High-Quality Arlon Materials
- Over 10 years’ experience
- Reliable Arlon materials supplier in China
- Excellent quality Arlon materials
- Competitive rates
Arlon PCB Manufacturing Service
Venture can provide the manufacture of Arlon Materials circuit boards. Arlon PCB specializes in thermoset resin processes,
including polyimide, high Tg and other multifunctional epoxies and low loss thermoset laminates and prepreg sheets.
Arlon PCB applications often require exceptional electrical, thermal, mechanical, or other performance characteristics beyond standard FR-4 materials in advanced commercial and military electronics such as avionics, semiconductor testing, heat sink bonding, High Density Interconnect (HDI) and Microvia PCBs.
Is Arlon materials Costly?
The cost of Arlon materials will vary based on factors such as lamination type, material type, stability, and its properties.
Arlon materials are inexpensive for high frequency printed circuit boards, priced between $30 and $60 per piece.
As a leading manufacturer and provider, Venture is your best Arlon materials PCB supplier, we are a reliable manufacturer of different kinds of Arlon materials in China. We have low cost price, high quality and professional after-sales.
Types and Features of Arlon Materials
Arlon materials include the following:
Similar to Arlon 33N, a flame retardant polyimide with a glass transition temperature of 250 degrees Celsius. Mainly used to fill clearance holes connecting through-hole components, especially in metal core printed wiring boards. As such, it finds application in improved thermal conductivity, minimal resin shrinkage, and crack resistance.
The glass transition temperature of the high temperature polyimide material is 250 degrees Celsius, and the water absorption rate is 0.27. It is mainly used for multi-layer boards with high layers, with thermal stability and reliability, and is mostly used in aerospace, military and other electronic industries.
Venture Arlon Materials
Venture is a leading manufacturer of popular PCB materials for high-frequency PCB such as Arlon materials. We can manufacture different kinds of Venture Arlon materials. No matter what you need for your project, we can provide Arlon TC350 and Arlon 85n.
Venture Arlon materials are widely used in a wide variety of printed circuit board applications. These applications require laminates with specialized thermal, electrical, mechanical, or other performance characteristics that exceed standard FR-4 materials.
We manufacture different specifications for Arlon materials like AD255 C03099, AD255 C06099, AD255 C04099, AD300 C03099, TC600, AD250 C02055C, and many more.
Venture: Your Leading Arlon Material Supplier in China
Are you looking for high-quality Arlon materials for your PCB design? You’ve come to the right place! Venture is more than 10 years in providing Arlon materials to different industries throughout the world.
Venture Arlon materials are manufactured in thermoset resin technology such as high Tg multifunctional epoxy, polyimide, and prepreg systems and low loss thermoset laminate.
We manufacture Arlon materials for different industrial applications:
- advanced commercial
- military electronics ( avionics, heat sink bonding, semiconductor testing)
- high density interconnect (HDI)
- microvia PCBs in mobile communications products
Moreover, Arlon materials from Venture specialize in ceramic-filled fluoropolymers, fluoropolymers (PTFE), and low loss ceramic hydrocarbon thermoset laminates. It delivers the electrical performance needed in frequency-dependent circuit applications like phased-array radars, base station antennas, communication systems, power amplifier boards, and other antenna applications.
Venture has a full range of complete Arlon materials in stock to meet your standard applications. We know that there are many options when it comes to Arlon materials for your PCB.
We can help you select the best Arlon materials and as well as Arlon material specifications during your design stage.
Please feel free to contact us today for more info!
Arlon Material: The Ultimate FAQ Guide
A reason why this guide will help you choose high performance Arlon material for PCB.
First, I will begin by comparing Arlon with other PCB materials in the industry.
Then, the focus will shift to various performance variables and specifications of Arlon PCB material.
Let’s dive right in.
How Does Arlon Material Compare to other PCB Materials?
Before choosing any printed circuit board material, you should know the following.
Arlon PCB material
Rogers material and Arlon material are both suitable for the fabrication of high-frequency PCBs.
However, the majority of Arlon materials are PTFT reinforced fiberglass.
On the other hand, Rogers material primarily constitute woven glass reinforced hydrocarbon or ceramics.
Both Arlon and Nelco PCB materials utilize polyimide resin with a glass transition temperature of approximately 260°C.
