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SMT Assembly

  • Cost-saving
  • Fast delivery
  • Excellent customer service
  • Professional after-sale service

What is SMT used for?

Surface mount technology or SMT is the name given to the method used to produce SMDs. In the industry, it has largely replaced the through-hole technology construction method of mounting components with leads into holes on a circuit board.

An SMT component is typically smaller than its through-hole counterpart because it either has smaller leads or no leads at all. It may have various styles of flat contacts, short pins or leads, a solder ball (BGA) matrix, or terminations on the body of the assembly.

SMT used
how to work

How does SMT electronics assembly work?

Electronics manufacturing using SMT means assembling electronic components using automated machines that place components on the surface of a circuit board.

In contrast to traditional through-hole technology processes, SMT components are placed directly on the surface of the PCB rather than soldered to leads.

When it comes to electronics assembly, SMT is the most commonly used process in the industry and also includes the following production steps:
Applying Soldering Paste
Component Placement and Assembly
Component Soldering
AOI and visual inspection

Capabilities of SMT PCB assembly

Our capabilities in high quality SMT printed circuit board assembly services are covered:
State-of-the-art assembly lines to ensure reliable circuit boards.
Production ready parts for improved turnaround time.
Assembling the following types of SMT printed circuit boards.

Ball Grid Array (BGA)
Ultra fine ball grid array (uBGA)
Quad Flat Pack No Lead (QFN)
Quad Flat Pack (QFP)
Small Size Integrated Circuit (SOIC)
Plastic Leaded Chip Carrier (PLCC)
Package (PoP)
Small chip packages (pitch 0.2 mm)

Capabilities of SMT

As a professional SMT assembly manufacturer, we guarantee you the quality SMT assembly. We can have different types of SMT assembly depending on your specifications.

Venture is providing complete solutions of SMT assemblies and we are capable of manufacturing a wide range of SMT assemblies.

We are manufacturing and supplying our beloved customers globally for more than 10 years.

Venture assembly services can help you build your PCB.

Your Leading SMT Assembly Supplier in China

 

What is SMT? SMT means Surface-mount Technology. Originally, surface-mount technology was called planar mounting. Using SMT means that electronic components are assembled with automated machines that place components on the PCB.

Surface-mount technology is a method in which the electrical components are mounted exactly onto the surface of a printed circuit board (PCB).

SMT assembly is an alternative to the through-hole method of PCB manufacturing.

 

Mounting the surface is a way to produce electronic circuits by placing components directly onto the board’s surface.

SMT has many advantages, such as affordability, efficiency, simplicity, and less prone to error. Also, SMT assembling has benefits. It reduces size and weight, more components in a smaller space, and money-saving.

Venture uses high-quality materials so that the quality of the boards will surely meet and exceed the customer’s expectations. We can also supply them depending on your specifications.

We have experienced staff to assist you when you are in need of SMT assembly.

To create a better and more powerful electronic product, SMT assembly is the way.

We accept small or large quantities of SMT assembly orders.

For your inquiries, don’t hesitate to contact us.

SMT Assembly: The Ultimate FAQ Guide

SMT-Assembly-The-Ultimate-FAQ-Guide

Before choosing SMT assembly during PCB manufacturing and fabrication, you should read this guide.

It has all information you’re looking for about SMT assembly.

So, if you want to be an expert in PCB SMT assembly, read this guide.

What is SMT Assembly?

Surface mount technology assembly is the process of directly mounting electrical components on the surface of a PCB stackup.

You will mount the electrical components on the surface of the PCB stackup using solder materials without drilling through holes.

Figure 1 SMT Assembly

SMT Assembly

What are the Advantages of SMT Assembly?

Surface mount technology assembly is a modern mode of placing different electronic components and circuits on printed circuit boards.

Due to its modernity, there are numerous improvements on the component mounting technology that comes with numerous benefits.

Here are some of the benefits of using SMT PCB assembly:

Affordability

Since you will be drilling very few holes into the PCB if any, the cost of surface mount technology reduces considerably.

