Ventec PCB

  • High Tg FR­4
  • Excellent Thermal Reliability
  • CAF Resistance
  • Low Z­CTE

Ventec PCB compared to common FR4

Ventec PCB normally has higher TG compared to common high TG FR4. As this is the main reason that caused the price difference.
Also Ventec has better performance to maintain the high-temperature stability and mechanical strength.

We normally keep these materials in stock, such as VT-901, VT-47, VT-42 . If you need a material that is not listed here, please contact us and we can order it for you.

Ventec-PCB-compared-to-common-FR4
Ventec-for-multilayers-pcb

Which are the Quality Certifications for Ventec PCB?

Here below are the quality certifications that you should look for when choosing Ventec PCB:
BBB Certification               REACH Certification                     IPC Certification
ISO Certification                WEEE Certification                        RoHS Certification
ITAR Certification              SMTA Certification                        ESD Association
UL Certification

Ventec material combines superior loss characteristics

Our Ventec material combines superior loss characteristics. Our stock material can meet your demands from double side to multilayers, low TG130 to higher TG 180 request. If you have any requests, please contact Venture sales team now.

ventec pcb

Ventec PCB

Venture offers the highest quality Ventec PCB to meet the requirements of your projects.

Venture is committed to providing unparalleled and efficient services by maintaining the highest quality of work. Our Ventec PCB manufacturing processes have helped us earn numerous awards for excellence and environmental compliance.

Ventec PCB

 

Your Leading Ventec PCB Supplier in China

Venture Electronics is a professional manufacturer of Ventec PCB for more than 10 years. We manufacture a wide range of Ventec PCB to meet the requirements of your projects.

Venture is the best manufacturer of different types of Ventec PCB. We manufacture different thicknesses of Venture Ventec PCB. They are available from 002” to .200” thicknesses and with the copper foil from 1/4oz to 12oz.

There are many types of Ventec PCB. Venture is an expert in most Ventec PCB manufacturing. Mainly are VT-47 and VT-47PP. Venture Ventec PCB can supply either double-side treated or reverse treated (RT) copper foil. 

Our Ventec PCB is recommended to use the reverse treated copper due to the low profile. They are available in many E-glass styles such as 7628, 7629, 1506, 1500, 2113, 2313, 3313, 2116, 1080, 1086, 1078, 106 & 1067.

Venture Ventec PCB is widely used in different applications such as:

  • Chip Manufacturers
  • Engine/Flight Controls
  • Power Supply /Backplane
  • Military and Burn­in Board

Venture has a large Ventec PCB manufacturing capacity with our automatic production line. We have rich experience engineers and related tools to make sure your Ventec PCB layout meets all design rules and parameters.

Additionally, we offer Design for Manufacturability (DFM) analysis. We make sure to check the client’s design drawing such as:

  • fabrication circuit/trace routing
  • component positioning and spacing
  • potential fault reduction and process selection

For Venture, there’s no job too small or too large. Along with our 24/7 sales and engineering team support and 2 hours rapid response services, we will be your best Ventec PCB manufacturing, design, and assembly partner in China.

Ventec PCB: The Ultimate FAQs Guide

Ventec-PCB-The-Ultimate-FAQs-Guide

Before choosing Ventec PCB, read this guide.

It will help you understand the features, PCB material quality, applications and certifications, among other critical aspects.

Keep reading.

What is Ventec PCB?

This is a type of printed circuit board fabricated using high-performance copper-clad metal-backed and glass-reinforced substrates.

Ventec PCB combines superior loss characteristics, unequaled high-frequency performance (Df 0.002-0.0037/Dk 3.00-3.48 and highest reliability.

 Venture PCB

\Ventec PCB

Which are main Advantages of Ventec PCB?

The key benefits of Ventec PCB include:

  • Offer exceptional dimensional stability
  • Have high glass Transition Temperature (Tg of 180 degree Celsius)
  • Have uniform mechanical features that assist in limiting PIM
  • Laser Fluorescing
  • UV Blocking
  • Low Coefficient of Thermal Expansion
  • CAF Resistance
  • Excellent Thermal Reliability

What is the Purpose of the Desmearing Process in fabrication of Ventec PCB?

In desmear process refers to the removal of drilling debris and friction-melted resin from drill holes of the Ventec PCB.

This is attained through plasma or permanganate treatment.

Some procedures can as well improve resin coating adhesion through micro roughening.

During the process of drilling holes, heat is produced, which makes the epoxy resin to spread over connections of the inner layer.

The smeared epoxy must be cleaned off prior to any succeeding plating.