You can use both materials to fabricate PCBs for use in high-speed applications.
They also possess excellent thermal management and physical properties.
You can get materials with low dielectric constant and dissipation factor for both Arlon and Nelco materials.
Both Arlon and Taconic materials primarily rely on PTFT reinforced with different materials to construct their PCBs.
Similarly, you can use both materials in the construction of high-frequency PCBs.
This is because they have product grades with very low dielectric constants and loss tangent.
Isola PCB primarily produces FR-4 laminates constituting glass fibre epoxy laminate that is fire-retardant.
Similarly, Arlon PCB also uses Epoxy materials treated with fire retardant compounds.
In both cases, you can acquire materials with excellent dimensional stability and low CTE for the fabrication of high-frequency PCBs.
They are suitable for high-temperature applications.
What Are the Benefits of Using Arlon Material for PCB?
Arlon materials possess multiple benefits which makes it desirable for use in fabrication of a PCB.
They include but not limited to:
- Highly uniform electrical properties across frequencies
- Consistent and robust mechanical performance
- Excellent chemical resistance
- Superior dimensional stability
- Ideal for circuits that are sensitive to Er
- Low tangent loss
- The dielectric constant and dissipation factor are thermally stable
- Low insertion loss
- Has higher antenna efficiency
- Has reduced edge trim waste
- Superior copper bond strength
- Low moisture absorption
- Superior signal integrity
- Ideal for use in a humid environment
- Board processing and board layout is cost-effective
Are Arlon Materials High-Performance Materials?
By standards of classification, you can consider Arlon PCB material as a high-performance material.
Specifically, a high-performance material is a PCB material or laminate that can achieve functions beyond the capabilities of traditional FR-4 material.
Consequently, you will use a high-performance material for:
- Fabrication of PCBs suitable for high thermal applications
- Fabrication of PCBs for use in high-speed digital systems.
These boards will require materials with enhanced electrical features because they are always complex to manufacture.
- Fabrication of PCBs with Controlled Thermal Expansion
- Fabrication of PCBs requiring special electrical features such as controlled impedance
- Fabrication of PCBs for use on RF/microwave frequencies.
These are high-frequency PCBs and usually require fabrication materials with low dielectric constant and loss.
- Construction of PCBs with High-Density Interconnection (HDI).
Consequently, you will be able to laser-drill Arlon material, which is a pre-requisite for HDI PCBs, to form surface micro vias to layers 2 and 3.
What is an Arlon Laminate?
Arlon PCB laminate is a composite made up of either a single or several layers of copper and Prepreg.
Copper cladding can either be on one side or both sides, and the layers require heat and pressure to stabilize them into the final product.
What Classes of Arlon Laminates Are There?
Generic laminate classification, especially for E-glass reinforced laminates, depends on the type of resins used for fabrication.
Such include epoxy, polyimides etc.
Alternatively, you can also classify laminates about the type of resin and reinforcement used—for example, Polyimide-Kevlar, Epoxy-Kevlar, Copper-Invar-Copper, etc.
Specific to Arlon materials, you can get the following laminates:
· DiClad Laminate
These laminates constitute a composite material of PTFT and fibreglass.
You can vary the ratios of PTFT and fibreglass to acquire a laminate that offers a wide range of properties.
Consequently, you can construct a PCB substrate with the lowest dissipation factor and dielectric constant.
Similarly, varying the constituent ratios will also enable you to build a Diclad laminate, which is highly reinforced and has higher dimensional stability.
This laminate uses a woven fibreglass reinforcement which offers superior dimensional strength and uniform dielectric constant.
Characteristically, DiClad laminates have very low-loss tangent, consistent product performance and excellent dimensional stability.
DiClad laminates offer consistent mechanical performance, uniform electrical properties across frequencies and excellent chemical resistance.
DiClad Arlon laminates are ideal for fabricating PCBs used in applications demanding uniform dielectric constants such as couplers, filters, and low noise amplifiers.
· CuClad Laminates
Similarly, CuClad laminates are woven fibreglass or PTFT composite material.
You can produce substrates with a wide range of choices, depending on the proportion of PTFT and fibreglass.
The main differences with other types of laminates come in the lamination of CuClad material. Also, the laminates are cross plied.
