PCB Materials

Choosing the right PCB materials will give you a peace of mind.

Whether you need multilayer PCB, aluminum PCB, or high frequency PCB, their performance will depend on the type of material you choose during the PCB fabrication process.

So, if you want to learn how to choose suitable PCB materials, read this guide.

What Materials are PCBs made of?

Printed circuit boards (PCBs) are a fusion of laminates which are non-conductive layers and metal films that are conductive.

You find laminates are obtained from substrate materials such as FR – 4, ceramic, and CEM (Composite Epoxy Material).

FR 4 Material

Ceramic PCB Material

CEM Material

The conductive metal film can be furnished from metals such as copper, silver, and gold.

However, copper finds more common use.

Additionally, a PCB consists of other parts and layers that are derived from different materials.

For instance, the solder mask is made from solder material.

Also, the conductive traces are usually coated with other materials such as gold, nickel, silver, and tin for protective purposes.

How do I choose a PCB Material?

The selection of PCB material should be based on the board application and the determined design.

The material you choose for your PCB substrate will determine its strength.

Additionally, your choice of conductive material will speak to its conductivity levels.

When a board design requires thermal efficiency you will be better off employing a ceramic-based substrate.

Equally, important, a high-frequency board can perform better with silver as the material for its conductive path.

Why is Copper commonly used as the PCB Material for Conductive Layers?

Other materials such as silver and gold can be employed in printed circuit boards as the conductive material.

However, you will find many if not most printed circuit boards with copper material for the conductive layer.

Some of the qualities attributed to copper are explained below.

• Copper is a very good conductor of electrical signals.

The electrical transfer capability of copper is one with reduced signal loss levels.

• The use of copper is credited to its low cost that makes PCB fabrication economical.
• Copper is widely available and affordable compared to other metals with higher electrical properties such as silver and gold.
• Copper is a good thermal conductor too. The heat generated onboard can be efficiently dissipated by the conductive copper path preventing accumulation.

When heat is allowed to accumulate in a PCB, it causes thermal-induced strain which can result in board failure.

• Copper has high compatibility with other materials used in the PCB fabrication process.

You find copper will offer decent performance levels when used with either ceramic substrates or FR – 4.

What is PCB Material Etching?

PCB material etching refers to the removal of unwanted material parts of a surface to retain the desired pattern formation.

Etching is useful in helping you create the trace pattern for your board design.

Etching is also referred to as a subtractive process as it entails the removal of material.

You find two approaches to etching: dry etching and wet etching.

Dry etching entails the use of plasma related methods to remove unwanted material.

Here, you initiate a reaction between the atoms at the top and bottom.

Wet etching involves using chemical solutions to initiate extractive reactions.

Some of the chemical substances used in the PCB etching process include chlorides of copper and iron and cupric chloride.

Also used are alkaline ammonia and a mixture of hydrogen peroxide and sulfuric acid.

What are the Dielectric Materials used in PCB?

Dielectric materials exhibit poor electrical conductivity in their original state.

However, these materials can be modified to allow electrical charge transfer through a process known as doping.

In PCBs dielectric materials are employed to provide electrical isolation between conductive surfaces.

Some of the common dielectrics include metal oxides such as aluminium oxide, glass, porcelain, and plastics.

What are the Properties of the PCB Dielectric Materials?

Dielectrics are materials used to provide electrical insulation for conductive layers in PCB construction.

You find dielectric properties dictate the performance of a PCB under certain conditions such as high-temperature and high-frequency.

The dielectric properties for PCB substrate materials can be classified as:

• Electrical related properties which describe the electrical charge transfer capabilities of the substrate material.
• Mechanical related properties that define the strength performance of a substrate and consequently, the PCB structure.
• Thermal related properties are specific to the response of the materials to temperature changes.
• Chemical related properties provide an overview of the reaction of materials when exposed to chemical interaction.

PCB dielectric material

How is the PCB Material Prepreg made?

Prepreg material is made from woven glass fiber and resin.

The resin is impregnated to the glass cloth and hence the name prepreg.

Also, the process begins with a woven sheet of the fiber.

The woven glass fiber is derived from a weaving process that involves the use of fiberglass as yarn.

This material is rolled through a process house where it is reinforced with resin material.

The resin-based epoxy is deposited on the glass cloth through granular application or immersion.

Besides, the resin epoxy is derived from the chemical substances epichlorohydrin and bisphenol-A.

Thereafter, the material combination is conveyed to a roller system where the resin is distributed evenly to achieve a defined thickness.

What is the FR – 4 material in PCB?

FR – 4 is a variant of the Fire Retardant material that is commonly employed as a laminate in PCB fabrication.