In the long run, you will spend less in production of the printed circuit boards by embracing surface mount technology.

Efficiency

You will also use the space on the printed circuit board surface in a more efficient manner when you embrace SMT assembly.

With that in mind, you can make the devices smaller and lighter in weight thus increasing ease of handling.

Simplicity

You will also note that the overall make up of the surface mount technology is very simple in comparison to other technologies.

You will not go through complex manufacturing processes such as drilling holes and wiring thus simplifying the whole concept.

Not Prone to Error

You are also less likely to experience errors during the surface mount technology assembly processes thus minimizing losses from errors.

Most of the processes are automatic and not made by human beings thus simplifying and reducing any form of errors.

Are there Limitations Associated with SMT Assembly?

As much as you may want to know more about the benefits, it is also significant to have an idea about the pitfalls.

Here are some of the limitations that you might come across when using the surface mount technology assembly.

Attention to Detail

As much as this may seem to be an advantage, you will go through a difficult time processing the small details.

Despite having most of the processes automated, you will have to go through the detailing process with great attention.

Unsuitable for Certain Conditions

You may also go through a lot of trouble especially when you have to use the SMT PCBs.

In other words, there are certain conditions that are not suitable for surface mount technology printed circuit boards.

The conditions that are not suitable for SMT PCBs include mechanical stress conditions, environmental stress conditions, and temperature stress conditions.

You can mitigate this problem by creating a blend between through hole technology and surface mount technology on one board.

What are Some of the Uses of Surface Mount Technology Assembly?

You will use surface mount technology to create more powerful, better, and function electronic circuits. In other words, you will use surface mount technology assembly to manufacture PCBs that are:

  • Smaller in Size
  • Lighter in Weight
  • Faster in Speed
  • More powerful functionality

How Does SMT Assembly Compare to Through Hole Technology Assembly?

Figure 2 SMT PCB Assembly vs. THT PCB Assembly

 SMT PCB Assembly vs. THT PCB Assembly

Surface mount technology is taking over most of the activities that through hole technology was performing.

You can tell why this is so just by comparing surface mount technology and through hole technology.

Surface mount technology is a process of mounting different electronic circuit components on the surface of the PCB stackup.

Here, you will solder the components on the PCB surface without drilling holes through the PCB stackup.

In addition to that, you do not have to create a connection between the electrical components using wires.

Implying that surface mount technology depends on electric circuits running through the board to connect the components on the PCB.

It is the reason why you will not have to drill so many holes inside the printed circuit board stackup.

It is a complex process that requires automation but will cost you less than the through hole technology.

Just like SMT, through hole technology is also a process of mounting components on the printed circuit board stackup.

Through hole technology (THT) is a process of mounting electronic components on the surface of the PCB stackup through deep routing,

In this case, you will have to drill holes through the PCB stackup in order to successfully mount the electronic circuits.

Apart from that, you must perform proper wiring between the components in order to create a complete circuit.

It is a complex form of mounting different components on the PCB stackup that will create very strong components.

In addition to that, through hole technology will cost you a lot more in comparison to surface mount technology.

Why is SMT Assembly the Future of PCB Component Mounting?

Well, the most obvious of all factors is that surface mount technology is the future of PCB component mounting technology.

With an increase and growth in technology, you should expect more devices reducing in size while increasing performance.

In other words, surface mount technology is the future because it has the capability of fitting in smaller devices.

Implying that, surface mount technology makes smaller and faster PCBs that are capable of fitting well into smaller devices.

Apart from that, surface mount technology facilitates the construction or assembly of lighter electronic devices.

Surface mount technology is the future that will lead to the production of thin, light-weight, complex and reliable electronic devices.

How Does Manual SMT Assembly Compare to Automatic SMT Assembly?

You can perform surface mount technology either manually or with the help of a machine.

Manual surface mount technology uses less of machines and more of human labor to perform component mounting. You will, however, need a lot of concentration to pull it off successfully and that will consume a lot of time.

