What's the difference between RO4003C and RO4350B?
The performance of RO4003C and RO4350B is very similar. The value of dielectric constant of RO4003C is 3.38+/-0.05, the suggested value of circuit design is 3.55.
RO4350B dielectric constant manufacturing nominal value: 3.48+/-0.05, circuit design recommended value:3.66. The performance parameters of RO4350B and RO4003C are slightly similar.
The main difference is that RO4003C is halogen-free, which is more environmental-friendly.
Rogers 4003 PCB Testing Procedures For PCB Board
We perform multiple quality assurance procedures for the RO4003C PCB. These include:
* Visual Inspection
* Flying probe test
* Impedance control test
* Solderability detection
* Digital metallograghic microscope
* AOI (Automated Optical Inspection)
* Thermal shock test
What's the difference between RO4003C and RO3003?
There are several difference for RO4003C and RO3003. Firstly, it is the fabrication cost.Although they are both expensive as they both involve the use of technical tools in production, the Rogers 3003 is less expensive compared to the Rogers 4003.
Secondly, control temperature, Rogers PCBs can even work in harsh environmental conditions. RO 4003 works differently than R0 3003 due to environmental factors; though, both will work in any environment.
Rogers 4003 has better thermal control due to higher thermal voltage or gravity when weighing the difference with some PTFT constructed PCBs.
Venture RO4003C is a series of high-frequency circuit materials. Our RO4003C is manufactured with the most accurate tools, latest equipment, and advanced production facilities. We have expert engineers and designers who worked hard from designs, prototypes to manufacturing, and mass production. Because of that, Venture can always provide your RO4003C needs even in peak season. Surely, Venture is your total RO4003C solution provider!
Your Leading RO40003C Supplier in China
Venture RO4003C is a series of high-frequency circuit materials that are reinforced with ceramic/ceramic laminates. It is designed for any sensitive performance and high-volume commercial applications.
Our RO4003C is designed to provide low cost and excellent high-frequency circuit fabrication. Venture RO4003C is equipped with properties required by designers for RF microwave circuits.
Aside from that, we produce RO4003C that features low dielectric loss. This allows our RO4003C to be used in applications that require higher operating frequencies.
Moreover, Venture RO4003C possesses the following features:
- Volume manufacturing process
- Not PTFE
- Outstanding dimensional stability
- Superior high-frequency performance because of low dielectric loss and tolerance
- Low in-plane expansion coefficient
- Stable electrical properties
- Low z-axis expansion
- Low thermal coefficient of dielectric constant
The optimized features mentioned above make our RO4003C applicable for RF identification tags, LNBs for direct broadcast satellite, spread spectrum communication systems, power amplifiers, cellular and microstrip base station antennas, and more.
If you want a high-quality RO4003C for your business or project, don’t hesitate to rely on Venture! For more than 10 years, Venture became a professional in manufacturing RO4003C! We are a trusted Chinese supplier of RO4003C!
Through advanced processes and the latest equipment, we can produce the best quality RO4003C that will suit your requirements, PCB needs, and projects!
Through our competitive rates, flexible payment terms, best delivery options, and no MOQ, Venture can always bring your business and projects in the market with success!
More great deals are waiting for you if you purchase your RO4003C orders at Venture! We can offer 24/7 tech support. We also have a hardworking customer service team to give you the needed assistance. We will reply to your inquiries within 2 hours!
Send us inquiries for your next RO4003C orders!
RO4003C: The Ultimate FAQs Guide
Today, you will learn everything you need to know about RO 4003C – from applications, benefits, features, properties, and many more.
So, before you buy these Rogers PCB Materials, read this guide.
- What is RO4003C High-Frequency Material?
- What are the Main Features of RO4003C Material?
- What the Benefits of RO4003C Laminates?
- Which are the Methods of Components Attachment and Wire Bonding in RO4003C Laminates?
- What are the Applications of RO4003C Materials?
- Are RO4003C Flame Retardant PCB Materials?
- How Does Insertion Loss in RO4003C High-Frequency Material Compare to other Rogers laminates?
- Which are the Factors to Consider when Selecting RO4003C Laminate?