You find this material is derived from glass fiber and is employed as an industry standard for laminates in PCB construction.

There are three common variants of the FR – 4 material used in PCBs.

• You find the standard FR – 4 is the most common variant and most affordable.
• The standard FR – 4 can also be furnished with a higher temperature of glass transition to allow for lead-free usage. As a result, this variant complies with RoHS standards.
• The halogen-free is another variant of FR – 4 that also allows the use of lead-free solder.

Why is the FR – 4 a Popular PCB Material?

PCB FR 4 Material

You find the FR – 4 employed as a laminate in many PCB constructions across the industry.

The FR – 4 can be used for single-sided boards, double-sided boards, and multilayer boards.

The popularity of FR – 4 can be attributed to the following qualities:

• FR – 4 has a wide range of working temperatures with the ability to operate between – 50°C and 115°C.
• You also find the glass transition temperature of FR – 4 is high at about130°C.
• FR – 4 has good dielectric qualities with a stable dielectric constant and low dielectric loss.
• The mechanical strength provided by FR – 4 is decent for maintaining board structure integrity.
• You can modify FR – 4 to eliminate lead usage by increasing glass transition temperature.

Are FR – 1 and FR – 2 used as Materials in PCBs?

You find the usage of FR – 1 and FR – 2 materials restricted to single-sided boards only.

You find the reason to be because these material types are paper-based and are fabricated from phenol substances.

Consequently, they exhibit low mechanical strength.

FR – 1 and FR – 2 have identical features save for their values of temperature of the glass transition.

You find FR – 1 possesses a higher temperature value than FR – 2.

These materials have good manufacturability with good resistance to fire.

FR – 1 and FR – 2 can be made in other variants alongside the standard option.

You can find these materials made without halogen and phosphorous to make them RoHS compliant.

Additionally, they can be made to be unaffected by water especially their dielectric properties with a higher comparative tracking index.

What is the CEM 1 PCB Material?

CEM (Composite Epoxy Material) 1 material is a paper derived material sandwiched between a glass fiber epoxy-reinforced layer and phenol substances.

You find this material with a characteristic whitish color and employed in PCBs with only one conductive layer.

CEM 1 PCB Material

Their restricted use to these boards is due to their weak structure that dissuades the drilling of plated through-holes.

CEM 1 material is cheaper then FR – 4 but with similar dielectric characteristics.

However, these materials are considerably weak mechanically.

You find CEM 1 can be modified to have a higher glass transition temperature to allow lead-free usage.

Moreover, it can be packaged without halogen and stripped off antimony to make it non-hazardous.

Its comparative tracking index can be controlled to above 600 with water-resistant capability.

What is the difference between CEM 3 and CEM 2 in PCB Materials?

Rather than being based on paper compounds as CEM I, CEM 3 is structured on glass fiber and resin substances.

While it shares the distinct creamy white color of CEM 1, it has better mechanical strength.

Consequently, CEM 3 can be used in PCBs with two conductive layers requiring interconnection through metalized through-holes.

You find CEM 3 materials have good manufacturability with a high rating for flammability.

Unlike the CEM I, these materials can be fashioned such that it can impede the passage of ultraviolet radiation.

Additionally, you can alter the properties of CEM 3 to eliminate hazardous substances and comply with RoHS directives.

What Substrate Material is used for Flexible PCBs?

Flexible PCBs are printed circuit boards that can be bent and twisted without breaking.

You find these PCBs useful in wearable technology especially in making biomedical equipment.

Consequently, the substrate material composition of these PCBs needs to accommodate bending and twisting forces.

Polyimide is the material commonly used for substrates in flexible PCBs.

It is furnished as a thin film with a narrow thickness range not exceeding 120micrometers.

You find that the thickness of the polyimide will determine its flexibility.

As such, a large thickness results in reduced flexibility or increased stiffness.

What are the Features of Polyimide PCB Material?

While polyimide is notable for its flexible property, it has other notable characteristics. They include:

• Polyimide has a high working temperature range allowing its use in extreme military applications.
• You find this material can withstand large thermal-induced strains.
• Additionally, the electrical properties of polyimide are impressive.
• Polyimide has remarkable tensile strength that gives it remarkable endurance in harsh application conditions.
• Moreover, the ability to resist chemical interference by polyimides is high.
• Some polyimides have a matching coefficient of expansion with copper allowing similar responses to thermal changes.

However, you find polyimides are limited in the following instances:

• The rate of absorption of moisture and water content by polyimides is high.

Also, the absorbed moisture or water content can attribute to almost three percent of its weight.

