Wangling High Frequency Laminates
Wangling F4B Series features PTFE-based laminates engineered for RF and microwave PCBs. Combining stable dielectric performance with low-loss options, they support high-reliability antennas, radar, and satellite communications.
Key Features of Wangling High Frequency Laminates
Wangling is a leading manufacturer of high-performance, high-frequency copper-clad laminates (CCL) in China. For RF engineers seeking reliable supply chain localization, Wangling delivers electrical performance and thermal reliability on par with top-tier global brands—while offering superior cost efficiency.
Wangling high frequency laminates are developed to support reliable RF and microwave PCB performance. The material system combines low-loss dielectric properties, stable electrical performance, and processing consistency for high-frequency circuit applications.
Low Dielectric Loss
Df values range from 0.0009 to 0.0025 across the featured product families, supporting RF, microwave, and antenna circuit designs where signal loss control is an important material consideration.
Stable Dielectric Constant
Selectable Dk values from 2.17 to 10.20 provide material options for different impedance, circuit size and high-frequency PCB design requirements.
Low Moisture Absorption
Water absorption is rated at ≤0.08% for F4BM / F4BME models and 0.02% – 0.10% for F4BTMS models, supporting material stability in operating environments where moisture control is required.
Excellent Thermal Reliability
The featured product data includes thermal stress performance at 260°C for 10 seconds, repeated 3 times, with no delamination. Long-term usability is listed from -55°C to +260°C.
Multilayer RF PCB Structures
Wangling high frequency laminates can be used in multilayer RF PCB stack-ups where controlled dielectric behavior, copper foil selection and laminate consistency are important for circuit performance.
Stable Processing Performance
The product data includes copper peel strength, electrical strength, breakdown voltage and flame resistance values, providing reference information for PCB fabrication, lamination and downstream processing evaluation.
Common Applications
Wangling high frequency laminates are used in RF and microwave PCB applications where stable dielectric performance, low signal loss and material reliability are required. The product family supports a range of commercial and industrial high-frequency electronic applications.
5G Communication
Used in high-frequency communication equipment, RF modules and related PCB designs for 5G infrastructure and wireless connectivity.
RF Antennas
Suitable for antenna PCB structures where controlled dielectric properties and stable signal transmission are important.
Microwave Circuits
Applied in microwave circuit boards, signal transmission modules and high-frequency circuit layouts.
Radar Systems
Used in radar-related PCB designs that require low-loss materials and stable electrical performance at high frequencies.
Industrial RF Equipment
Used in industrial RF devices, high-frequency electronic equipment and specialized microwave applications.
Satellite Communication
Suitable for satellite communication modules, ground terminals, antenna systems and other high-frequency communication equipment.
Automotive Radar
Applied in automotive radar PCB designs where material stability and high-frequency performance are key design considerations.
Primary Product Series Include
the F4B, F4BTMS, TFA, and the WL-CT Hydrocarbon Ceramic Series
F4B Series Overview
The Wangling F4B Series is a family of PTFE-based high frequency copper clad laminates developed for RF and microwave PCB applications. The series includes F4BM, F4BME, F4BTM, and F4BTME product families, providing material options with different dielectric compositions, dielectric constant (Dk) values, and dissipation factor (Df) ranges for high-frequency circuit designs.
PTFE-Based Laminate Structure
F4B Series laminates are based on PTFE material systems and are designed for high-frequency PCB applications. The product family includes PTFE reinforced with fiberglass cloth, as well as PTFE combined with ceramic and fiberglass cloth structures. These material constructions provide different dielectric constant options for RF and microwave circuit requirements.
RF & Microwave Design Focus
The F4B Series is designed for RF and microwave PCB designs where dielectric stability, low signal loss, and reliable processing performance are important. These laminates can be used in high-frequency circuits such as RF antennas, microwave modules, communication equipment, radar-related circuits, satellite communication modules, and industrial RF devices.