Which are the Common Ventec PCB Materials?

The following are some of the popular Ventec PCB materials available in the market:

Ventec LED PCB

Ventec LED PCB

· tec-speed 20.0

tec-speed 20.0 blends unmatched frequency performance, greatest reliability and superior loss properties.

This type of PCB material is made for most taxing high-frequency printed circuit board applications.

· -5A2

VT-5A2 provides a polymer matrix that is totally feasible with Ventec PCB, polyimide or epoxy-based materials.

This makes it the perfect option for the fabrication of multilayer low-loss PCBs.

It boasts of greatest performance thermal conductivity, high Glass Transition Temperature, and best thermal performance.

· VT-4B Series

VT-4B provides the right properties and performance for superior heat management of an Insulated Metal Substrate, which is designed for forming and bending.

Its tiny minimal radius facilitates easy installation in tight spaces, for classic PCB assembly.

The Ventec PCB material family offers a wide selection of thermal performance, and come with a flexible dielectric that will not peel or crack.

· VT-901

This is a type of Ventec PCB material that is perfect for applications that require high-temperature stability and mechanical strength.

The polyimide substrate features high glass transition temperature, high flex strength, and low Z-axis CTE.

VT-901 also has extended T260 and T288 times instrumental in maintaining dimensional integrity and stability, even under extreme loads.

VT-901 by Ventec is secure non-MDA formula having low outgassing, which is available as prepreg or laminate.

Its excellent electrical performance provides high electrical isolation resistivity and resistance to tracking, dielectric breakdown and arcing.

Moreover, VT-901’s low dissipation factor and dielectric constant ensure superior signal integrity for communications and computing.

What are the Applications of Ventec PCB?

Ventec PCBs are commonly used in the following devices and equipment:

  • Power amplifiers
  • Antennas for Cellular base station
  • Automotive radar
  • Broadcast satellites LNB
  • RFID

Which are the Quality Certifications for Ventec PCB?

Some of the main quality certifications include the following:

  • Military (MIL-PRF-31032) certifications
  • AS9100 Certification
  • ITAR Certification
  • IPC Certification
  • PCQR 2 Certifications

Which are the Suitable Electrical Properties of Ventec PCB?

Here are the electrical features that you should look for in Ventec PCB:

  • Low dissipation factor: Helps in maximizing power delivered and allow high-power PCB applications.
  • Low dielectric constant (Dk): facilitates rapid signal propagation
  • Consistent Dielectric Constant and Dissipation factor:

Uniform Dk and Df throughout the operating bandwidth of planned application prevent phase distortion and offer uniform transmission line impedance.

  • Consistent Dk and Df, Dk with temperature changes.

What are the Effects of Surface Roughness on Performance of Ventec PCB?

At frequencies lower than 1GHz, there are negligible impacts of surface roughness of copper on dielectric loss.

Nevertheless, with increasing frequency, there is a dramatic increase in a loss since the skin effect guides the current into the copper surface.

With a rough copper surface, the functional conductor length stretch as current flows along the surface contours up and down with copper surface topography.

In high-frequency Ventec PCB applications, the copper effective resistance increases parallel to the extra distance current must travel the surface contours.

The total loss consists of the sum of dielectric loss and conductor loss.

What is Resin Content in Ventec PCB?

Resin content refers to the overall weight of PCB prepreg that comprises of resin.

Burn out is the standard test method for determining resin content within fiberglass reinforced laminates and prepregs.

In the technique, following a burnout at 1100 degrees Celsius, the final weight is subtracted from the initial weight.

The resin content is the difference, which is usually represented as a percentage.

In Ventec PCBs employing organic reinforcements, a “basis weight” technique is used to establish the resin content.

The method determines the original weight of the fabric, where it presumes that the weight is uniform through a fabric roll.

The resin content is then calculated by getting the difference between the basis weight and the coated weight.

The flow and resin content dictates the thickness of a PCB laminate when pressed.

They as well determine the amount of resin that will be necessary to fill the interior layer copper.

Ventec PCB resin content equally has great effects on features like dielectric constant, drilling and etching quality, dimensional stability, and coefficient of thermal expansion.

The capability to regulate resin content relies on the following factors:

  • Weight variation of the base fabric
  • coater operation consistency
  • Variation in batch-to-batch rheology of the resin solution

In most cases, the prepreg is produced within a ± 3 percent tolerance.

Which are the Methods of Measuring Flow of Ventec PCB Prepreg?