• You find polyimides are exorbitantly priced making them expensive.
• While polyimides have exceptional temperature characteristics they are subject to the forces holding the layers together.

What Qualities favor Fine Ceramic use as a PCB Substrate Material?

The popularity of fine ceramic compounds as PCB substrate material is credited to a variety of qualities.

Common fine ceramic substances used as in PCBs include aluminium oxide and aluminium nitride.

The following features attribute to their use in PCB manufacture.

• Fine ceramic substances have good endurance even in high-temperature environments.

You find ceramic PCBs with a high glass transition temperature and temperature of decomposition.

• You find ceramic compounds have a very low thermal coefficient of expansion.

Furthermore, their CTE matches that of copper providing uniform response to temperature changes.

As a result, structural weaknesses caused by thermal strain due to different CTEs are reduced.

• The ability of ceramics in thermal energy transfer is unparalleled among substrate materials.

Subsequently, you will do well to employ ceramic substrates in a PCB design calling for thermal efficiency.

• Fine ceramic compounds can operate in a high-frequency application without impairing signal quality.

Ceramic substrates stave off impedance observed in transmission and other forms of interference.

• The flexural strength and tensile modulus of ceramic materials are high.

Therefore, you find ceramic materials can bear mechanically induced stresses without breaking.

As such, these materials can be used for multilayer PCB construction.

• Ceramic based PCBs have a decent response to inconsistent voltages and surges.

They cushion the PCB from such occurrences and offer near-perfect isolation for the conductive layers.

• Ceramic compounds are tolerant to increased radiation levels.

Thus, PCBs with a ceramic material for substrates are employed in space machinery and satellite equipment.

• You find the moisture absorption of ceramic substances is very low.

As a result, these materials will retain their thermal and dielectric properties even in wet environments.

What is the Glass Transition Temperature of PCB Materials?

The glass transition temperature (Tg) is a range of temperatures within which the PCB’s substrate material exhibits a change in the physical state.

You find the material transforms from a firm solid state to a soft slippery state as the material bonds weaken.

Typically, when the temperatures are returned to below Tg, the material reverts to its initial state.

The temperature of glass transition is described in degrees Celsius or Centigrade.

How is the Decomposition Temperature related to PCB Materials?

Sometimes a PCB material undergoes decomposition chemically due to the attainment of a certain temperature value.

You find this temperature is referred to as the temperature of decomposition (Td).

Decomposition temperature is expressed in degrees Celsius.

A PCB substrate material can lose up to a twentieth of its weight during decomposition.

Unlike with Tg, where the change is reversible when the substrate reaches Td the transformation is permanent.

Consequently, you find most materials with a higher Td than Tg.

Why is the CTE of Materials in PCBs important?

CTE refers to the coefficient of thermal expansion.

It is a measure that describes the expansion rate of a material used in a PCB when temperature builds up.

The rate of expansion is described in parts per million which are equated with a single degree rise in temperature.

Also, the CTE of the material will be observed as the temperature exceeds that of Tg.

You find the CTE of PCB materials important in ensuring a similar response to thermal changes.

When materials in PCBs have different CTEs, they exhibit different responses to temperature resulting in thermal strains along shared borders.

Consequently, it is important to match the CTEs of PCB materials to provide uniform thermal influenced behavior

Substrate material such as FR – 4 has a higher CTE than copper in standard PCBs.

It follows that when temperatures increase, copper will exhibit a response faster than the substrate material.

Design changes are essential in mitigating the effect of CTE.

Furthermore, you can determine a material’s Tg by determining the curve intercept of a CTE graph.

Is Thermal Conductivity important for PCB Substrate Material?

Thermal conductivity is a measure of a material’s capacity to transfer heat.

When a material has low conductivity it highlights its limited capacity in transferring heat.

A material with high thermal conductivity can easily transfer thermal energy.

Thermal conductivity is measured in watts per meter per degree Celsius.

Thermal conductivity is useful in dissipating generated heat in a PCB.

PCB substrate materials with high conductivity contribute to better board performance.

You find ceramic substrates have a higher thermal conductivity than FR – 4 materials.

Their thermal conductivity rate is comparable to that of copper.

Consequently, when PCB applications require thermal efficient designs, ceramic materials are employed as substrates.

What is the Dielectric constant of a PCB Material?

The dielectric constant of a material is also referred to as the relative permittivity of the material.

It is a value that describes the capacity of a material to retain its dielectric properties.

You find most materials used in PCBs have a dielectric constant value between 2. 4 and 4.6.

The relative permittivity of materials in PCBs is useful in determining the PCB performance in high-frequency applications.

Especially of concern are its performance in signal transmission and impedance control.

