Precision SMT Assembly Services
- IPC-A-610 Class 2 & Class 3 Certified Quality
- 0.3mm Fine-Pitch BGA Expertise
- Full Turnkey, Consigned & Hybrid Assembly Options
- 100% In-Line Automated Inspection (3D SPI & AOI)
Our SMT Assembly Capabilities
| Category | Feature | Specification |
|---|---|---|
| Services & Scale | Assembly Services | SMT, Through-Hole (THT), Mixed Technology, Electromechanical |
| Service Tiers | Prototype & NPI, Low-to-Mid Volume, High-Volume Production | |
| Supply Chain | Full Turnkey, Consigned, Hybrid | |
| Daily Capacity | Over 5 Million Component Placements | |
| Component Capability | Smallest Component Size | 01005 |
| Smallest Pitch | 0.2mm for small chip packages | |
| Fine-Pitch Capability | Down to 0.3mm for BGA/CSP, 0.4mm for QFP/QFN | |
| Supported Package Types | A comprehensive range including:• Ball Grid Array (BGA)• Ultra-Fine BGA (uBGA) / CSP• Quad Flat No-Lead (QFN)• Quad Flat Pack (QFP)• Small Outline IC (SOIC)• Plastic Leaded Chip Carrier (PLCC)• Package-on-Package (PoP) | |
| Board & Process | Maximum PCB Dimensions | e.g., 510mm x 460mm |
| PCB Types Handled | Rigid PCBs, Flexible Circuits (FPC), Rigid-Flex PCBs | |
| Soldering Process | Lead-free (RoHS Compliant), Leaded | |
| Quality & Compliance | Inspections & Testing | Visual, 3D SPI, AOI, X-Ray, ICT, Flying Probe |
| Compliance & Standards | IPC-A-610 Class 2 & Class 3, RoHS, ISO 9001:2015 |
Inside Our State-of-the-Art SMT Process
Step 1: Solder Paste Printing
We use fully automated, vision-guided printers to apply solder paste through a custom-made stencil onto the bare PCB. This critical first step ensures the correct volume and shape of solder is deposited on every pad, forming the foundation.
Step 2: 3D Solder Paste Inspection
Before a single component is placed, we verify the print. 100% of boards undergo 3D SPI to precisely measure the volume, area, height, and alignment of the solder paste deposits.
Step 3: High-Speed Component Placement
The heart of our SMT line is our fleet of high-speed pick-and-place machines. They are capable of placing over 55,000 components per hour, accurately handling a vast range of parts—from tiny 01005 passives to large, fine-pitch BGA and QFN packages.
Step 4: Multi-Zone Reflow Soldering
The populated board travels through our 12-zone reflow oven. We develop a unique, thermally-profiled recipe for each assembly, ensuring that the solder melts perfectly to form strong, reliable joints without thermally stressing sensitive components.
Step 5: Automated Optical Inspection
Post-reflow, every board is again subject to 100% automated inspection. Our AOI systems use high-resolution cameras to meticulously scan each component and solder joint, checking for placement accuracy, polarity, solder bridging, insufficient solder, and other potential defects.”
Step 6: X-Ray Inspection (for BGA/QFN)
For components with hidden solder joints like BGAs, QFNs, and other bottom-terminated packages, visual inspection isn’t enough. We utilize X-ray inspection to see inside the device, verifying solder joint integrity, checking for voids and shorts, and ensuring your most critical components are perfectly soldered.
Your Best SMT Assembly Manufacturer
We are manufacturing and supplying our beloved customers globally for more than 10 years.
Venture assembly services can help you build your PCB.
We have experienced staff to assist you when you are in need of SMT assembly.
To create a better and more powerful electronic product, SMT assembly is the way.
We accept small or large quantities of SMT assembly orders.
For your inquiries, don’t hesitate to contact us.
Your SMT Assembly Questions, Answered
Yes. Our Full Turnkey service is our most popular option. We manage the entire process for you—from sourcing all components and fabricating the bare PCBs to assembly and final testing. This single-point-of-contact approach streamlines your project, reduces logistical burdens, and often accelerates your time-to-market.
We adhere strictly to IPC/JEDEC J-STD-033 standards for handling MSL components. All moisture-sensitive parts are stored in humidity-controlled dry cabinets. If a component’s floor life has expired, it will undergo a controlled baking process in our ovens to restore it to a safe condition before entering the assembly line. This prevents micro-cracking (‘popcorning’) during reflow and ensures long-term product reliability.
No, we are highly flexible and do not have a minimum order quantity. We are fully equipped to handle everything from single-piece prototypes and small batch runs to scheduled, high-volume production. We support your project at every stage of its lifecycle.