Selectable Dk Options
The F4B product family provides selectable dielectric constant options from 2.17 to 3.5, depending on the product model and material composition. F4BM and F4BME products use PTFE with fiberglass cloth, while F4BTM and F4BTME products use PTFE with ceramic and fiberglass cloth. This allows the series to support different impedance, circuit size, and high-frequency design requirements.
F4B Series Product Models
The F4B Series includes F4BM, F4BME, F4BTM and F4BTME product families. These models cover PTFE fiberglass cloth laminates and ceramic-filled PTFE fiberglass cloth laminates for RF and microwave PCB applications.
Featured Models:
F4BM217
PTFE fiberglass cloth laminate with a nominal Dk of 2.17, suitable for low-Dk RF and microwave circuit designs.
F4BM220
PTFE fiberglass cloth laminate with a nominal Dk of 2.20, used for antenna circuits, microwave modules and communication PCB applications.
F4BM255
PTFE fiberglass cloth laminate with a nominal Dk of 2.55, providing an additional Dk option for high-frequency PCB designs.
F4B Series vs. Rogers Material vs.Taconic Material
| Material Model | Dielectric Composition | DK | DF | Rogers Material Model Number | Taconic / AGC Material Model Number | |
|---|---|---|---|---|---|---|
| F4B Series | F4BM / F4BME | PTFE + fiberglass cloth | 2.17–3.0 available |
0.001–0.002 | cuclad217, cuclad233, cuclad250, diclad880, diclad870, diclad527 | TLY-3, TLA-6, TLX-0, TLX-9, TLX-8, TLX-7, TLX-6 |
| F4BTM / F4BTME | PTFE + ceramic + fiberglass cloth | 2.98–3.5 available |
0.0015–0.0025 | AD300D, AD350A | RF-30, RF-35, TLC-30, TLC-32, TLC-338, TLC-35 | |
| F4BTMS Series | F4BTMS220 | PTFE + ultra-thin ultra-fine glass fiber | 2.20 | 0.0009 | cuclad217, diclad880 | TLY-5（A） |
F4B Series vs. Other China Local Brand RF Materials
| Material Model | Dielectric Composition | DK | DF | RELONG | SHENGYI | GUONENG | FSD | |
|---|---|---|---|---|---|---|---|---|
| F4B Series | F4BM / F4BME | PTFE + fiberglass cloth | 2.17–3.0 available |
0.001–0.002 | R217, R220, R233, RD250, RD260 | SCGA-500 series, SG5 series | GNA series | FSD2 series |
| F4BTM / F4BTME | PTFE + ceramic + fiberglass cloth | 2.98–3.5 available |
0.0015–0.0025 | RC250B, RC255B, RC260, RC300E, RC300B, RC320, RC350 | SG3 series | GNC300M (DK 3.0) |
FSD320N, FSD338N, FSD350N, FSD350NA, FSD360 | |
The F4B series has become a go-to substrate for passive components (such as power dividers, couplers, and filters) in China, delivering up to a 50% cost reduction compared to traditional Western alternatives. Additionally, the F4B/F4BM series is widely adopted in high-volume consumer microwave applications, including video transmission antennas, data-rate RF modules, and commercial walkie-talkie antennas.
F4BTMS Series Overview
The F4BTMS Series is a PTFE-based high frequency laminate family designed for RF and microwave PCB applications. Compared with the general F4B product family, F4BTMS focuses on ultra-thin, ultra-fine glass fiber and ceramic-filled PTFE material structures, providing a wider range of dielectric constant options for different high-frequency circuit designs.
PTFE-Based Structure with Ultra-Fine Glass Fiber
F4BTMS materials use PTFE combined with ultra-thin ultra-fine glass fiber. Selected models also use ceramic-filled PTFE with ultra-thin ultra-fine glass fiber to support different dielectric constant requirements.
Designed for High-Frequency PCB Applications
The F4BTMS Series is developed for RF and microwave PCB designs where low dielectric loss, stable Dk performance and material consistency are important. Typical applications include RF antennas, microwave circuits, radar systems, satellite communication, communication equipment and industrial RF devices.