- Does the Type of Solder Mask Influence Performance of RO4003C High-Frequency Materials?
- Which are the main Circuit Technologies Used in RO4003C Substrates?
- Which Parameters Affect Radiation Losses in RO4003C Laminates?
- Which are the Properties When Selecting Solder Mask for RO4003C Laminate?
- What Determines the Reliability of RO4003C High-Frequency material?
- Why is the Thermal Coefficient of the Dielectric Constant of RO4003C Important?
- Which is the Best PCB Material in terms of Moisture Absorption between RO4003C vs. FR-4?
- How does Electromagnetic Field Patterns about RO4003C Transmission Lines of Microstrip and GCPW Circuit Technologies Compare?
- Does Outgassing Characteristics of RO4003C Material Allow Spacecraft Applications?
- When is Controlled Impedance Most Essential in RO4003C Laminate?
- How do you Perform CAF Testing in RO4003C High-Frequency Material?
- Which are the CAF Testing Coupons Used in RO4003C laminates?
- Are there Safety and Quality Standards for RO4003C Laminates?
What is RO4003C High-Frequency Material?
RO4003C materials refer to patented woven glass reinforced ceramics/hydrocarbon having PTFE/woven glass electrical performance and epoxy/glass manufacturability.
Supplied in several configurations, the laminates use both 1674 and 1080 glass fabric styles.
All configurations fulfill similar electrical performance requirements.
RO4003C laminates offer low loss and tight dielectric constant control whilst using a similar processing technique as conventional epoxy/glass.
They require no unique thru-hole treatments or handling processes, which makes them different from PTFE based high-frequency materials.
What are the Main Features of RO4003C Material?
The key properties of RO4003C high-frequency laminates include:
- Dissipation factor (Df) of 0.0027 at 10 GHz
- Dielectric constant (Dk) of 3.38 +/- 0.05
- Low Z-direction CTE at 46 ppm/°C
What the Benefits of RO4003C Laminates?
Some of the advantages of RO4003C materials consist of:
- Low Z-direction coefficient of thermal expansion, which facilitates reliable plated thru-hole quality
- Suitable for multilayer PCB constructions
- Compatible with lead-free soldering
- Processes same as FR-4 laminates at reduced fabrication cost
- High thermal conductivity which ensures enhanced thermal management than standard PTFE laminates
- Ideal for performance-sensitive, repeatable applications
- Competitively priced
Which are the Methods of Components Attachment and Wire Bonding in RO4003C Laminates?
Mass production of RO4003C circuit assemblies needs quick, reliable, and effective techniques of mounting PCB components.
Bonding methods for standard epoxy glass grade substrates have been applied with minimal success on PTFE-based materials.
Nonetheless, traditional epoxy glass material parameters are broadly permissible for Rogers RO4003C high-frequency laminates.
Lead attachment techniques are the same as those employed in standard FR-4 epoxy grade PCB laminates.
The lead bonding methods applied to attain low resistance electrical joints and quality mechanical integrity are in 2 categories:
RO 4003C Laminate
1) Welded Bonds
This is true fusion welding in which you melt the circuit pad and metals of lead.
There are various types of welded bonding of RO4003C laminate components including:
· Resistance Welding
Here, you press the circuit conductor and lead together and then pass a high current pulse (often from a capacitor) between the two elements.
The heat produced due to the passage of current across the joint resistance causing melting and welding of the metal.
· Parallel Gap Welding
This refers to a specialized type of resistance welding of components of Rogers RO4003C substrate.
Here, you supply the electrical energy to a set of parallel electrodes that touch the leads of the component.
The weld relies on the conduction of heat produced within the lead to the circuitry pad so to melt and bond them together.
· Percussive Arc Welding
In this RO4003C components attachment method, you hold the pad and lead at some distance apart.
Subsequently, generate an arc by exerting a short RF energy pulse to ionize the space, succeeded by discharge from the capacitor.
A mechanical apparatus compels the 2 heated surfaces together, thus completing the weld.
· Electron Beam Welding
In this lead bonding method, you focus a high-speed electrons beam within a vacuum onto the lead and circuitry pad joined together.
The joint absorbs the energy of the electron, increasing the temperature of the metal’s melting point.