Automatic surface mount technology uses more of machines and less of human labor input. Implying that, you will need human labor to help in the designing process and also setting up the machine.

After setting up the machine, you will allow the machine to carry on with the mounting process. It is a faster and more accurate process in comparison to manual SMT assembly.

In addition to that, you will spend less with the automatic SMT assembly process and more on manual SMT assembly.

How Many Types of SMT Assemblies are There?

Figure 3 BGA SMT Package

BGA SMT Package

You can choose the most suitable form of surface mount technology that will suit your production specifications.

Implying that, there are numerous forms or types of SMT assembly process that you can opt for.

Here are the main surface mount technology assembly types that you can perform.

Ball Grid Array (BGA) Surface Mount Technology

Ball grill array is a surface mount technology that you can use to mount electronic components on numerous overlapping layers.

This form of mounting technology can contain one to over a million multiplexers, flip flops, and logic gates among other circuits.

Ultra-Fine Ball Grid Array (uBGA) Surface Mount Technology

Ultra-fine ball grid array is a special type of surface mounting technology that you can use to mount ultra-fine components.

You will use the ultra-fine ball grid array surface mount technology to mount very small components on numerous overlapping layers.

Quad Flat Pack No-Lead (QFN) Surface Mount Technology

Quad flat pack no-lead is a special type of surface mount technology with metalized surface pads at the bottom surface.

You will use it to create leadless plastic packages with very low profiles, great electrical performance, and moderate thermal dissipation.

Quad Flat Package (QFP) Surface Mount Technology

You will use the quad flat package surface mount technology on integrated circuits with gull wings extending from the sides.

This method employs very rare socketing technology with the help of surface mounting to ensure proper component mounting.

Small Outline Integrated Circuit (SOIC) Surface Mount Technology

You will use the small outline integrated circuits to mount different components that will take up less space.

In other words, it is a mounting technology that takes up between 30 to 50% less space that the dual in-line packages.

Plastic Leaded Chip Carrier (PLCC) Surface Mount Technology

You will use the PLCC technology to enable mounting of integrated circuits on PCBs through direct soldering or through sockets.

It is the best surface mounting technology that you can employ in PCBs that require frequent removal for film-ware updates.

Package-On-Package (PoP) Surface Mount Technology

Here, you will combine both ball grid array (BGA) and vertically discrete logic technologies in mounting different components.

You can use the package-on-package surface mount technology to install or mount two or more packages atop one another.

Do You Do SMT Assembly with Custom Designs in Mind?

Absolutely, your expectations as a customer is our priority in manufacturing custom designs.

We will carefully match our surface mount technology requirements to your design specifications.

You can rest easy that your design will go through the inspection and affirmation stages before production begins.

We will also make prototypes of the design you need and test if it will function accordingly during DFM checking stage.

You should also be ready to look at some of the suggestions we will propose even though you will be in complete control.

How Do You Maintain the Integrity of SMT Assembly Processes?

Our basic commitment is to produce the best out of the surface mount technology assembly. No matter the type of PCB you need, you should rest easy that we do not compromise on quality.

On that note, you can check or maintain the integrity of the surface mount technology assembly process.

Here are the factors to consider to maintain the integrity of the surface mount technology assembly.

Reduction of Human Error

You should consider using machines that will ensure a great deal of accuracy in the SMT assembly process.

For instance, you can use the circuitcam software to create the machine programs for CAD designing software. It will help in improving accuracy and eliminating room for error.

Use of Inspection Equipment

As soon as you complete the soldering process, you should inspect how good the process actually is. You can use solder paste inspection equipment to inspect, identify and then eliminate any soldering defects.

Simultaneous Production

You can also save on production time by using numerous placement machines that provides flexibility and run multiple jobs simultaneously. Apart from that, you can use several machines that will increase output on a large scale SMT assembly job.

Verification of Small Components

You can also use the three-dimensional automatic optical inspection (AOI) machine to verify very small components. It will also help in providing for the unprecedented quality control thus ensuring the highest quality possible.