Wide Dk Range Selection
The F4BTMS Series provides selectable Dk values from 2.20 to 10.20, with listed Df values from 0.0009 to 0.0023, depending on the product model and test conditions. This allows the series to support both low-Dk and high-Dk high-frequency PCB design requirements.
F4BTMS Series Product Models
The F4BTMS Series includes multiple PTFE-based high frequency laminate models with selectable Dk values from 2.20 to 10.20. For this product page, the featured models include F4BTMS220, F4BTMS233 and F4BTMS255.
Featured Models
F4BTMS220
PTFE with ultra-thin ultra-fine glass fiber high frequency laminate with a nominal Dk of 2.20 and listed Df of 0.0009.
F4BTMS233
PTFE with ultra-thin ultra-fine glass fiber high frequency laminate with a nominal Dk of 2.33 and listed Df of 0.0010.
F4BTMS255
Ceramic-filled PTFE with ultra-thin ultra-fine glass fiber high frequency laminate with a nominal Dk of 2.55 and listed Df of 0.0011.
F4BTMS Series vs. Rogers Material vs.Taconic Material
| Material Model | Dielectric Composition | DK | DF | Rogers Material Model Number | Taconic / AGC Material Model Number | |
|---|---|---|---|---|---|---|
| F4BTMS Series | F4BTMS220 | PTFE + ultra-thin ultra-fine glass fiber | 2.20 | 0.0009 | cuclad217, diclad880 | TLY-5 (A) |
| F4BTMS233 | 2.33 | 0.0010 | cuclad50, diclad870 | TLY-3 | ||
| F4BTMS255 | Ceramic + PTFE + ultra-thin ultra-fine glass fiber | 2.55 | 0.0011 | AD255(C) | / | |
| F4BTMS265 | 2.65 | 0.0012 | / | TLA-6 | ||
| F4BTMS294 | 2.94 | 0.0012 | CLTE-XT | TSM-DS3M | ||
| F4BTMS300 | 3.00 | 0.0013 | CLTE, CLTE-AT | TSM-DS3, RF-30A | ||
| F4BTMS350 | 3.50 | 0.0018 | AD350A | RF-35A2, TLF-35A | ||
| F4BTMS430 | 4.30 | 0.0019 | / | TRF / RF-43 | ||
| F4BTMS450 | 4.50 | 0.0020 | AD450 | TRF / RF-45 | ||
| F4BTMS615 | 6.15 | 0.0023 | AD600 | RF-60A | ||
| F4BTMS1000 | 10.20 | 0.0023 | AD1000 | RF-10, CER-10 | ||
F4BTMS Series vs. Other China Local Brand RF Materials
| Material Model | Dielectric Composition | DK | DF | RELONG | SHENGYI | GUONENG | FSD | |
|---|---|---|---|---|---|---|---|---|
| F4BTMS Series | F4BTMS220 | PTFE + ultra-thin ultra-fine glass fiber | 2.20 | 0.0009 | RN217, RP200 | SG7220 | GNA220G | — |
| F4BTMS233 | 2.33 | 0.0010 | RN233, RP233 | — | GNA233G | — | ||
| F4BTMS255 | Ceramic + PTFE + ultra-thin ultra-fine glass fiber | 2.55 | 0.0011 | — | — | — | — | |
| F4BTMS265 | 2.65 | 0.0012 | — | — | — | — | ||
| F4BTMS294 | 2.94 | 0.0012 | RA300, RS300, RA300L | SG7294 | GNC3004 | — | ||
| F4BTMS300 | 3.00 | 0.0013 | RG300 | — | GNC3008 | FSD300NB | ||
| F4BTMS350 | 3.50 | 0.0018 | — | — | — | FSD300NA, FSD300N | ||
| F4BTMS430 | 4.30 | 0.0019 | — | — | — | — | ||
| F4BTMS450 | 4.50 | 0.0020 | RC450 | — | — | FSD450NT | ||
| F4BTMS615 | 6.15 | 0.0023 | RC615 | — | — | — | ||
| F4BTMS1000 | 10.20 | 0.0023 | RC1000, RA1000 | — | — | FSD1020NT | ||
The F4BTMS series is actively mass-produced for the RF boards of front collision-avoidance radar systems in passenger vehicles in China. It meets stringent automotive reliability standards while cutting substrate costs by 50% compared to imported Western materials.