You find that the relative permittivity of a material will change with the frequency levels, reducing while frequency values rise.

PCB materials have different response rates to frequency changes that affect their permittivity.

You can find PCB materials with a fairly stable dielectric constant allowing them to perform over a broad range of frequency.

How are PCB Materials Influenced by their Dielectric Loss Tangent?

Dielectric loss tangent

The dielectric loss tangent is also known as the dissipation factor.

It highlights a material’s net power loss as a result of the material’s inherent properties.

Materials with a low dissipation factor exhibit a reduced loss of power.

The dissipation factor of PCB materials is relatively low making it one of the most common quality.

Additionally, you find the dielectric loss tangent changes with the frequency such that as frequency rises so does it.

However, the rate of change is low and can only be of concern in extreme frequency values exceeding a gigahertz.

A PCB material’s dissipation factor is of great importance when employed for circuit boards in applications dealing with analog signals.

In this case, the loss tangent influences the extent of the attenuation of transmissions.

Therefore, you find the dissipation factor determines the signal and noise relation across the conductive path.

What are the Guidelines for Determining Flammability Specifications of PCB Materials?

Flammability is a measure of a PCB material’s flame retardancy.

It is provided as a feature for safety concerns due to the thermal occurrences on a printed circuit board.

To conform to the set standards of flammability, the following guidelines are used during material testing.

• When the material is subjected to a flame test, it should not visibly combust longer than ten seconds.
• The flame test is carried out on five different samples of the same material. In this event, the total time of combustion should be less than fifty seconds.
• When the material sample burns up, the ball of the flame should not be large such that it extends to the handle.
• The burning material sample should not have issues of burning material dropping off.

Furthermore, these separate combusting particles should not kindle a dry cotton ball located twelve inches below.

• Upon consecutive lighting with a flame test, the material sample should not burn up longer than half a minute.

How does Moisture Absorption by PCB Materials Hamper Performance?

Moisture absorption by a PCB material is illustrated by its failure to draw in the water when submerged.

The measure of absorption is determined by the weight increase after immersion in water.

PCB materials typically have low absorption rates of less than 0.2 percent.

When PCB materials take up moisture content, their electrical and thermal properties are affected.

You find their resistivity and dissipation factor lowered.

Additionally, heat conduction is impaired by the presence of water molecules.

What is the Peel Strength concerning PCB Materials?

Peel strength alludes to the strength of the connection bond formed between the conductive layer and the substrate material.

It is a mechanical property that describes the amount of force needed to break a surface to surface material bond.

Peel strength is expressed as a force over a linear distance.

When conducting a peel strength test between the conductive layer and substrate layer, the test is subject to the following conditions.

• The test sample is exposed to molten solder at over 250 ^oC for about ten seconds to induce thermal stress.
• Another condition you find is the subjection of the test sample to elevated temperatures at about 130 ^o The temperatures are induced by convectional means through heated air/fluid.
• The test sample can also be subjected to a succession of chemical processes.

How is the Electrical Strength of a PCB Material Determined?

A PCB’s material strength is exhibited by its capacity to withstand an electrically induced breakdown.

Typically, this measure is taken for breakdown whose line of action is in the z-axis.

The standard measurement unit for electrical strength is volts per millimeter.

To establish a PCB material’s electrical strength, intermittent pulses of high voltage values are applied to the material.

These pulses are carried out at typical frequency values with alternating current power similar to that used in normal board operation.

The material’s electrical strength is measured by how long it endures these voltage pulses without breaking down.

What is the difference between Surface and Volume Resistivity of PCB Materials?

Volume/electrical resistivity is a PCB material property that underscores the material’s ability to resist electrical charge transfer.

You find materials with a high volume resistivity with an increased propensity to restrict electrical flow.

Surface resistivity is similar in measure to volume resistivity with the major difference being the location of measurement.

Surface resistivity is only taken over a material’s surface.

PCB substrate materials require high resistivity values to achieve remarkable isolation of the conductive layers.

Moisture content and temperature changes can influence a PCB material’s resistivity.

The standard measure of resistivity is given in ohm-meters.

Where are Isola Materials used in PCBs?

Isola materials are employed for PCB designs meant for high-speed digital applications.

Isola PCB material

Such applications involve transmission processes for digital signals with high frequencies that ensures high quality.

You find the conductive path to offer a signal path and is consequently the source of generated interferences.

There are many equipment you will find with PCBs fabricated from Isola material.

These equipment typically have elevated rates of data transfer with extended channel spans.

You find this possible due to the increased use of the internet with a variety of application needs.

These needs encompass virtual and cloud storage, and integrated computer systems.