· Laser Welding
Here, you focus energy on the two parts by an extreme, collimated, monochromatic beam of light.
The workpiece absorbs the energy, which increases the temperature to the fusion point.
This method of attaching RO4003C components involves coating lead and pad with an alloy of low melting point then pressing them together.
You apply either generally (oven/infrared heating) or locally (using the heating tool) for solder melting and welding of the 2 parts together.
2) Diffusion Bonding
This component attachment method in RO4003C substrates is a type of diffusion where you make the joint without melting.
· Ultrasonic Welding
Here you induce the metal diffusion between the pad and lead through clamping the 2 together and exerting mechanical energy (ultrasonic sound vibration).
Cleaning of the metal surfaces is through friction, which heats them as well.
However, temperatures don’t hit the melting point.
· Thermal Compression Bonding
In this technique, you complete the metal diffusion by pressure and heat applied to cleaned surfaces of lead and pad.
Temperature is adequate to provide true diffusion weld.
· Thermosonic Bonding
This technique is a blend of thermal and ultrasonic compression bonding.
You preheat the work and then supply ultrasonic energy via a gold capillary.
The method achieves the weld at temperatures lower than the metal fusion point.
What are the Applications of RO4003C Materials?
The common uses of RO4003C laminates are in the following equipment:
- Communication Systems
- IP Infrastructure
- Test and Measurement Devices
Are RO4003C Flame Retardant PCB Materials?
RO4003C laminates are non-brominated and lack UL 94 V-0 rating.
Therefore, they are suitable for Rogers material designs or applications that require UL 94 V-0 flame rating.
How Does Insertion Loss in RO4003C High-Frequency Material Compare to other Rogers laminates?
High-Frequency circuits need substrate materials that feature tight dielectric constant control together with low loss.
Laminates that fulfill these specifications typically cost higher compared to ordinary epoxy/woven glass circuit boards.
The advent of the commercial high-frequency semiconductor market has led to a strong necessity to balance manufacturability, performance, and cost.
Rogers High-Frequency Laminates close the gap by offering tight control on Dk and low loss.
The table below shows a comparison of 50Ω microstrip transmission line insertion loss for various Rogers materials:
Rogers PCB Material Features
RO4003C material gives loss similar to GX and RO3003 material.
A great loss increase is noticeable when moving to the succeeding laminate, BT glass.
The lossiest material, which is 4.5 times lossier in comparison to RO4003C laminate is difunctional epoxy.
Which are the Factors to Consider when Selecting RO4003C Laminate?
Generally, you need to consider the following issues when choosing high-frequency laminate during design stages to minimize design cycle time:
- Material Loss
- Dielectric Constant Control
- Mechanical and electrical thermal stability
There are several materials suitable for high-frequency PCB applications, but RO4003C makes the best in terms of performance and cost.
It offers good control of Dk and low, crucial for C-band and beyond frequencies.
Moreover, Rogers RO4003C not only offers necessary electrical properties, but you can also fabricate it applying traditional epoxy/glass procedures, reducing fabrication costs.
Generally, the laminate blends the greatest electrical characteristics with ease of construction at a competitive price for commercial applications.
Does the Type of Solder Mask Influence Performance of RO4003C High-Frequency Materials?
Solder mask makes one of the most overlooked RF/microwave PCB components.
It gives protection to the circuit though can equally have an impact on ultimate performance, particularly at higher frequencies.
However, most high-frequency PCBs often omit solder mask even if it gives protection that improves reliability.
This is due to the negative effects of solder masks on the performance of RF/microwave circuit boards.
Solder mask addition will increase effective Dk and dielectric losses of RO4003C substrate with grounded-coplanar-waveguide (GCPW) or microstrip transmission lines.
Therefore, you must include considering the solder mask properties when predicting the circuit performance.
This is particularly important when the primary goal of a design is to minimize PCB losses.
Often, high-frequency PCB designs use small solder mask patches as “dams” in areas that need solder application for SMT components assembly.
Contrary to having a solder mask on the entire PCB substrate, these small patches tend to exhibit an insignificant effect on electrical performance.
Generally, solder mask patch will have a negligible effect on performance at a specific frequency if it is below the one-tenth wavelength of working frequency.