Proper Component Alignment

You must also make sure that the component placement is aligned properly using X-ray machines to inspect BGA placements.

It is also the best type of machine that you can use to detect reflow after completing the surface mount technology assembly.

In addition to the above factors, integrity goes all the way through quality maintenance, cost control, and meeting delivery schedules.

How Do You Inspect SMT Assembled Products?

Well, in terms of maintaining quality of the surface mount technology assembly, the most convenient method is use of machines.

In other words, you have to inspect the final product of surface mount technology using machines.

Here are some of the techniques and machines that you can use to inspect surface mount technology assembled products.

Reflow Ovens

You will depend on the reflow ovens to help in establishing an efficient work flow with more than 10 zones.

You can control cooling cycle and heating cycle on individual profiles thus maintaining high levels of uniformity. It enables an efficient flow that encourages repeatability in order to come up with perfect PCBs.

AOI Inspection

Automated optical inspection (AOI) is also another important process that helps in the inspection of the SMT products.

Here, you can either use 2D or 3D technology to inspect the SMT printed circuit boards depending on the type of board.

There are various aspects of inspection that you can use under automated optical inspection depending on board layout and component population.

BGA X-Ray Inspection

You can also employ the X-ray inspection process to help in identification of deficient solder joints.

In case of a problem, you will use the machine to send the PCB to a rework station. At the rework station, you will fix the problem before pushing the PCB further for complete inspection.

Which Equipment Do You Use in SMT Assembly?

In the surface mount technology process, you can use different types of machines depending on the production outcome. These machines can support different batch sizes ranging from quick turn prototypes to runs of full production.

Here are some of the equipment that you will use for the surface mount technology assembly.

Solder Paste Systems

You will use the solder paste system to apply enough solder paste on the printed circuit board. It will calculate the quantity of solder paste that is most appropriate for particular surface mount technology project.

Volume Printers

You will use the volume printers to print large and numerous copies according to the production specifications.

Placement Systems

In addition to that, you will need a placement system which will actually perform the work of placing components.

It will help you to identify the right spots for placing the right components according the design of the PCB.

Reflow Oven

You must also make sure that the components stick well or properly on the printed circuit board. With the help of the reflow oven, you can control heating temperatures thus securing the components well.

3D AOI Machine

You can opt for the 2D or 3D automatic optical inspection machine to inspect small surface mount technology details. It will help in identifying the issues that you may not see with the naked eye for the purpose of quick repair.

Inline AOI station

Apart from the AOI inspection on the outer surface, you can also use the automatic optical inspections of the inner layers.

The inner layers may also have defects especially when you mix SMT assembly and through hole technology.

BGA X-Ray Inspection System

You may have to inspect the PCBs with BGA components regularly as they go through rapid thermal expansion and contraction.

Using the X-ray inspection process, you are in a better position to identify fault on the printed circuit boards.

SMT Assembly Line

SMT Assembly Line

Which Quality Certifications Do SMT Assembly Manufacturers Adhere To?

You can rest easy knowing that the SMT manufacturers have quality in mind. There are international quality standards that all the SMT assembly manufacturers adhere to.

Here are the main quality certifications that you have to look out for.

  • CE Quality Certifications
  • UL Quality Certifications
  • International Standard Organization (ISO) Quality Certifications
  • RoHS Quality Certifications
  • ANSI/AHRI Quality Certifications
  • IPC Quality Certifications
  • IATF Quality Certifications
  • EN Quality Standards
  • AS9100 Quality Standards
  • JOSCAR Quality Certifications

Which Materials Do You Use in SMT Assembly?

You will require very few materials to complete the whole process of surface mounting of different components.

Here are the main materials that you will need for the process of surface mount technology assembly.

Solder Paste

You will use the solder paste as an adhesive and as a solder material to fit the surface mount components. It will perform well in wet conditions as well as high temperature conditions thus being the most appropriate adhesive material.

Flux

Flux is a very important SMT material that you will use in carrying out the mounting process very smoothly.