That is, placement of alternating layers of coated fibreglass at a right angle to each other cross playing offers true mechanical and electrical isotropy in the XY plane.
CuClad laminates have a higher PTFT to glass ratio.
You will use this laminate when dealing with applications that are highly sensitive to dielectric constant.
There are three main types of CuClad laminates.
- CuClad 217
- CuClad 233
- CuClad 250
Arlon produces these types of laminates by combining nonwoven fibreglass and PTFT.
It is ideal for applications requiring bending the final circuits to fit a specific shape.
It offers superior uniformity of the dielectric constant and dimensional stability by using a proprietary process and long random fibres.
Consequently, the resulting products provide an extremely low loss, high isotropic in X, Y and Z directions.
Furthermore, IsoCladis less rigid compared to fibreglass.
This product is PTFT based, filled with ceramic powder and reinforced with woven micro fibreglass to produce a laminate with low water absorption.
The production follows the Arlon proprietary process to deliver a highly stable product with reduced thermal expansion on the Z-direction.
The material combination helps reduce changes in dielectric constant as a result of the second-order phase transition temperature at 19°C.
The stabilization of dielectric constant ease the circuit design and enhances product performance.
You can use this product permits the use of higher power because it has a high thermal conductivity which enhances the rate of heat dissipation.
It also provides lower loss tangent, which is common with PTFT based products.
· AD260A Laminate
It is a low cost, low loss, Arlon laminate fabricated from woven fibreglass reinforced PTFT filled ceramic composite.
It has the following features and benefits:
- Low dielectric constant and loss
- Low Er thermal coefficient
- Low CTE on the Z-direction
- Large antenna formats and higher efficiencies
- Low insertion loss
- More boards per panel
· AD 300A
The product constitutes woven fibreglass reinforced with PTFT and Microfine ceramics composites.
You can improve the electrical performance of this material without any additional cost, typical with higher performance by using advance material.
It has low insertion and dielectric loss, low moisture absorption and perfect copper bond strength
Similar to the predecessor, it is comprised of a woven fibreglass reinforced PTTFT and Microfine Ceramics.
It has a higher dielectric constant of 3.20 compared to the dielectric constant of AD3OOA, which is 3.00.
What Factors Determine the Thickness of Arlon Laminates?
PCB Thickness Laminate
The thickness of the Arlon laminate depends on the type and number of constituent prepreg layers.
You can mathematically determine the thickness of each coated fabric style by calculating individual weight and density of the resins and that of the fabric.
To accurately determine the laminate thickness, you should calculate the total weight of the fabric since it can vary by upto 5% from one roll to the other.
You can use a single fabric to achieve different finished weights as a result of applying varying levels of resins.
When you ply these coated fabrics, you will produce a laminate with different thickness.
You can use an infinite variety of methods to build up a laminate when it is 0.020“ and above.
You should select a cost-efficient process, that is, produce a laminate with desired properties and thickness at the lowest cost.
Even though you can determine a rough estimate of buildup thickness when using common prepregs, the final thickness will depend on resin content and processing.
What Applications Require the Use of Arlon Material?
You can use Arlon materials in a wide range of applications. Some of these applications include:
- Digital Radio Antennas
- Military Radar Feed Networks and other electronics
- Low loss antennas for base stations
- Commercial phased array networks and other phase-sensitive electronic structures
- LNAs, couplers, and filters and other microwave components
- Missile guidance systems
- Circuits for stripline and Microstrips
- Conformal antennas
- Space and satellite electronics
- Digital audio broadcasting antennas
- Electronic surveillance structures
- Antennas for GPS and RFID
- Multimedia transmission systems
- Amplifiers for power, tower mounted, and tower-mounted boosters, etc.
What Factors Should You Consider When Selecting an Ideal Arlon Material for Your PCB Application?
The choice of the most suitable Arlon material depends on your system requirement and not on a standard set of laminate properties.
For instance, a material that you will consider ideal for a high-speed digital application may not be ideal for high-temperature application.
Consequently, you can only consider the following properties.
They are potentially significant depending on the kind of application you want to use it on.
i. Glass Transition Temperature (Tg)
This property indicates the potential of Z-axis expansion and hence its reliability for plated through-hole.