Provided you apply adequately small solder mask patches, they will have insignificant impacts on RO4003C laminates.
Nevertheless, the use of several solder mask patches in a comparatively small substrate section can lead to a change in material properties in that region.
This can cause electrical impacts like a higher loss.
Which are the main Circuit Technologies Used in RO4003C Substrates?
To attain optimum performance, RO4003C laminate can use either grounded coplanar waveguide (GCPW) or microstrip circuitry technology.
Each of the two circuit technology for high-frequency PCB has its advantages and disadvantages as detailed below:
· Microstrip Circuits
The circuit entails thin transmission lines found on one edge of laminate and conductive metal ground plane located on the other edge.
Several material-related parameters affect the performance of microstrip transmission line including:
- Dielectric material thickness
- Conductive metal thickness
- Conductive metal smoothness or roughness at the copper-substrate interface
· Grounded Coplanar Waveguide (GCPW) Circuits
Also referred to as conductor-backed coplanar waveguide (CBCPW), the circuit technology increases the ground amount about a circuit in comparison to microstrip.
It does this by putting ground planes on the base of the RO4003C dielectric material.
Further, you place the ground planes on either side, same plane, and top of the signal transmission line.
GCPW circuitry structure attains electrical stability by precisely using ground planes to surround a signal line.
Both RO4003C substrate circuit technologies function by way of dominant quasi-TEM (quasi-transverse-electromagnetic) propagation means.
However, due to their advanced ground structures, GCPW circuits are to some extent more mechanically sophisticated to construct.
Moreover, CBCPW equally has a lower dispersion in comparison to microstrip transmission lines.
This is in addition to lower radiation loss, specifically at frequencies stretching into the millimeter-wave range.
Due to their advanced ground structures, CBPCW circuits have the capability for wider impedance ranges and effective bandwidths compared to microstrip circuits.
Nonetheless, microstrip circuitry is comparatively robust and simpler to construct than GCPW transmission lines.
This is because of their simple “ground plane at the base” circuit structure.
Furthermore, the performance of the microstrip transmission line is not as delicate to RO4003C laminate fabrication problems as GCPW circuits.
They experience minimal variations in performance because of normal etching modifications of conductor thickness and spacing.
Which Parameters Affect Radiation Losses in RO4003C Laminates?
Radiation losses in Rogers RO4003C high-frequency materials depend on several different parameters consisting of:
- Operating Frequency
- Substrate Thickness
- Laminate Dielectric Constant
- Various Design Aspects
With regards to the last parameter, radiation losses frequently result due to differences in propagation of wave and poor impedance transitions.
The main areas of concern in RO4003C laminates transitions include stepped impedance points, matching networks, stubs and signal launch area.
When correctly designed, these laminate parameters will feature minimal radiation losses due to smooth impedance transitions.
However, you still need to be aware of the chances of impedance mismatches happening at any type of circuit junction.
With regards to the operating frequency of RO4003C materials, radiation losses are generally problematic at higher frequencies.
Material dielectric constant and thickness are the common parameters of influencing radiation loss.
Thicker high-frequency laminates incline to have a high probability for radiation loss.
Similarly, Rogers RO4003C substrates having lower Dk values will encounter more radiation loss compared to those with higher Dk values.
With reference to laminate tradeoffs, the advantages of thin RO4003C substrates sometimes counterbalance concerns over utilizing a lower Dk material.
The dielectric constant and thickness of high frequency material will influence its performance in relation to frequency.
Typically, laminates having 20 mils or lower thickness will often not experience radiation loss under 20 GHz.
Which are the Properties When Selecting Solder Mask for RO4003C Laminate?
You need to consider several characteristics when choosing solder mask for RO4003C RF/Microwave circuits.
The properties of solder mask to factor in include:
- High adhesion
- Long shelf life
- High electrical insulation
- Great plating resistance to all kinds of plating
- Good heat resistance
- Compliance with halogen-free specifications.
For applications of RO4003C laminates where performance is important, solder mask color choice can affect Dk and Df of the material.
A color difference can imply, though negligible, a difference in both parameters.
Proper cleaning and PCB surface preparation can equally help in ensuring strong solder mask bonding to surface of laminate when applied.