There are different techniques of measuring prepreg flow in IPC-4101, which represent varied approaches to flow:

· Standard 4-ply flow test

This flow testing method entails cutting prepreg pieces to a particular size, weighing and compressing them at a regulated pressure and temperature.

The resin flows being tested and later a smaller portion is cut from the middle, weighed again and normalized to the initial area.

The flow (denoted as a percentage) is the weight loss between the original PCB material and the ultimate weighed “flow biscuit”.

Standardization is strongly recommended on the method where practical.

More plies lead to greater flow values.

However, making standardized Ventec PCB prepreg is complex since different users may have different requirements on similar material.

· Scaled Flow (SC) Test

To enjoy the actual benefit of this test, you must consider together Delta-H and scaled flow.

Considering the two elements together would offer a perfect indication of the thickness of the finished ply created by a prepreg.

In addition, they also indicate the flow amount that took place to achieve the results.

· Low-Flow (NF) Test

Low-flow test entails measurement of the quantity of resin flow into holes having 1-inch diameter.

The diameter denotes a cutout area in a Ventec PCB.

This technique is applied for measuring the flow amount of materials engineered for rigid-flex and heat sink bonding applications.

It is used in applications requiring the prepreg to stick layers together.

However, the prepreg cannot be permitted to flow in excess into cutout sections or in spaces where flex material should stay unconstrained.

· Rheological Properties Measurement

Rheological features are tested using various equipment that determines the viscosity of the resin system when melted or during the process of melting.

Oscillating Disc Rheometry (ODR) is a complex test that gives data on change of heat up rate, temperature and rheology relative to time.

Rheology data provides a hint of nature of flow of material during processing.

What is the meaning of Buildup in the Manufacturing of Ventec PCB?

Buildup is a terminology used define a specific blend of prepreg plies that is included in the construction of a Ventec PCB laminate.

It is practical to build up majority of laminates in one of the various different methods available.

Actually, if a laminate has a thickness of 0.020″ or more, there exist nearly an unlimited buildups variety you can apply.

Normal production of is governed by the principle of least cost.

The buildup chosen is that gives the required thickness at the least cost.

All 7628 are used in In Rigid Ventec PCBs.

They do not apply 7642 or additional heavier glass designs that are cheaper, yet produce inferior laminate.

For ordinary prepregs, you can approximate the thickness of the build per ply.

However, the actual thickness yield relies on the processing, ply weight and resin content.

What is a Ventec PCB Cert?

A “cert” denotes to a Certificate of Compliance.

It refers to a piece of paper that expresses, in effect, the Ventec PCB you are purchasing fulfils your purchase order requirements.

Typically, a cert consists of certain fundamental test data or validates that there is test data to back it up.

A cert is the most popular and least class of a Test Report.

If suitable, certs and test data are put in one form.

This ensures easier record keeping and handling and reduces chances of error.

Which is the Standard Copper Treatment Method Used During Manufacture of Ventec PCB?

The standard method of treating copper in Ventec PCB entails depositing microscopic copper nodules across the copper “teeth” on the foil bath-side.

You can plate nickel, brass or zinc across the deposited copper nodules for a more thermally steady treatment and to minimize oxidation.

Moreover, it is possible to use a further treatment consisting of a very thin zinc chromate or supplementary antioxidation treatment.

This helps in avoiding oxidation of the smooth edge of the foil or drum.

Copper adhesion is attained by a blend of chemical and physical bonding.

Electrodeposited copper foil possesses a natural “tooth design” created during electro-deposition.

The nodular copper treatment offers a locking system if the resin plates and encases the copper teeth.

Copper foil chemical treatment can as well enhance bonds.

Most of the foils in application presently have proprietary silane or additional treatments that chemically improve bond to a number of resins.

What Dictates the Thickness of Ventec PCB Laminate?

Thickness of PCB

 Thickness of PCB

The thickness of a Ventec PCB laminate is based on the type and number of prepreg plies or layers that it contains.

Every fabric style, if coated using resin to a specific weight, possesses a characteristic thickness.

The thickness can be calculated mathematically depending on the resin density and weight and fabric density and weight.

It is important to note that the weight of fabric can differ by as high as ±5 percent roll to roll.

Therefore, a more accurate technique of ensuring total laminate thickness is by controlling total weight rather than just measuring resin content.

You can have a sole fabric having several varying finished weights, which when plied will produce varying finished laminate thickness.

How do you Control Traceability of Ventec PCB?