Arlon materials constructed using polyimides such as 35N and 85N have the highest glass transition temperature, usually 250°C and above.
The Tg represents the period a laminate will remain stable at a particular temperature before it starts blistering.
It is a prime indicator on the properties of traditional materials such as polyimides and epoxy.
However, you should use it considerably when selecting non-traditional resin or highly filled systems.
This is because it may give you skewed results on reliability characteristics.
Usually, the properties of these materials also rely on other components composites.
ii. Thermal Decomposition Temperature (Tg)
It is the temperature at which your Arlon material will start degrading thermally.
Consequently, the decomposition temperature of Arlon materials significantly varies with the chemical compositions of the products.
For instance, the majority of epoxy materials have a Tg range from mid-300°C while you will get a handful of polyimides materials with a Tg range of above 400°C.
You will also find some datasheets indicating Tg as the temperature at which the material lost 5% of its original weight as a result of decomposition.
In essence, the onset temperature of any significant weight loss would be a better indicator since the material might be already rendered useless at 5% weight loss.
iii. Dielectric Constant and Loss Tangent
The dielectric constant of Arlon material will indicate the speed of electrical signal across the surface of a dielectric Arlon material.
On the other hand, loss tangent measure the amount of signal power lost as the signal passes through a transmission line.
The dielectric constant greatly varies to the type of material, test method and the test frequency.
Thus referred to as the relative dielectric constant.
The nature of your application and the loss characteristics under its operating conditions will determine your desired dielectric constant.
For example, you should select modified epoxy materials that have a dielectric constant between 3.0 and 3.5 for use in high-speed digital applications.
In contrast, you should select pure PTFT on a fibreglass substrate for RF and microwave applications.
This is because it has a very low Dk of 2.1 and loss of 0.0009.
iv. Coefficient of Thermal Expansion
You should match the CTE of your Arlon material with the cladding’s expansion, and surface mounted device and interior buried thermal planes.
Currently, using a material with 6.0 ppm/ °C offers superior features in the case of leadless ceramic chips.
Consequently, you can use Arlon’s 45NK laminate reinforced with woven Kevlar has very low resin contents, and its CTE is very close to 6.0.
You can also use Copper-Inver-Copper, quartz reinforced, and nonwoven aramid-reinforced offers CTE between 9 to 11.
v. Thermal Conductivity
The thermal conductivity of the PCB material you select should be high enough to prevent heat buildup on surface mounted devices.
However, the thermal conductivity of the material should not compromise the dielectric and electrical properties.
Material that can significantly reduce surface temperatures of mounted devices lie in the range of 1.0 to 3.0 W/m-K.
Henceforth, you can select from a wide range of Arlon materials such as 91ML, 92 ML, TC350 or TC600.
vi. Expansion in the Z-direction
You should choose a material that has a thermal expansion close to that of copper, which is 17 ppm/°C.
This will help you prevent potential damage to the pleated through-hole when subjected to thermal excursion processes.
vii. Lead-Free Compatibility
The material of choice should be able to withstand higher reflow and soldering temperatures in lead-free solder systems.
Such materials always have a higher transitional temperature, usually more than 155°C t and an average CTE of below 3.5%.
Polyimide based laminates are always lead-free compliant.
However, you have to confirm whether the newer generations of epoxy materials have manufactured following lead-free standards.
viii. Copper Anodic Filament (CAF) Resistance
You should carefully look into the CAF resisting capabilities of the material if you want to construct PCBs.
That, is PCB will operate continuously for an extended period of time.
For instance, you need to use a material with higher CAF resistance when fabricating large PCBs for use in high-end servers.
Though CAF resistance depends on the properties of a particular material, the fabrication process also plays a critical role in determining the final resistance properties.
ix. Green Laminate and Prepreg
You should select Arlon ‘green’ material when you want to address health and environmental concerns of using non-green materials.
These materials are UL-94 V0 flammability rated, yet without the use of brominated bisphenol-A.
However, you should note that the cost of compliance with the use of green material is a bit elevated compared to the alternatives.
x. Ease of Use
You should select materials that do not require complicated processing techniques.
Consequently, you should select materials that you can process by use of conventional photo-imaging technique and wet chemical processing.
Similarly, they should also be compatible with standard etching and lamination methods.
