.
What is the Difference Between Pure Build and Hybrid Build when working with Rogers materials?
Pure build describes a multilayer PCB construction consisting of similar material types all through the stack-up.
For example, construction of PTFE, FR-4, or another type of Rogers PCB material.
Conversely, hybrid build describes multilayer board utilizes PCB materials having considerable different essential properties compared to traditional pure builds.
It could employ a combination of FR-4 and Rogers materials or a blend of high-frequency materials having different dielectric constants.
Electrical performance, cost, and reliability are some of the reasons for utilizing hybrid construction in high-frequency PCB designs.
Specially engineered materials for RF/microwave PCB applications, such as Rogers laminates are more costly than ordinary FR-4 PCB materials.
However, if multilayer design includes several non-crucial PCB layers, you can build them using inexpensive FR-4 material.
Similarly, use Rogers materials on the crucial circuit board layers.
With advancing technology, hybrid construction is getting more popular, yet there are advantages and disadvantages of hybrids that you should understand.
Therefore, close consultation with your PCB manufacturer will guarantee a perfect construction method that balances PCB manufacturability and RF performance.
Why is Controlled Impedance Critical in Rogers Materials?
Typically, Rogers substrate materials have uncontrolled impedance, unless they feature carefully designed traces.
This implies that the impedance value will vary from location to location across the trace.
At high-frequency PCB applications, traces don’t act in the same way as simple connections.
Therefore, controlled impedance is instrumental in ensuring that there is no signal degradation as they propagate across a Rogers laminate.
Basically, controlled impedance refers to the matching of Rogers substrate features with trace measurements and locations.
This makes sure that a trace’s signal impedance falls within a specific percentage of a particular value.
Controlled impedance Rogers substrate materials offer reproducible high-frequency performance.
Therefore, controlled impedance is necessary if a signal needs to have a specific impedance to function correctly.
With high-frequency PCB applications, it is vital to match the traces impedance to maintain signal clarity and data integrity.
You may experience issues when the impedance of the Rogers substrate trace linking 2 elements doesn’t match the characteristic impedance of the components.
There might be raised switching times in the circuit or device.
Moreover, you may as well experience random errors.
Which are the Common Transmission Line Formats Used in RF/Microwave Rogers materials?
The common transmission-line technology applied in RF/microwave PCB applications is stripline and microstrip.
The choice of transmission-line format to employ depends on factors such as ease of execution and expected performance.
Let’s look at the two popular transmission-line technologies in details:
· Stripline Transmission-line
This refers to a high-frequency transmission-line format that is basically a trace on the interior layer having a ground plane on top and under it.
Because of the surrounding dielectric material (insulator), strip lines don’t radiate, thus described as non-dispersive.
For this reason, you can closely space and densely pack stripline circuits.
This facilitates miniaturization at RF/microwave frequencies.
There exist a few variations of stripline that influence differential impedance:
· Edge-Coupled Stripline
A configuration having 2 adjacent traces on the interior layer centered in the middle of a reference plane.
· Offset/Edge-Coupled Dual Stripline
This refers to the edge-coupled stripline offset in the middle of the 2 reference planes.
Typically, you use it if you route orthogonally 2 adjacent signal layers, with reference planes exterior of them.
· Broadside-Coupled Stripline
A configuration having 2 differential lines on neighboring layers right on top of each other.
They are essentially offset strip lines positioned in the middle of their 2 reference planes.
· Microstrip Transmission-line
This is also a type of high-frequency transmission-line format.
It refers to a simplified structure having one conductive trace, ground plane, and dielectric layer dividing the ground plane and signal conductor.
It is prone to more radiation with an increased gap between the ground plane and transmission lines.
This is due to a lack of dielectric insulation.
Therefore, microstrip is the best transmission-line technology for radiating Rogers laminate applications like mini microstrip patch antennas.
There exist 2 types of microstrip transmission-line formats that affect differential impedance:
· Edge-Coupled Microstrip
Consists of 2 adjacent traces on the external layer having one reference plane under it.
· Edge-Coupled Embedded Microstrip
This type of edge-coupled microstrip enclosed with a dielectric.
You can use a solder mask to convert a microstrip to an embedded microstrip line.
Which are the Two methods of Producing Blind Vias in Rogers PCB Materials?
Blind vias link external layer to internal layers of Rogers substrate, with access to just a single external layer.
The two main techniques of creating blind vias include:
- Sub-assembly stack-up processing and by drilling the vias, succeeded by lamination.
You might require several sequential laminations.
You may decide to fill the blind vias with prepreg/bond ply resin during the lamination stage.
Alternatively, you can use distinct non-conductive via fill before lamination.