Traceability of Ventec PCB is very important and it attained as follows:

  1. Mix cards of resin batch constitute the lot number of every raw resin batch utilized in their blending. They also include the measured weights of every component included in the mix.
  2. Treater run sheets consist of referral to the mix cards together with manufacturer, roll, and lot numbers of fabric rolls utilized in run. It comprise of all real test data produced in the course of the run.
  3. Shop Travelers, which is common for laminates, comprise of the lot number of every prepreg lots used to produce the laminate. This can be traced back to the treater run sheets. It as well includes the roll number and manufacturer of all copper foil utilized. The shop traveler is constituent of the fundamental quality record of Ventec PCB laminate.

The key to traceability of a Ventec PCB is the lot number.

With the lot number of a given product, you can trackback to the manufacturing raw materials.

Furthermore, it as well makes it possible to trace back to the entire equipment setup and run conditions.

What is the Meaning of Thermal Decomposition Temperature (Td) of Ventec PCB?

Thermal decomposition Temperature varies significantly based on the chemical composition of the Ventec PCB materials.

It varies from 300 degrees Celsius for most epoxy systems to above 400 degrees Celsius for some polyimides.

Td refers to the temperature at which a PCB material starts to disintegrate thermally.

Certain data sheets will register it as the temperature where a laminate has lost 5 percent of its initial weight because of decomposition.

Onset temperature would be a better performance indicator, since it is the temperature where substantial weight loss starts to take place.

A PCB material may turn unusable in most applications by the time it has lost 5 percent of its weight to degradation.

Which are the Crucial Process Parameters that must be Observed During the Fabrication of Ventec PCB?

There are 5 distinct areas specifically associated with the selection of prepregs and laminate that you must consider during PCB manufacturing.

They are crucial irrespective of the Ventec PCB material, even though specific suggestions might be different for low-flow, epoxies, polyimide or filled systems.

Here are the important process elements that should be considered during the manufacture of PCB:

  1. Maintaining processed interior layers and prepreg dry before lamination.
  2. Controlling of rate of heat up within the laminating press to make sure there is uniform melt flow.
  3. Guaranteeing the right temperature of lamination for the PCB material being utilized.
  4. Ensuring that the cure time is sufficient to develop glass transition temperature.
  5. Regulating cool down to avoid warpage.

How Do you Control Prepreg Flow During Fabrication of Ventec PCB?

Usually a process tweak is needed to promote right flow of prepreg for a specific Ventec PCB design including:

· Change the Lamination Pressure

Moderate adjustment in pressure will lead to somewhat more flow and might enable you to create the appropriate condition for the PCB.

· Change the Rate of Press Heat up

This needs more of a modification than adjusting pressure and should not be utilized unless you cannot fix the procedure by pressure only.

Resins incline to exhibit reduced melt viscosities and slower flow if heated up more gradually.

· Cut Back the Prepreg

In some instances if using low-flow prepreg, you need to moderately cut it back to avoid coming out of flow bead to cutout area.

Modifying the cutback can always correct a minor flow problem without the need to tweak the procedure.

You can perform the modification for single or two distinct cutouts that are flowing excessively without touching others or modifying the lamination process.

Altering heat up or pressure rate affects the entire Venture PCB equally.

What is CTE of Ventec PCB?

Also known to as Thermal Coefficient of Expansion, Coefficient of Thermal Expansion refers to a thermomechanical feature of a PCB material.

It defines the tendency of a Ventec PCB laminate to expand as it heats up.

The materials expansion is volumetric in feature, yet the laminate design is such that you need to independently consider out-of-plane and in-plane expansion.

Also, the clean resin would have an isotropic expansion (similar in all directions), if there existed no restraining fabric within the laminate.

Reinforcing fabrics utilized in Ventec PCB laminates have lower CTE than the resin in addition to high modulus values.

This restricts the PCB material in-plane expansion.

Nevertheless, the volumetric expansion of resin is basically incompressible.

This implies that the resin will enlarge in the comparatively unconstrained Z-direction.

This is because the strong fiber reinforcement restricts the degree of resin movement in the laminate plane.

The coefficient of thermal expansion in Z-direction rises four times beyond the resin system glass transition temperature.

This implies moving from 50 to 200 ppm per degrees Celsius in typical resin system.

Conversely, the coefficient of thermal expansion within the X and Y-axis of the Ventec PCB normally decreases moderately below the Tg.

This is due to the decrease of resin modulus and strengthening of the constraining capability because modulus is comparatively uninfluenced by temperature changes.

In short, choosing the right material for the PCB fabrication process can be a challenging process.

We hope this guide makes it easier for you to analyze the Ventec PCB.

In case you have any questions or inquiries, feel free to contact Venture Electronics team

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