Some of the equipment employed include channels for transmitting high-speed data and telecommunication equipment such as routers and system servers.

You also find modules combining transmitter and receiver functions alongside power amplifiers as other application devices.

What are some of the Isola Materials used in PCBs?

There are many alternatives when considering Isola materials.

These materials have a wide range of properties chief of which is their ability to sustain performance at high-temperature levels.

Other desirable properties include a low coefficient of thermal expansion especially in the z-axis and lead-free usage.

The following includes some of the available Isola materials used in the fabrication of printed circuit boards.

· FR406

The FR406 is a fire retardant variant of Isola that encompasses a prepreg and epoxy-based laminate with the achievement of high thermal performance.

Use of the FR406 is prevalent in multilayer board construction.

You find it provides better board consistency in manner of size with low CTE and remarkable thermal efficiency.

· FR408/ FR408HR

You will find this FR-4 variant of epoxy-based laminate and prepreg to be highly effective in its performance.

The production of FR408 follows the standard process for FR-4 and consequently does not require expensive upgrades in equipment.

Additionally, this material is typically common in applications with complex circuit formations.

The FR408 material’s minimal dielectric properties allow increased data rates and better signal quality in such applications.

The Isola FR408HR core material is fabricated via an improved resin and glass fibre combination process.

Subsequently, it significantly improves the thermal and electrical features of the standard FR-4 material.

The FR408HR is ideally employed in PCBs with multilayer configurations where the consistency levels desired in thermal efficiency are high.

It follows that this material possesses a remarkably high temperature of glass transition at well over 200°C.

· 370HR

This variant of Isola material is another FR-4 derived alternative for making PCB prepregs and laminates.

It can perform consistently at high-temperature values with an impressively high temperature of glass transition at over 170°C.

You will discover in the manufacturing process of 370HR, and improved resin-epoxy compound is fortified by using a modified glass fibre standard.

The 370HR is improved to exhibit a reduced coefficient of thermal coefficient while maintaining the manufacturability of the FR-4 material.

Moreover, you find its thermal, electrical and physical properties are similar to if not better than the conventional FR-4 materials.

Furthermore, the examination of a PCB with this material type can be carried out automatically.

You can execute surface pattern imaging without difficulty too.

The possibility is due to its positive response to laser application and its determent of ultraviolet radiation.

When carrying out serial lamination procedures, using the 370HR for laminates is highly effective.

· G200

The G200 Isola material allows for the manufacture of PCBs with reliable performance at high-efficiency levels.

It is often employed in panelization modes of manufacture for multilayer circuit boards.

To fabricate this material type, resin-based epoxy is reinforced with Bismaleimide and Triazinecompounds that greatly improve its overall material properties.

· IS410

The IS410 eliminates the use of lead in its manufacturing process while providing enhanced reliability for the circuit boards.

You find this material type is subjected to numerous thermal cycles to impart increased thermal efficiency.

Additionally, using the IS410 is particularly useful in providing superior drilled holes due to its quality bores.

· IS415HR

Another highly efficient PCB laminate material commonly used for multilayer board configurations requiring efficient thermal designs is the IS415HR.

Applications that could employ this material type to best use are those with a need for impressive signal quality.

Its use in multilayer board formations is due to its low response to temperature changes.

· IS680-300

The IS680-300 is a laminate material that exhibits reduced dielectric loss.

Subsequently, it permits consistent performance levels within wider temperature and frequency limits.

You will find this material type used for PCBs in radiofrequency transmission circuits.

It provides a cheaper option for polytetrafluoroethylene material.

· P96/P26

The P96/P26 is an Isola laminate and prepreg material core that is furnished from polyimide compounds.

The P96 indicates the laminate base while the P26 indicates the prepreg input.

You find this material type applied in circuits with large thermal demands.

To fabricate the P96/P26, a modified resin is combined with a polyimide to form an adaptive polymer.

You find the resulting material is rigid with strong covalencies with an elevated temperature of the glass transition.

The P96/P26 cannot easily combust and its polyimide backing permits its use in demanding applications such as military use.

Generally, this material type finds employment in appliances demanding efficient thermal designs.

What Material Improvements are Observed in Isola Materials?

Conventional circuit boards for microwave transmission have a low layer count with many not exceeding two.

However, PCBs used for high-speed digital functions constitute multiple layers that can exceed twenty with extended conductive tracks.

Furthermore, the different nature of the application requires different material needs.

Materials used in microwave transmissions produce losses and signal deformations through their sinusoidal wave formations.

A common cause of concern is the dissipation factor and dielectric constant related to the material.