Though most industries consider normal processing techniques for FR-4 ideal, you may require different processing setups for fabrication high-performance materials.
How Can You Determine the Flammability Rating of Arlon Material and Why is it Important?
High frequency PCB material
Different types and grades of Arlon materials have varying flammability rating.
Flammability rating of a material indicates the safety standards of the material by focusing on the ability of the material to contribute to fire.
You can test the flammability of Arlon material as per the specifications of IPC 4101.
Consequently, you will apply a flame, commonly known as BTU energy, at the bottom of test material for 10 seconds, remove it then reapply again.
For material classification, you will take data on the following parameters then compare to the values given under IPC 4101 specification for classification.
- Flame combustion after applying each flame cycle
- The total combustion time for 5 and 2 samples respectively
- Time taken to glow after removal of the second flame
- Availability of dripping particles capable of igniting a tissue paper
- Level of sample burning, i.e., complete or partial burning.
Most Arlon polyamide products are flame retardant.
However, you will have to incorporate other brominated flame retardants for epoxy-based materials.
What is The Moisture Absorption of Arlon Material?
Similarly, moisture absorption of Arlon product depends on the composition of the material.
Moisture absorption of a product refers to its ability to withstand the effects of moisture when submerged in a liquid.
This property will affect both the thermal and dielectric properties of a material and usually range from 0.01 to 0.2 percent.
The absorbed moisture can react with resin and reduce the transitional temperature (Tg) for the majority of high temperature, multifunctional epoxies.
In the case of polyimides, moisture may not interfere with the Tg but can cause blistering or delamination.
These defects are more critical during post-processing of the finished boards at high temperatures.
It is even critical during levelling or soldering.
Polyamides prepregs absorb water from the atmosphere faster than epoxies and therefore more sensitive.
The moisture doesn’t affect the prepregs but can cause delamination, voids and other defects to the laminates.
Presence of moisture in a complete multilayer board can significantly affect efficiency.
This is even serious if you are to expose it to high temperatures such re-soldering.
Are Arlon Materials Suitable for Fabrication of High-Frequency PCB?
You can select Arlon materials with low Dk and Df for construction of PCBs for use in high-frequency applications.
High frequency PCB
What Factors Determine the Shelf Life of Arlon Material?
Shelf life refers to the period of which you can store Arlon material under a specific temperature and humidity.
It is a period beyond which its proper function will be affected.
The storage life of a laminate depends on storage condition and stability of copper foil. Laminates use C-stage cure that can last eternity since it cannot advance further.
Consequently, the shelf life of a laminate should be indeterminate when stored in clean, cool and dry conditions.
It will still have its original specs as manufactured for initial use unless the copper foil has oxidized beyond repair through the standard pre-clean process.
Arlon prepregs are IPC-4101B and IPC-4103.
You can store Arlon prepregs for six months, or 180 days at below 5C or three months when stored at less than 23C.
Do not expose the material to catalytic conditions such as excess radiation and UV light while in storage.
Such conditions will speed up the rate of product deterioration.
Also, allow the material to acclimatize to the conditions of processing before use.
Always test your material after the initial storage period, and if the original flow value has changed more than 15%, then consider the material expired.
What Drilling Defects Are You Likely to Encounter When Using Arlon Material?
You encounter the following difficulties when drilling an Arlon material.
- Haloing (Resin fracturing) surface
- Pad (Land) Tearout
- Wedge voids
- Hole wall fractures
- Exit burrs
- Pink ring
What is The Dielectric Constant of Arlon Material and What is its Importance?
Dielectric constant (Dk) refers to the measure of permittivity, that is, the travel-speed of an electric signal across the material.
The electric signal speed is inversely proportional to the Dk.
For instance, a product with low Dk will support higher signal propagation and vice verse.
Arlon materials have different values for dielectric constant, which depend on the component’s inherent properties.
The material with ideal values will depend on the requirements of your system.
You can use modified epoxy laminates with Dk values between 3.0 to 3.5 for your high-speed digital applications.
For applications requiring lower Dk values like RF and microwaves, you can use pure PTFT on a fibreglass substrate which has a Dk value of 2.1.
The dielectric constant of a material depends on:
- Properties of the material
- Sample condition before and after test
- Test method used
- Test frequency
For this reason, you will find a lot of literature referring to it as ‘relative dielectric constant’.