You can either use the acid flux or the resin flux and helps in eliminating oxides and dirt from the stackup surface.

You will use flux to make the surface of the stackup wet as you proceed with the SMT assembly.

Adhesives

You will use different types of adhesives to ensure that the SMDs stick properly on the surface of the PCB.

It will help in keeping the SMDs from displacement or from falling off the surface of the PCB stackup.

Cleaning Agent

You will use the cleaning agent to get rid of the solder mask residues after completing the soldering process.

They have great chemical properties and also have very good thermal stability thus maintaining integrity of the SMT assembly process.

Which Surface Mount Components Do You Mount Using SMT Assembly?

You will mount different types of components on the surface of the PCB stackup using the SMT assembly process.

You can identify the components that you will mount on the PCB stackup as surface mount devices.

Surface mount devices have specific features that will allow you to directly mount them on the surface of the PCB.

Here are the different types of components that you can mount on the surface of the stackup using SMT assembly.

Passive Surface Mount Devices

Most of the passive surface mount devices are capacitors or resistors with standardized package sizes.

Apart from resistors and capacitors, there are other components such as crystals and coils which have specific uses.

Integrated Circuits

Here, you can have different types of integrated circuits which vary according to the connectivity needs.

Diodes and Transistors

You will also have diodes and transistors in smaller packages which lead form connections and touch on the PCB.

What is a Chip Mounter in SMT Assembly?

Chip mounters are special types of machines that you will use to aid the mounting of components during surface mount technology.

Here are the main details that you should know about the chip mounter technology.

Structure of Chip Mounter

Chip mounters are special types of automated equipment with very high levels of accuracy for the application of surface mount technology.

It is an automatic machine that you can comfortably control using a computer and integrating lights to complete the SMT assembly.

Mounting Efficiency

You have to be very careful when choosing the accuracy and speed of the chip mounter you would like to use.

You are in a better position to decide on the quality of SM assembly process that will eventually control overall quality.

SMT Chip Mounter

SMT Chip Mounter

Elements Affecting Chip Mounter

Just like any other machine or technology, there are numerous factors that will affect how it works.

The main elements that you should consider or that affect the chip mounter are:

  1. X-Y Axis Structure
  2. X-Y Axis Moving Error
  • X-Y Axis Inspection
  1. Vacuum nozzle Z axis moving effect

 

Visual System

The main visual systems in the chip mounter include optical magnifying times and pixel elements on the camera. These systems will increase the accuracy of the cameras thus boosting the whole process of surface mount technology.

Software System

The software system is the secondary computer system that you will use to control the whole process of surface mounting.

You need to get the best type of software that will help in controlling the entire surface mount technology assembly process.

What is the Significance of Electrostatic Discharge in Surface Mount Technology?

Electrostatic discharge on the surface mount technology leads to the production of static electricity.

Static electricity on the surface of the PCB stackup often leads to damages on the stackup.

The problem is that you may not know the problem until the PCBs leave the production house.

It is, therefore, important to inspect the PCBs thoroughly before you begin the distribution process.

What are the Protection Measures in Place for Electrostatic Discharge?

You can avoid the effects that the electrostatic discharge has on the printed circuit board.

Here are some of the ways that you can employ to help the damages from static electric current.

  • Grounding the Printed Circuit Board
  • Introduction of the Static Inspection Systems

What Does the Quoted Price in SMT Assembly Include?

Depending on the type printed circuit board you need, you will receive different quotes. In the quote that you will receive, there are certain specifics that detail how much you will pay.

Here are the fees that your PCB manufacturer will charge for surface mount technology.

  • Setup Fee which will range between 7 US dollars to 12 US dollars
  • Stencil fee which will range between 1 and 3 US dollars
  • SMT Assembly Service Fee at 0.0015 US dollars per joint
  • Hand soldering labor fee ranging between 3 and 5 US dollars
  • Manual Assembly fee at 0.02 US dollars per joint
  • Cost of the Components based on the type of components

In other words, the prices will not be definite and will vary according to the specifications of your PCB. You should also remember that the prices will vary according to the quality, quantity, and size of the PCB.