On the other hand, the high-speed digital board material propagates timing difficulties, pulse stretching and signal to dampen with trapezoidal formations.

Isola materials employ laminates with modified resin qualities, conductive film and glass fibre.

Furthermore, the conductive path is revised to be over the woven glass or furnished over an epoxy base.

Isola materials are maintained as dielectrics to allow movement of charges upon exposure to a signal induced electrical field.

You find the Isola materials used as laminates employ glass fibre with similar evenness for better impedance control.

Moreover, the epoxy and glass formations are provided with a marked dielectric relationship.

Also, while the conductive paths are made to be broad, they are laid angularly relative to the fibre formation.

What areVentec PCB Material?

Some of the most common Ventec PCB materials include:

9Ventec PCB material

· Standard FR-4 Materials

Ventec materials are provided as standard FR-4 for rigid circuit boards with options for mid and high glass transition temperature.

Some of the materials include VT-481 as a standard FR-4, VT-47 for high Tg, and VT-42 for high-value IRC.

These FR-4 materials are derived from high-grade resin and glass fibre laminates with different thickness options.

You will find these FR-4 materials used with copper films for a variety of applications requiring different power needs.

Additionally, you find they possess strong mechanical properties such as flexural strength with impressive thermal and electrical properties.

Their resistance to material changes on exposure to different temperature values provides stronger joints and stability.

· Copper Foil and Aluminium Copper Foil Materials

Ventec materials are also used for the preparation of plain copper films and those bonded with aluminium.

Different bases derived from FR-4 and even polyimide are employed with the films.

Some of these films are IPC-4563, HTE copper, copper films with reinforced bonds, protective coating and those bonded with aluminium.

You find these copper and aluminium films are made to high-quality finishes without any surface contaminations.

As a result, these measures provide a steady surface for bonding with high-value production.

· Drill Entry and Exit Materials

Ventec provides entry and exit materials for drilling efforts that ensure process efficiency.

You find this possible through the elimination of draining processes such as targeting to dissuade offsets and deburring.

Materials used ensure the drill parts are not subjected to excess generated heat and consequently make them durable.

PCBs using Ventec’s drill entry and exit materials last much longer while maintaining performance standards. Some of these materials include:

• A high-density brown coloured exit drill board (BU25).
• The WLB25 which is a laminated whiteboard for drill exit.
• The PHP which provides a drill entry and exit board that is phenolic based.
• The aluminium drill entry film (ALU).
• WCB25H as a white coloured backup material for drilled boards.

· Flex/Flex Rigid Materials

Ventec materials are also offered for flexible boards and those with mixed elements, that is, both rigid and flexible.

These products are especially useful in applications with aspects of flexibility such as wearable technology.

Ventec materials of this calibre are fashioned to tolerate high working temperatures and preserve their physical status.

Notable products of this type are the VT-47PP and the ThinFlex range of products.

The VT-47PP material is made by impregnating prepreg with fine ceramic compounds to limit the shrivelling and fissuring of the resin.

It made without lead elements and has an elevated temperature of the glass transition.

It is employed in backplanes and ball grid packages, alongside automotive use.

· Halogen and Lead-free Assembly Materials

You will find Ventec FR-4 materials rid of halogen presence and lead element.

These materials are furnished to maintain the high-performance standards of conventional materials but with safe environmental effects.

They can employ cured organic elements to produce environmentally safe substrates with remarkable material properties.

Some of the outstanding properties include a high glass transition temperature alongside a stable coefficient of temperature expansion.

Furthermore, you will find these materials with a high working temperature and impressive index for comparative tracking.

They include; VT-441, VT-447, VT-464G, and VT-481.

· Polyimide Materials

Polyimide materials by Ventec are fashioned from prepregs and laminates with the ability to endure high-temperature conditions.

Ventec polyimides offer performance dependability and are viable for use in extreme applications such as military and space.

You also find these materials do not use bromine elements making them non-hazardous.

A common Ventec polyimide material is the VT-901PP.

The prepreg material for the VT-901PP is impregnated with a fine ceramic compound.

It is also employed as a filler for etched parts in multilayer configurations with heavy copper features.

Application areas include power supplies, engine controls and backplanes.

Why are Arlon Materials commonly Employed in PCB Construction?

Arlon materials are developed for PCB construction by the Arlon Corporation.

These materials are made diverse to include polyimide products, low flow prepregs, epoxy derived products and those with controlled thermal expansion.

These offerings are attached with many highly desired features.

They include:

Arlon PCB Material

• A high temperature of glass transition with some in the excess of 250°C.

With this property, Arlon materials can withstand high-temperature processes such as soldering in the absence of lead.