What Determines the Reliability of RO4003C High-Frequency material?
Typically, high-performance laminates feature good reliability properties.
Often, the thermal cycling reliability of the plated through-hole is the main determinant of reliability of RO4003C laminate.
Glass transition temperature (Tg) and the coefficient of thermal expansion (CTE) are the key attributes to consider with regards to Rogers laminate.
Especially, the most significant is the Z-axis CTE of the substrate.
The CTE of Rogers RO4003C materials generally falls within a span that produces superior PTH reliability.
Thermoset hydrocarbon laminates have exceptionally high Tg (greater than 280 degrees Celsius). This makes them not to transition beyond Tg during fabrication and assembly processes.
With material remaining under Tg, CTE stays constant, which is low and assumed very ideal for PTH reliability.
Majority of thermoset substrates feature CTE that varies below and above the Tg.
Therefore, although the materials feature high Tg, the CTE will probably be different above compared to underneath.
Generally, beyond the Tg, there will be higher CTE and it is the temperatures at which assembly soldering normally happens.
Why is the Thermal Coefficient of the Dielectric Constant of RO4003C Important?
High-frequency RO 4003 PCB
Some applications of RO4003C laminate involve working in dynamic thermal conditions.
This may subject the Rogers material to a variety of temperatures for different durations of time.
Due to this fact, the Thermal coefficient of the dielectric constant of the PCB substrate used in the dynamic thermal conditions is very crucial.
Abbreviated as TcDk, all circuit boards possess this feature.
In most scenarios, you will use high-frequency materials to only attain enhanced electrical loss.
In some instances, sustaining controlled impedance might be more critical than electric losses.
Typically, RO4003C laminates feature low TcDk, which is instrumental for constant electrical performance.
Low TcDk implies that the material encounter very negligible dielectric constant change with a variation in temperature.
This means a very insignificant change in impedance.
Therefore, you should always choose RO4003C laminate for a more steady design in dynamic thermal conditions.
Which is the Best PCB Material in terms of Moisture Absorption between RO4003C vs. FR-4?
If humidity is the main concern in PCB design, you should use RO4003C high-frequency material rather than FR-4 laminate.
It is the best choice even if the circuit board needs no low electrical loss.
The majority of FR-4 materials may absorb moderate moisture amount as a result of humidity within the surrounding.
Certain PCB applications are responsive to moisture and/or variation in impedance because of humidity.
Compared to FR-4 PCB materials, Rogers RO4003C high-frequency features extremely low moisture absorption characteristics.
How does Electromagnetic Field Patterns about RO4003C Transmission Lines of Microstrip and GCPW Circuit Technologies Compare?
Physical dissimilarities in-circuit technologies lead to substantial dissimilarities in electromagnetic (EM) field patterns about every technology’s transmission lines.
In microstrip transmission lines, the majority of EM fields fall between the bottom ground plane and the top signal plane.
However, there is a high field concentration with high field concentration around the signal conductors’ edges.
With GCPW, strong electromagnetic fields occur between ground-signal-ground regions on the coplanar circuitry layer of RO4003C laminates.
Similarly, weaker EM fields occur between the bottom pane and signal plane than for microstrip’s bottom and top circuit planes.
Furthermore, GCPW transmission lines experience more conductor losses in comparison to microstrip.
However, GCPW circuits have minimized radiation loss than microstrip transmission lines.
In addition, the neighboring GCPW ground planes can substantially be instrumental in the elimination of spurious modes.
Does Outgassing Characteristics of RO4003C Material Allow Spacecraft Applications?
RO4003C materials are thermally stable hydrocarbon composites with exceptional resistance to outgassing.
They feature greatly cross-linked hydrocarbons, an attribute that makes them not to emit by-products or gases at high temperatures.
Testing for outgassing characteristics of Rogers RO4003C laminate involves vacuum heating 100-300 mg specimens within a copper enclosure having exit port.
The heating happens at 125 degrees Celsius for 24 hours.
There is a chrome-plated collector located at 12.7 mm away from the exit port, which you maintain at 25 degrees Celsius.