The aspect ratio of via processed in this manner relies on the capability of thru-hole plating.
- Laser or control depth drilling and plating right from the top surface to pad found on the blind layer.
Every type of visa comes with its advantages and disadvantages.
Therefore, make sure your Rogers PCB manufacturer chooses the correct process sequence fit for the distinct design.
The benefit of these two techniques of producing vias in Rogers laminate is that it is possible to plate the blind vias and vias concurrently.
This does away with an additional plating cycle and probably a lamination cycle.
However, the disadvantage is on the aspect ratio of vias created using these methods.
There is a significant reduction in aspect ratio for standard technology to 0.7:1 and 1.2:1 for modern technology.
Why is Balanced Structure Essential When Fabricating Rogers PCB Material?
Maintaining a balanced construction with respect to the Z-axis median of the PCB is important in ensuring minimal bow and twist.
The balance is essential irrespective of the Rogers laminate material you use.
The balance includes layers dielectric thickness, copper layer thickness, plane layers, and circuit distribution and location.
A higher layers count often implies an increased amount of plane layers.
If practical, balance planes about the median line of the Z-axis of the Rogers laminate layup and preferably positioned interior of PCB.
Adhering to the industry-standard design of multilayer, the maximum acceptable specification of bow and twist is 0.75 percent/inch or better.
Balanced construction is crucial in any circuit board design.
Nonetheless, it is more crucial with hybrid Rogers material produced utilizing mixed dielectrics.
Which are the Methods of Copper Plating on Rogers PCB Material?
There are two primary techniques applied during electroplating of Rogers laminate:
· Panel Plating
In panel plating, you plate the whole copper surfaces on either side of the Rogers substrate.
Also, the hole walls get plated to the needed final thickness.
The process requires a reasonably large source of current for even a moderate size of Rogers laminate panel.
Panel plating leads to a smooth, brilliant copper surface, which allows easy cleaning and preparation for succeeding procedures.
However, the lack of a photoplotter can lead to problems in exposing circuit patterns.
You will have to utilize negative artwork to reveal the circuitry pattern to the popular contrast inverting dry-film photoresists.
The panel plating technique eliminates the majority of issues with copper plating distribution.
Nevertheless, since it adds the base layer copper thickness, the process makes sustaining fine line definition and stability difficult.
· Pattern Plating
As the name hints, pattern plating entails masking off a great portion of the copper surface and electroplating only the circuit pattern’s traces and pads.
With this method of electroplating Rogers laminate, you generally require a current source of smaller capacity.
Moreover, the only thing you need if utilizing contrast inverting dry-film photoresist is the circuit’s positive image.
It is possible to produce this artwork reliably on a comparatively inexpensive pen plotter or inkjet printer.
The copper plating method uses less anode bank copper and requires the removal of less copper during etching.
This minimizes requirements for bath evaluation and maintenance.
The disadvantage of pattern plating is the need for plating of circuit patterns with either lead/tin or electrophoretic resists substance before etching.
Whichever type of Rogers laminate plating you choose, you must strip it off before application of solder mask.
This raises the complexity and incorporates additional wet chemical baths set to the entire operation.
Why is Edge Plating Crucial in High-frequency Rogers Materials?
Encapsulating edges of Rogers laminate using plating might be necessary for boosting EMI shielding in high-frequency PCB designs.
It as well enhances the chassis ground of electronic devices.
Edge plating requirement implementation is necessary for both the multiple-axis and single-axis margin of the PCB, constituting all 4 edges.
It involves a rout path procedure before metallization of the Rogers PCB circuitry features.
Edge encapsulation is at times known as the “plated rout” feature.
Design requirements for executing this technology depends on:
- The requirement for edges count of each circuit board
- Board size
- Whether you need the Rogers substrate in a multi-up array.
The stability of Rogers material used to construct the high-frequency board is equally instrumental in routing requirements development.
Non-standard Rogers laminates without glass reinforcement might need a unique routing design.
The unique routing design makes sure there is adequate stability of partly routed panel to endure through the left fabrication processes.
You perform the parts processing while they are still within the carrier panel utilized for manufacturing.
In some situations, there may be a need to develop tabs for edge plating.
However, tabs might not be necessary for the stability of one edge needing plating.
What are the Applications of Rogers PCB Material?
The key uses of Rogers laminate substrate consist of the following:
- Cellular Base Station power Amplifiers and Antennas
- 5G Station
- Automotive Radar Sensors
- All types of microwave equipment
- Aerospace and Defense equipment
- Microwave P2P links
- Direct Broadcast Satellites LNBs
- Mobile Internet Device
- RFID Tags
What are the Advantages of PTFE-Based Rogers Laminate material?