How Do Basic Components and Extended Components of SMT Assembly Compare?

In the assembly of components on the printed circuit board, you can mount basic components and extended components.

Primarily, there are the basic components that the printed circuit board must have to ensure it functions well. You will have the basic components on the P-and-P machine and maintain them on one common feeder.

They are permanent in that position and you don’t have to worry about their presence on the circuit board. You will also pay nothing for the mounting of the basic components.

On the other hand, we have the extended components that you will decide on. Implying that, you will choose the best types of components that will have additional function to the PCB.

They are not permanent on the PCB assembler and you will change them accordingly at a fee.

Which Files Do You Use in SMT Assembly Orders?

There are various files that you will use in the process of surface mount technology orders. These are the files that your manufacturer will understand and consider when manufacturing the PCB.

Here are the main files that you need to send to your manufacturer.

  • Gerber file with the details about the printed circuit board
  • Bill of materials with details on the type of materials
  • Component Placement List file which the machine will read to determine the point where the components fall.

Do You Have Size Limitations in SMT Assembly?

Well, depending on the manufacturer you hire, you may have size limitations. However, most of the manufacturers do not really have the size limitations thus allowing to choose any size.

You may occasionally come across manufacturers with panel size limit of 250 by 250 mm.

Do You Support Lead Free SMT Assembly?

Absolutely, we do support lead free surface mount technology assembly.

We are conscious about the health of the environment and also about your health. It is the reason why we eliminate lead and use materials that are free of the harmful lead materials.

How Do You Prepare for the SMT Assembly Process?

You have to prepare for the whole surface mount technology assembly process even though most of it is automated. The preparation involves getting the right materials in place and programming the machine.

You will have to use the certification or the validation from the CM team before you proceed.

As soon as that is complete, the preparation process will proceed with the following processes.

Application of Solder Paste

You will use the stencil that you were using to make the PCB and apply the solder paste on the SMT pads. It is important to ensure that you adhere to a specific time limit before the solder paste actually dries up.

Inspection of Solder Paste

After applying solder paste, you will run the whole board through solder paste inspection (SPI) which inspects paste location. Apart from that, it will evaluate the physical volume of the paste, among other important parameters.

After completing these processes, you will repeat it on every secondary side you have on the PCB. As you prepare the board for surface mount technology, you must also prepare the components that you will mount.

Here are the main preparation points for the components.

Preparation of the Bill of Materials Assembly Kit

You will take the bill of materials data alongside other important details and prepare the BOM assembly kit. After that, you will stock the bill of materials kit with the right type of components you want to have.

As soon as that is complete, you will forward the kit to pick and place machine on SMT production line.

Component Preparation

Here, the pick and place machine will hold every component that you need to place on the printed circuit board. Every component has a unique key that will match that of the machine thus increasing ease of component placement.

What Does the SMT Assembly Process Involve?

After completing the preparation process, you will proceed straight to the surface mount technology assembly process.

Here are the main processes that you will go through during the surface mount technology assembly process.

SMT Assembly Process

SMT Assembly Process

Component Placement

First, the pick and place machine will place the components at the right locations according to the design.

Here, the machine is simply following the commands that you will create on the design of the printed circuit board. It is, therefore, very important to ensure that you get everything right during the designing phase of the PCB.

SMT Printing

Here, you will apply pressure on the board that will spread the solder paste all over the pad.

After that, you will ensure that the solder paste is properly spread all over the area you intend to mount components.

You must also make sure that the SMT printing is as accurate as possible with no hitch on the printing program.

Reflow Soldering Process

After SMT printing, you will proceed to reflow soldering process which you will begin by assessing component positions. Here, you will maintain optimal temperatures and since welding is key, you have to look at the working parts.

You will proceed with preheating to ensure that you achieve a balance on the temperature of 180 degrees centigrade.

You must maintain humidity at 50% and then heat again to 245 degrees centigrade as solder melts at 183 degrees centigrade.