• A low and consistent coefficient of thermal expansion especially along the z-axis.

The material CTE is especially useful for multilayer board formations with plated through-hole features.

• The temperature of decomposition for Arlon polyimide materials is high at over 350°C which ensures performance stability at elevated temperatures.
• Many Arlon materials can be used in lead-free procedures ensuring their compliance with RoHS directives.

Furthermore, this is done without compromising on performance.

• The Arlon materials are highly resistive to flames and combustion meeting the standard industry obligations.
• Arlon polyimide materials undergo a shorter curing process saving costs with a tempered outcome that prevents crevice formations when drilling.
• The thermal stability of Arlon materials is remarkable allowing their use in high-temperature applications and environments. They also exhibit consistent physical and electrical abilities.

How many Arlon Materials are available for PCB Construction?

You will find many different Arlon materials for different usage.

Arlon materials are employed in PCB constructions for use in high-temperature environments.

They are also found where the need for limited and even flow of resin is desired.

Additionally, Arlon materials are utilized in bonding applications particularly in flex-rigid multilayer formations of polyimides.

The following categories for Arlon materials are available:

· Polyimides

The Arlon materials available in this category are derived from polyimides with different features.

Some are flame retardant while others are filled with ceramic compounds to achieve different performance levels.

They possess high temperature of glass transition and include the 33N, 35N, 85N and 85HP.

· Low Flow Category of Products

These Arlon material offerings encompass polyimide and epoxy-based prepregs with low flow levels.

They can be used for flex-rigid applications and as bonding materials for heat sinks.

You also find some of these products capable of lead-free usage.

The 37N, 47N, 49N and 51N are some of the Arlon materials in this category.

· Epoxy-based Offerings

Epoxy-based Arlon materials are commonly prepared for multilayer circuit boards.

The prepreg formed from epoxy substances can be filled to achieve certain properties.

These materials have a medium temperature of glass transition also finding use as fillers for drilled holes.

Common types are the 44N and 45N.

· Products with Controlled Thermal Expansion

Materials for these products are furnished on woven fibreglass with resin reinforcements or non-woven fibres.

They possess medium glass transition temperatures and low thermal expansion coefficients.

Common products in this category are the 45NK, 55NT and 85NT.

What Material is used in the Rogers PCB?

Roger PCB

The Rogers PCB is fashioned from materials originally developed by the Rogers Corporation that lends it its name.

These materials are applied in the fabrication of PCBs with high-frequency demands.

Furthermore, they provide impressive electrical qualities and signal transmissions.

You find Rogers materials with low signal and dielectric loss accompanied by reduced noise generation.

Moreover, the Rogers materials are available with different dielectric constant values to suit your needs.

The fabrication costs associated with Rogers materials are also low as are their emissions when used in space.

Some of the material options available in the Rogers catalogue include:

· The RO3000 Series

For this series, the laminates are developed by filling polytetrafluoroethylene compounds with fine ceramic substances.

These laminates possess stable physical properties across different dielectric constant values.

Consequently, these materials are highly compatible.

As such, you can use materials in the RO3000 series in PCB designs with multiple layer formations.

Additionally, the coefficient of thermal expansion for these laminates is lower than standard FR-4.

Consequently, Rogers PCBs suffer from little thermal strain caused by mismatched CTEs.

A common application for these materials is in SMT radiofrequency components.

They are also used in power amplifiers and GPS transmitters and receivers.

· The RO4000 Series

The materials in this series are derived from toughened hydrocarbon compounds and ceramic substances.

Their properties are perfect for complex high-frequency circuit designs where impedance control is desired.

Furthermore, you find the RO4000 series materials to be affordable, with processing procedures similar to conventional FR-4 and even without lead.

You can use materials in the RO4000 series for multilayer board formations.

They have a low electrical signal loss and dielectric stability with remarkable electrical properties.

Rogers PCBs with these materials can operate at elevated frequency values and their signal paths provided impedance control.

Furthermore, the RO4000 series materials possess low CTEs ensuring mechanical stability over different temperature values.

Common applications include power amplifiers, sensor and radar technology, telecommunication antennas, satellites, and identification chips using radiofrequency.

What Materials are used in Nelco PCBs?

Nelco PCBs are made from materials fostered by the Nelco organization.

These circuit boards are employed in digital applications where speed is essential.

Materials used to make Nelco PCBs are made in processes free of lead element and designed for boards with several layers.

Consequently, Nelco PCB materials are considered as not harmful to the environment.

Materials used in Nelco PCBs offer impressive thermal performance with remarkable physical qualities.

PCBs made from Nelco materials are employed in backplanes and automotive applications, and telecommunication infrastructure.