It also shifts with a temperature change.
The dielectric constant of a PCB material is only critical for microwave and high-speed digital applications.
Why is Glass Transition Temperature of Arlon Material an Important Aspect?
Glass transition temperature (Tg) is the temperature at which a laminate starts changing its mechanical properties rapidly.
Usually, the material converts from hard and brittle form to softer consistency.
The physical changes in transitional glass temperature will affect several material properties which reflect on the PCB performance.
For instance, resin softening at the Tg ease its smearing during drilling.
The bonding between the laminate’s resin and its copper foil cladding significantly reduce.
Thus affecting the line or pad lifting, among other problems with surface features.
Subjecting your PCB to higher temperatures above its Tg will also result in dramatic change along the Z-direction, expanding fourfold to normal expansion.
The extraordinary expansion along the Z-direction strains the copper-plated through holes and cracking them.
It can also result in latent defects that will prop up during regular PCB operation.
What is the Difference Between Glass Transition Temperature and Continuous Operating Temperature of Arlon Material?
Your PCB material can continually operate in continuous operating temperature without suffering severe deterioration within its expected service life.
In contrast, the transition temperature indicates the temperature, upon which when you exceed, your PCB will start having higher rates of failure.
The failure is because the expansion along the Z-axis increases by a factor of four folds causing cracks on Vias and through holes.
Similarly, the rate of chemical reactions, such as oxidation, also doubles for every rise in temperature by 10C.
What is the Thermal Decomposition Temperature (Td) of Arlon Material?
It is the temperature at which a material has lost 5% of its weight due to thermal decomposition.
You will use it to evaluate the ability of Arlon material to sustain its integrity when exposed for extended periods in high temperatures.
The Td values can indicate the ability of the material to resist high-temperature soldering.
Given that you will rarely use Arlon PCB at temperatures beyond Td values.
The Td of Arlon materials significantly varies to the chemical composition of the materials.
For instance, some polyimides laminates have Td exceeding 400C while most epoxy laminates range from mid 300C.
What is the CTE of Arlon PCB and What Is Its Significance?
Coefficient of Thermal expansion measures the behavior or rate of PCB laminate expansion when subjected to heat.
The final CTE of a multilayer PCB depends on several factors. Generally, the CTE of an Arlon multilayer PCB will vary between 16 to 18 ppm/°C.
The CTE of a multilayer PCB is fundamental in determining its stability and resistance to shear.
Principally, such a low CTE characteristic of Arlon PCB will increase the service life of the PCB and ensure product reliability.
Multi layer PCB
Where the difference between laminate CTE and copper CTE is vast, then the product will suffer faster shear and tear.
It originates from differences in expansion and contraction of the laminates and copper, causing traces and vias o crack.
Why Should You Use Copper Foil When Fabricating Arlon PCB laminates?
Copper foils help in transporting signals from one region of the PCB to the other.
It also interconnects the mounted devices, inputs, outputs.
Copper has superior electrical and thermal conduction properties.
It will provide efficient transfer of heat across the PCB surface, thus reducing potential heating and damaging of the PCB surface.
Its excellent electric conductivity also enhances the transmission of signals without any loss of electricity.
Moreover, copper has an exceptional thermal resistance and high carrying capacity.
Making it ideal for fabricating reliable PCBs that can work even under harsh conditions.
What Factors Should You Consider When Selecting a Prepreg to Use for Fabricating Your Arlon PCB?
When selecting a prepreg, you should consider the following factors:
- The resin content and flow
- The thermal and electrical properties of the Prepreg
- The physical and mechanical properties
- The chemical characteristics of the Prepreg
- Moisture sensitivity of the Prepreg
- The material of construction
What Problems Can You Encounter with Arlon Prepreg and How Can You Resolve Them?
Some of the prepreg issues that you are likely to encounter include:
· Flow Test and Flow Specifications
You might note differences in flow specifications and test for Arlon materials tested by different labs.
Usually, these differences arise due to variation in test conditions and can cause unnecessary frustrations on both the customer and laboratories front.
Some of these tests are also very sensitive to the operator skills, equipment and technique.
Therefore, small variations will cause notable differences.