For analysis, you express the following variables as a percentage of initial specimen mass:
- Total Mass Loss (TML)
- Water Vapor Recovered (WVR)
- Collected Volatile Condensable Materials (CVCM)
Generally, you should avoid high-frequency laminates having CVCM above 0.10 or TML above 1.0 in spacecraft applications.
Therefore, Rogers RO4003C is perfect for spacecraft applications since it has a CVCM of 0.00 and TML of 0.06.
When is Controlled Impedance Most Essential in RO4003C Laminate?
You should employ controlled impedance in case a signal needs to possess a specific impedance for it to function correctly.
Impedance matching of RO4003C substrate trace in high-frequency PCB applications are instrumental in the maintenance of signal sharpness and data integrity.
It is important to ensure that the impedance of laminate trace linking two components matches the characteristic impedance of components.
Any impedance mismatches can increase switching times in the RO4003C PCB or device, in addition to random errors.
How do you Perform CAF Testing in RO4003C High-Frequency Material?
Finding out CAF after its occurrence is very difficult, which makes it challenging to examine and study.
It commonly takes place in layers buried inside the RO4003C substrate.
CAF can as well appear in conjunction with supplementary contributing to failure factors.
This makes it challenging to recognize when CAF is the main accountable failure factor.
Nevertheless, you can apply several advanced testing techniques to evaluate and characterize the creation and failure of CAF.
The tests consist of IPC standard electrical techniques referred to as Surface Insulation Resistance (SIR) tests that include:
· IPC Electrochemical Migration Testing
This IPC standard test helps in determining resistance to current flow through the surface of Rogers RO4003C laminate.
· Temperature-Humidity-Bias (T-H-B) Testing
T-H-B testing is a SIR test that factors in the processing temperature, voltage bias, aging, and relative humidity.
You can equally a number of techniques to image CAF development on a RO4003C circuit board. These methods consist of:
· Scanning Electron Microscopy (SEM)
The technique entails using the main electron beam gun that relays electrons to a positively charged anode within a vacuum via electromagnetic lenses.
It is possible to operate this gadget in a secondary electron (SE) mode, which is suitable for surface-topography imaging.
Alternatively, you can apply a backscattered electron (BSE) mode that facilitates atomic number contrast.
· Energy Dispersive Spectroscopy (EDS)
This involves an incident electron beam which makes it possible to recognize elements like bromine, chlorine and copper within the RO4003C laminate.
· Focused Ion Beam (FIB)
In this method, it is possible to use the high resolution to magnify a surface and then create a narrow cross-section to attain a 3-D image.
· Transmission Electron Microscopy (TEM)
This device, which operates the same as a light microscope, makes it possible to recognize material phases and establish the crystallographic structure.
· X-Ray Photoelectron Spectroscopy (XPS)
At times known as electron spectroscopy for chemical analysis, this technique is a surface-analysis method that allows you to recognize chemical compounds.
· Fourier Transform Infrared Spectroscopy (FTIR)
This method evaluates organic components and forms a spectrum of wavelength and intensity readings.
· Ion Chromatography
In this technique, which might be either cation- or anion-exchange chromatography isolates polar molecules and ions.
Which are the CAF Testing Coupons Used in RO4003C laminates?
You perform CAF testing under high humidity (87 percent Relative humidity) and high temperature (65 or 85 degrees Celsius) environmental conditions.
IPC-TM-650, Method 2.6.25A is the standard test method applied, which employs standard coupon designs including:
- IPC 9253
However, you can adopt your coupon design as a substitute to standard coupon design.
The adopted coupon designs need to include various hole sizes; Z-axis spacing, hole-to-plane, or hole-to-hole; and orientations of glass fiber.
This allows for all probable failure modes to establish if the Rogers RO4003C laminate will satisfy the necessary specifications.
Are there Safety and Quality Standards for RO4003C Laminates?
Here are the internationally recognized safety and quality standards that you should look for in RO4003C materials:
- ANSI Standards
- ISO Standards
- CE Standards
- ASTM Standard
- RoHS Standards
- IPC Standards
- UL Standards
Depending on your unique application requirements, Venture Electronics offers a range of Rogers PCB laminates.
Contact us today for all your RO 4003C PCBs from China.