Finally, you will cool it down at a slow pace so as to get optimal results and then prevent extreme changes in temperature. At this point the components will remain firm and strong on the PCB thus summarizing the SMT assembly.

How Do You Choose the Best SMT Assembly Manufacturer?

Your aim of getting a PCB is to get one that will work very well and support all your application specifications.

Apart from that, you should always go for the printed circuit board that is strong and highly durable.

You can achieve this by choosing a very good manufacturer who has the best of services.

Modern Equipment

You should go for a manufacturer who has a factory that carries state of the art equipment that can build complex PCBs.

The equipment must also be flexible enough for future modifications in order to handle any changes on the PCB.

Experienced Labor

You should also look at the labor force that will be handling the processing of your printed circuit board.

Here, you should make sure that your manufacturer has qualified engineers with plenty of experience in SMT assembly.

Quality Materials

Your SMT manufacturer must also use very high-quality materials in the process of surface mounting components.

Here, you should aim at satisfying the highest quality levels that your customers will never forget about.

Perfect Timing

You should also go for a manufacturer who keeps time and delivers everything you need according to time agreements.

On the same note, the manufacturer should be capable of meeting the mass production requirements within shorter time periods.

Affordable Rates

The manufacturer of choice must also be in a position to provide you with the best quality PCBs at affordable prices.

You should work with your manufacturer hand in hand to create the most affordable budget for the process.

What are Reasons why some SMT Components Do Not Fit the Automated Assembly Process?

You should know that not all the components of the SMT will automatically fit the printed circuit board.

Here are the reasons why some components will not fit well on the automated surface mount technology assembly.

Too Light in Weight

Some of the components are light in weight and will not fit well during the surface mount technology assembly.

Such components will have a very poor mass adherence ratio for automatic placement thus need for manual placement.

Thermal Stress

You will also note that some of the components are too sensitive to heat and may not fit well with the requirements.

You will assemble heat sensitive components later after completing the surface mount technology assembly.

Great Solder Joints

There are certain components that will need a robust solder joint and may not fit the small solder joints.

In order to accommodate them, you will have to place the components on the PCB manually.

Panelization Separation

You may cause damages on certain components if you separate them out of the original assembly panels.

In this case, you will assemble the components manually after completing the separation process on the board.

What is the Difference Between SMT and SMD?

SMD Components

 SMD Components

Surface mount technology is the process of soldering and mounting the components on the surface of the PCB.

Surface mount device is a special type o component that you can only mount on the PCB surface using SMT machines.

In other words, you need a soldering plate to help in the surface mounting of the surface mount devices.

What are the Three Main Categories of SMT Assembly Devices?

There are three main package styles that you can use in the mounting process of components on the PCB.

Here are the main categories tat you can consider during the SMT assembly process.

Passive Surface Mount Devices

There are different packages that you can use for passive surface mount devices.

The majority of the surface mount devices that you can use are either surface mount technology resistors or capacitors.

Transistors and Diodes

You will find the SMT transistors and diodes are in small plastic packages with connections through the leads.

The leads have bends that are easy to mount and place on the surface of the printed circuit board.

Integrated Circuits

Here, the package that you will use for the integrated circuits will depend on the interconnectivity you need.

You can either use a package that has 14 or 16 pins on them depending on the application specifications.

What are the Main SMT Assembly Applications?

Even though you can employ surface mount technology in manufacturing different appliances, you need to be careful with the process.

Apart from that, you have to take the integrated circuit spacing seriously to ensure proper connections.

With all these conditions in place, you can produce some of the best equipment for use in the following industries.

  • Communication Industry to make communication equipment such as cell phones
  • Computer Systems
  • Medical Industry to make medical equipment such as pressure detection systems and MRI machines
  • Automobile Industry to manufacture various machine in the cars such as radios
  • Aviation industry especially because of the small size and light weight

At Venture Electronics, we will help you in all your PCB fabrication and assembly processes.

For inquiries, contact us now for all your SMT assembly needs.

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