The use of PTFE-based Rogers substrates is common in high-frequency PCB design due to their extremely low loss and low Dk.
The different fillers help in adding mechanical strength to the material.
However, they increase the dissipation losses and dielectric constant.
PTFE-based Rogers laminate materials feature exceptional peel strength.
Perfect adhesion of copper laminate on the dielectric surface is important if fabricating the slim widths of conductors in high-frequency boards.
Typically, PTFE laminate materials have a high coefficient of thermal expansion in the Z-direction.
However, thinner boards made using the material have the Z-axis CTE decreased.
Furthermore, PTFE Rogers substrate materials also have stable dissipation factors and dielectric constant over wide ranges of frequency.
This makes them perfect choices for broadband printed circuit board designs.
What Determines Rogers Substrate Price?
The main factors that affect the cost of Rogers laminate include:
· Material Choice
The material you use in a substrate will inevitably affect its price.
Choosing different laminate thicknesses and types may both have a substantial impact on cost.
As a rule, PCB applications involving higher frequencies need higher grade materials than conventional FR4.
Therefore, RF/microwave PCB require materials like Rogers substrate, which could cost 10 times more than ordinary laminate materials.
· PCB Size
Size of the circuit board and panel utilization make 2 of the main vital factors affecting Rogers laminate price.
Generally, the number of circuits needed for corresponding equipment determines the substrate size.
Also, the amount of space taken up by board components will influence the cost.
Granted, certain PCB designs have no consideration for production costs and efficiency.
Ultimately, the PCB design dimensions will be among the key factors determining the general Rogers substrate price.
· Layer Count
Another important cost-determining factor is the number of layers.
The cost of manufacturing single-sided or two-sided circuit boards is almost the same.
Nonetheless, multi-layer designs create extra costs in Rogers’s materials and fabrication process.
Normally, shifting from double-layer design to four-layer design will double the cost.
Adding extra layers to multilayer PCB design will incur additional cost though the increase is not as notable.
For instance, the cost of moving from four layers to six layers might denote a 50 percent increase.
This is against the 100 percent increase sustained if shifting from two-layer to four-layer Rogers PCB design.
· Finish Type
Expenses related to a specific finish is a minor consideration when determining the cost of Rogers laminate.
Some surface finishes feature higher grades and provide prolonged shelf life, hence increasing the general cost of PCB material.
HASL is among the popular and low-cost finishes that give good solderability though have a lower rating on other properties.
By comparison, ENIG ranks highly in most categories but just grasp a small price difference.
The layers count may as well influence the extent to which the surface finish the overall Rogers substrate price.
· Size and Count of Drill
Another critical factor that determines Rogers laminate cost is the smallest hole size and total hole count you need to drill.
The material cost can rise by 5 to 10 percent if the hole is lower than 0.015”.
A large hole count can raise the price additionally by the same percentage.
The reason for this is the need to adjust the fabrication process for tinnier hole sizes and greater hole counts.
This in turn decreases the number of the panel you can drill within a specific duration.
· Drill Type
When you require much smaller holes, usually known as microvias, you will need to use a laser drill process.
Laser drilling procedure can add substantial expenses to the general Rogers material processing.
Buried or blind vias are also supplementary factors that affect the cost of Rogers laminates.
Each extra drill operation may add up to 20 percent or beyond to the total substrate cost.
Most of the current PCB designs require very tiny components.
To facilitate this, you need to ensure narrower spacing between conductive copper elements on the Rogers laminate.
It is essential to leave adequate space as practical to maintain the PCB substrate prices in check.
Trace/space that falls below 0.006” can lead to a 5 to 10 percent increase in Rogers substrate price.
· Unique or Custom Specifications
The uniqueness of laminate material can also affect its cost.
Custom Rogers laminates could increase production costs, even if the panel is small and comprise of just 1 or 2 layers.
Whether the properties in consideration need special tools or expertise to attain is the actual determining factor.
Special features typically need specialized sets of skill.
Moreover, unique Rogers material designs often require special tools.
It will be necessary to purchase the needed equipment for the special design.
Which are the Quality Standards for Rogers PCB Material?
When Choosing Rogers laminate material makes they comply with the following quality standards for PCB:
Rogers 4350 PCB
- ASTM D570 Standard
- IPC Standard
- RoHS Standard
- UL Standard
- CE Standard
- ISO Standard
- IEEE Standard
- CCC Standard
- REACH Standards
In short, there are many variables to consider before choosing Rogers PCB material.
The best part, this guide has highlighted all the critical aspects you need to know.
However, in case you have any question, feel free to contact Venture