TFA series and WL-CT Series Overview
The TFA series features a ceramic-filled PTFE resin matrix. Instead of conventional woven-glass cloth impregnation, these substrates are manufactured via a proprietary prepreg formulation and a specialized lamination cycle. The result is an aerospace-grade, high-frequency material that delivers exceptional electrical, thermal, and mechanical uniformity across identical dielectric constant (Dk) ratings.
The WL-CT series is a thermosetting high-frequency laminate composed of a hydrocarbon resin, ceramic filler, and fiberglass reinforcement. It provides the low-loss electrical performance required for advanced RF designs while offering drop-in FR4-compatible processability—making it significantly easier and more cost-effective to drill, plate, and machine than traditional PTFE materials.
| TFA Series Product Features： | WL-CT Series Product Features： |
|---|---|
| ◈ Small dielectric constant tolerance and excellent batch-to-batch consistency; | ◈ Low dielectric constant tolerance and low loss; |
| ◈ Lowest dielectric loss in its class; | ◈ Hydrocarbon ceramic thermosetting resin system with better PCB processability and heat resistance; |
| ◈ The frequency of use is up to 77G for millimeter wave and automotive radar applications; | ◈ Excellent temperature characteristics of dielectric constant with low variation with temperature; |
| ◈ Excellent frequency stability and phase stability from -55°C to 150°C; | ◈ X/Y-axis CTE matched to copper foil; low Z-axis CTE ensuring dimensional thermal stability and plated through-hole reliability. |
| ◈ Excellent irradiation resistance, maintaining stable dielectric and physical properties after dose irradiation treatment; | ◈ High TG value greater than 280℃, maintaining dimensional stability and hole copper quality at high temperature; |
| ◈ Low outgassing performance validated per standard vacuum volatility test methods, compliant with aerospace vacuum outgassing requirements. | ◈ High thermal conductivity, better than thermoplastic materials in the same class, suitable for high-power applications; |
| ◈ CTE closely matched to copper foil, ensuring plated through-hole reliability and dimensional stability under thermal cycling. | ◈ Commercial, high-volume, cost-effective products; |
| ◈ Low water absorption, ensuring the stability of the material under humid environment; | ◈ Excellent irradiation resistance, maintaining stable dielectric properties and physical properties after dose irradiation treatment. |
| ◈ According to customer's requirements, we can add fiberglass cloth to enhance the strength appropriately. | ◈Low outgassing performance, validated per standard vacuum volatility test methods, compliant with aerospace outgassing requirements. |
TFA Series and WL-CT Series vs. Rogers Material vs. Taconic/AGC Material
| Material model | Dielectric composition | DK | DF | Rogers material model number |
Taconic/AGC material model number |
|
|---|---|---|---|---|---|---|
TFA Series |
TFA294 | PTFE+ceramic |
2.94 | 0.0010 | RT6002 | / |
| TFA300 | 3.00 | 0.0010 | RO3003 | NF30 | ||
| TFA615 | 6.15 | 0.0022 | RT6006, RO3006 | / | ||
| TFA1020 | 10.20 | 0.0025 | RT6010.2LM, RO3010 | / | ||
WL-CT Series |
WL-CT300 | Hydrocarbon+ ceramic+ fiberglass cloth |
3.00 | 0.0030 | RO4730G3 | HF-300F |
| WL-CT330 | 3.30 | 0.0026 | RO4533 | HF-330 | ||
| WL-CT338 | 3.38 | 0.0029 | RO4003C | HF-340 | ||
| WL-CT350 | 3.48 | 0.0040 | RO4350B | HF-350F | ||
| WL-CT440 | 4.40 | 0.0050 | KAPPA438 | / | ||
| WL-CT615 | 6.15 | 0.0040 | RO4360G2 | / | ||
TFA Series and WL-CT Series vs. Other China Local brand RF Materials
| Material model | Dielectric composition | DK | DF | RELONG | SHENGYI | GUONENG | FSD | |