Some of the materials used in Nelco PCBs include;

Nelco PCB

• F-529 that is a phenolic prepreg employed as a laminate in internal layers of a PCB.
• E-765 which is a hardened resin-based prepreg.
• E-752 that is an epoxy prepreg developed for applications in harsh environments.
• E-746, an enhanced resin with high mechanical stability amidst elevated thermal environment.
• N4000-6, an FR-4 substrate with a high glass transition temperature and adaptable epoxy.
• N4000-13, which is an improved epoxy with low signal loss and high transfer speed.
• N4350-13 RF, which is a microwave material with reinforced epoxy.
• NH9000 that consists of a woven glass fibre material reinforced with PTFE.
• N4000-6NF, a no-flow amenable epoxy with a fast cure rate and high Tg.

What advantages of Bergquist PCB Materials?

The Bergquist PCB is a PCB that employs thermal cladding in its fabrication process.

The thermal clad Bergquist PCB is rigged to achieve high-temperature values and light intensity or mixed-use.

To achieve better performance, the dielectric layer of the Bergquist PCB is tweaked.

Materials used include HT-04503, MP-06503, and HT-07006.

Bergquist PCB material

You find the conductive layers are electrically isolated ensuring efficient thermal dissipation while the bottom film is attached with metal.

With this arrangement, the system temperature is kept low and results in a bright output in LED applications.

Other applications are as a spark instigator in motorcycles, audio boxes, power supplies and shields guards.

The following benefits are derived from using Bergquist material:

• You achieve low working temperatures when using Bergquist PCB materials and consequently achieve better durability of the circuit board. A reason for this is the better efficiency in thermal management.
• With the Bergquist PCB materials, the power output is augmented while the material physical properties are stable.
• These materials are highly resistant to combustion with a low coefficient of thermal expansion that ensures the physical dimensions are unchanged.
• You will realize the need for interlayer connections in Bergquist PCBs for thermal transfer is reduced due to the cladding. Furthermore, this ensures the overall circuit board size is reduced.
• The temperature values recorded at the junction are lower than is usual for standard boards of the same construction. Moreover, thermal-induced impedance is reduced in the Bergquist PCB.

What Material is used in the Fabrication of Teflon PCBs?

Teflon is a trademark name for polytetrafluoroethylene (PTFE) that is credited to the DuPont Company.

It is based on polymers of fluorocarbon base and possesses unique qualities that allow for its use in specialized functions.

Teflon PCB

For instance, it can tolerate elevated temperatures reaching over 260^oC.

You find PTFE offers better performance at high-frequency values than the FR-4 laminate.

With PTFE material, there is lower signal displacement thanks to the low values of dielectric constant compared to FR-4.

Additionally, PTFE materials possess higher temperatures of transition and decomposition.

PTFE has a high molecular count that gives it impressive physical strength.

The material has low reactivity to chemical infringements and is not prone to combustion.

It is stable at different temperatures while providing resistance to external elements.

You find PTFEs with high electronegativity offering insulation from electrical charges and heat.

However, PTFE is costly and need careful handling to prevent tearing and scratching.

As such, you will need focused strategies to make interlayer connections through drilling procedures.

Use of PTFE is common in telecommunication infrastructure.

What High Performance Materials are used in Taconic PCBs?

Taconic PCBs are manufactured from materials developed by the Taconic Corporation.

These materials possess varied physical, thermal and electrical properties that allow the achievement of high-performance levels.

You find these materials are based on polytetrafluoroethylene, fine ceramic substances and glass.

Some notable Taconic materials are:

Taconic PCB

• CER-10: An organic-ceramic filled glass fibre with PTFE and a dielectric constant value of ten.
• RF series: Encompasses materials of organic and ceramic nature and fibreglass to make laminates with high-performance standards.
• TF-260, TF-290: These materials are thin and very reliable, employing flexible materials for interconnection with reduced loss.
• TLC family: These materials are derived from PTFE and glass with the resultant laminates capable of various microwave functions.
• TLG product category: The material offerings here are made free of bromine element and are classified as high performance.
• TLT product range: The electrical properties of these materials, especially dielectrics, are impressive, and so are their thermal and electrical features.
• TLY series: Fiberglass of the woven kind is used for these materials with combinations of PTFE in its structure.
• TPG family: Materials in this category are furnished from similar laminates and employed for data transfer where speed is essential.
• TSM-30: This material type has a reduced moisture content absorption rate with a loss tangent that is minimal.

At Venture Electronics, we help you choose the most suitable PCB materials for all your applications.

Contact us today for all your PCB materials needs.