The inside of coater might occasionally release small bits of particulate matter collected over time.
You will also notice some creases and wrinkles within the material rolls.
You can easily lose the counts of your prepregs when not keen.
Always ensure that you double-check to confirm that your tally is correct to a second party’s count.
In case you encounter any defective prepreg, then collect and send product details such as lot number and sample to the manufacturer for testing.
If the test reveals that the defects were a result of manufacturing, then you will receive a compensatory shipment to caution you against huge losses.
Why Should You Subject Your Prepreg to Vacuum Desiccation Before Use?
You should remove moisture from your trapped in the prepregs after storage through vacuum desiccation before using them.
Compared to oven drying, vacuum desiccation at room temperature exhibit superior results in removing excess water.
Oven drying can cause delamination or failure of recurring thermal processing due to insufficient bonding or flow.
What is IPC-4103 and Why is It Important?
The document specifies the requirements for PCB materials to be used in microwaves and RF application that don’t fit on traditional slash sheet properties.
Specifically, IPC 4103specifications cover base materials for high frequency/high-speed applications.
You will use it as a guideline to produce plastic materials you need for making PCBs.
That is PCBs operating in strip lines, microstrips, and high speed electrical and electronic circuits.
It gives guidelines on the material thickness as measured over the dielectric only.
When you produce your laminates in adherence to IPC-4103, then it will have a dissipation factor below 0.005
How Does Vacuum Lamination and Conventional Press Lamination Compare When Fabricating an Arlon Multilayer PCB?
Though conventional non-vacuum press lamination methods are still familiar with most high volume FR-4 facilities, vacuum lamination has shown superior properties.
Henceforth, you will vacuum lamination technology is becoming the preferred method for many laminators.
Vacuum lamination can use lower pressure, of about 60-70% reduction.
This because the vacuum enhances the flow of resins around traces and into the via holes.
What Analytical Methods Can You Use to Study the Characteristics Of Arlon Material?
You can use several methods to determine and understand the characteristics of Arlon laminates and prepregs.
Some of the tests you can conduct are:
· Thermomechanical Analysis
You can use this test to measure the volumetric expansion of the material.
That is, by accessing the change in length, thickness and width of the material when subjected to heat.
Specifically, it is useful in determining the CTE of circuit material.
You can also use to determine the transition temperature of an Arlon PCB material indirectly.
· Differential Scanning Calorimetry (DSC)
You will use this test to determine the heat flow through your material and compare it to a standard reference, usually aluminium.
DSC test will help you determine the material’s melting point, onset temperature for material curing, level of prepreg ageing, the level of laminate curing, etc.
· Thermogravimetric Analysis (TGA)
The TGA test is fundamental for measuring the rate of material weight loss about rising temperature.
You will use this test to determine; thermal decomposition temperature and its rate of progress, content moisture, content volatile, ash residue, etc.
You will also use the results to predict the long term thermal stability of the material.
· Infrared Spectrophotometry (IR)
IR test is useful in determining the absorption and transmission of infrared frequencies.
You can use it to test to detect changes in the chemical properties of a PCB material.
You can use this test to characterize materials viscosity under heat and pressure.
You will use the data acquired to plan for press lamination.
There are different kinds of rheological tests which provide various kinds of information.
- Oscillating Disk Rheometry:
- Dynamic Scaled Flow:
- Dielectric Spectroscopy:
- Dynamic Mechanical Spectroscopy techniques
· Laser Flash Thermography
You can use this method to determine the thermal conductivity of your material as described under ASTM E-4261-01 specifications.
Consequently, you will need a Laser Micro-Flash instrument which irradiates a single laser beam pulse on the sample.
Then use an infrared detector to measure the rise in temperature on the opposite side of the material and plot it against time.
Use a mathematical formula to derive the thermal conductivity from thermal diffusivity, bulk density and specific heat of the material.
The test method is useful in determining the dielectric constant and dissipation factor of the material at up to 10 GHz.
You can also use different methods such as Time Domain Reflectometry or Cavity Resonator to determine the two factors.
In short, there are many variables you should consider when choosing Arlon materials for PCB.
The best part – Venture Electronics team is here to help you get the best Arlon materials for your PCB fabrications.
In case you have any questions or inquiries, contact Venture Electronics now.