|---|---|---|---|---|---|---|---|---|
TFA Series |
TFA294 | PTFE+fiberglass cloth |
2.94 | 0.001 | ||||
| TFA300 | 3 | 0.001 | SG7300N mmWave77 |
GNC3003 | FSD300GR | |||
| TFA615 | 6.15 | 0.0022 | SG7615D | GNC3006 | FSD615G FSD615NT |
|||
| TFA1020 | 10.2 | 0.0025 | GNC3010 | FSD1020GR | ||||
WL-CT Series |
WL-CT300 | Hydrocarbon+ceramic +fiberglass cloth |
3 | 0.003 | AeroWave300 | GNH300 | FSD886T | |
| WL-CT330 | 3.3 | 0.0026 | LNB33 | GNH330 | ||||
| WL-CT338 | 3.38 | 0.0029 | FSD883T | |||||
| WL-CT350 | 3.48 | 0.004 | S7136D, S7136H (Low DK) | GNH350 | FSD888T | |||
| WL-CT440 | 4.4 | 0.005 | FSD450T | |||||
| WL-CT615 | 6.15 | 0.004 | FSD615T | |||||
WL-CT300 is widely used in mass production for portable satellite terminal feed networks. It supports standard FR4 multilayer PCB processing, reducing manufacturing costs by 35% compared with PTFE materials. In 77GHz automotive radar applications, the combination of F4BTMS (antenna layer) and WL-CT (PA base layer) has achieved mass production in domestic passenger vehicles, replacing imported RO3003 substrates with localized solutions. The WL-CT series is also broadly adopted in IoT applications, including LoRa base station omnidirectional antennas and outdoor industrial antennas.
The high-dielectric TFA615 laminate is applied in compact satellite filter modules, reducing component size by 40% and enabling mass production of lightweight terminal devices.
Other Wangling High Frequency Material Series
F4BXW Series
Low-loss PTFE short glass fiber composite substrates for microwave circuit applications.
F4BTD Series
High thermal conductivity PTFE ceramic-filled laminates for high-power RF and microwave applications.
WL-PP Series
Bonding films and prepregs for multilayer RF PCB lamination and stack-up structures.
Composite Dielectric Laminate Series
Composite dielectric laminate options for customized RF and microwave PCB material requirements.
Frequently Asked Questions
Material selection should be based on your design’s target frequency, impedance requirements, dielectric constant (Dk), dissipation factor (Df), laminate thickness, copper type, circuit structure, and processing conditions.
Wangling high frequency laminates are used in RF and microwave PCB applications, including 5G communication, RF antennas, microwave circuits, radar systems, satellite communication, automotive radar and industrial RF equipment.
Yes. F4B and F4BTMS materials are designed to be used in multilayer RF PCB stack-ups where dielectric stability, low signal loss, and reliable lamination and processing performance are important design considerations.
The featured F4B and F4BTMS product families provide selectable Dk values ranging from 2.17 to 10.20, depending on the specific product model and material composition.
Yes. Available material configurations include a range of laminate thicknesses, copper foil types (such as standard electrodeposited copper, reverse treated foil, etc.), and copper thicknesses. Specific options should be confirmed based on the product model and project requirements.
The reference and comparison tables are provided as a general guide for preliminary material comparison based on dielectric composition, Dk, and Df values. Final material selection and verification should be confirmed according to the actual application requirements, datasheet values, PCB processing conditions, and customer validation.
Customers can contact Wangling with the required product model, Dk value, laminate thickness, copper specification, panel size and estimated quantity. The Wangling team can provide datasheet information, sample support and lead time details based on the request.