Is RO3003 material RoHS compliant?
Yes, RO3003 material is RoHS compliant. That means the raw material comply with Directive (EU) 2015/863 on the Restriction of the use of certain Hazardous Substances in Electronics and Electronic Equipment.
The RO3003 raw material does not contain any restricted materials and considered environmential-friendly.
What does RO3003 high frequency material offer?
PCBs have made great contributions to the development of electronic devices in the world today. Rogers is a well-known PCB company that provides high quality laminates.
The Rogers 3003 is one of the Rogers 3000 series. The RO4003 PCB material can support for high frequency applications. RO3003 is a commonly used circuit board in the electronics industry.
This board has great features and benefits. If you have projects, please contact Venture, and we are happy to hear from you.
What are the applications for RO3003?
There are some typical applications:
1. Automotive radar applications
2. GPS Antennas
3. Power amplifiers and antennas applications
4. Patch antennas for wireless communications
5. Direct broadcast satellite applications
Venture is a professional manufacturer of RO3003 that features low dielectric loss. This makes our RO3003 to offer high-performance. Our RO3003 laminate is perfectly suitable for any applications with 30-40 GHz.
Aside from that, Venture RO3003 undergoes a volume manufacturing process. Therefore, we can offer RO3003 with economical laminate pricing. Venture can offer you a cost-effective solution for your RO3003 needs!
Your Leading RO3003 Supplier in China
Venture is a professional manufacturer of RO3003 in China. We offer RO3003 that is a high-frequency circuit material. Our RO3003 is a PTFE ceramic-filled composites that are usually used for RF and commercial microwave applications.
We manufacture RO3003 with superior mechanical properties. This allows our RO3003 to provide reliable multilayer and stripline board constructions.
Other than that, our RO3003 offers a stable dielectric constant. Because of this, Venture RO3003 is ideally suitable for voltage-controller oscillators, microstrip patch antennas, and bandpass filters.
For a full range of dielectric constants, we designed RO3003 with uniform mechanical properties. This makes our RO3003 perfect for multilayer board designs and multilayer epoxy glass board hybrid designs.
Venture RO3003 is also equipped with a low in-plane expansion coefficient. This enables our RO3003 to offer excellent surface mounted assemblies.
Because of its advanced features, our RO3003 is also perfect for applications including power backplanes, remote meter readers, datalink on cable systems, patch antennas, and more.
Venture is committed to making innovations and excellence in manufacturing RO3003. Through our latest manufacturing facilities, tools, and equipment, guaranteed that we can supply you the best quality RO3003!
For more than 10 years, Venture is an expert manufacturer of RO3003. We can guarantee you that our Nelco RO3003 comes with full customer support.
To support your business or projects, we offer RO3003 with the most affordable rates. We also offer flexible payment terms without MOQ. Aside from that, we can give you value-added deals if you purchase NRO3003 from us!
Our customer service team will work 24/7 to give you their full service and assistance. You can always trust Venture as your supplier of high-quality RO3003!
Send inquiries for your next RO3003 orders!
RO3003: The Ultimate FAQ Guide
Whether you want to learn about properties, uses, quality standards or features of RO3003, you will find all information right here.
So, if you want to be an expert in these Rogers PCB materials, read this guide.
What is RO3003 PCB?
This is a ceramic-filled PTFE circuit-based material that has consistent mechanical properties.
It is, therefore, suitable regardless of any dielectric constant you select.
Also, it enables designers to develop multi-layer boards that use varying dielectric constant materials with no warpage or reliability issues.
What are the Features of RO3003 PCB Material?
A RO3003 will offer the best dielectric constant [Dk] stability at varying temperatures and frequencies.
Some features of this component are:
- They have a dissipation factor of 0.0010 at 10 GHz.
- It has a dielectric constant [Dk] of 3.00 +/- .04.
- The low CTE values are as follows: X at25 ppm/°C, at Y at 25 ppm/°C, and Z at 25 ppm/°C.
- It has a dielectric loss factor of only 0.0013.
What are the Benefits of RO3003 PCB Material?
Here are the benefits of RO3003 PCB:
- The price of the laminate is reasonably economic.
- The low dielectric constant [Dk] makes it suitable even in applications with up to 77 GHz.
- It comes with a wide array of dielectric constant [Dk] of between 3.0 to 10.2.
- Also, it is available in woven or non-woven glass reinforcements.
- The low Z-axis CTE will make the plated through-hole reliable.
- It also provides the lowest loss as a commercial laminate.
- Its board construction provides a reliable stripline and multi-layer capability.
- It is suitable for multi-layer designs that provide a wide array of dielectric constant.
- Also, it provides the best use with epoxy glass multi-layer designs that offer hybrid designs.
- It has a stable dielectric constant versus the frequency and temperature.
- Also, it is suitable for band pass filters, voltage-controlled oscillators, and microstrip patch antenna.
- The low in-plane expansions coefficient allows for:
- Good dimensional stability.
- Suitable for applications that are sensitive to temperature changes.
- It allows for a reliable mounting of assemblies on the surface.
What is the Dielectric Constant of RO3003 PCB?
The dielectric [Dk] constant of a RO3003 PCB varies a lot.
It can range from 3.0 to 10.2.
Multilayer Roger 3003 Material
What are the General Parameters of RO3003 PCB?
These are the general parameters you will find on this PCB:
- A dissipation factor [Df] of 0.0011.
- It comes in a ceramic-filled PTFE.
- The thermal conductivity is at 0.43 W/m/K.
- It has a Td of 500 °C.
- The thermal coefficient is between 16 to 18 ppm/°C.
- It has a thickness of 0.13 mm or 0.25 mm.
What are the Different Color Options for RO3003?
There are various colour options for RO3003.
This depends on the designers and consumers.
Here are the colour options you can find:
This is the second most popular color PCB after the green color.
It provides better contrast between the copper wires and the color.
This makes it easy to repair damages and do assembly of the components.
· Red PCB
This color provides a bold and professional statement.
It will provide a great contrast between the empty spaces, planes, and traces on the board.
This makes it possible to quickly identify any issues on the board.
Besides, it is a wonderful color when you are planning to use a magnifier to see problems and issues on the traces.
· Black PCB
Several consumers find it hard to work with a black PCB.
This is because it is difficult to differentiate the traces, planes, and black spaces.
Therefore, you will need to tilt the black PCB on a large light source to review it.
The pads will offer a great definition if you decide to work with a different silkscreen.
It will enable one to identify the spots and see if they have the right markings.
This color of PCB is available in Apple products like iPhone and MacBooks.
· White PCB
A white PCB will offer the least amount of contrast.
One can create a contract with a duller color when you use a silkscreen that you can use on a black PCB.
· Purple PCB
This is not a common color that you will find in PCB.
Also, you will pay extra if you need this color on your PCB.
It provides high contrast and impressive workability.
· Yellow PCB
This color will provide the widest detail of contrast between the planes, traces, and empty spaces.
It is very visible, efficient, and provides great workability.
· Green PCB
Many manufacturers use this color for their PCB and have been here for several years.
What are the Uses of RO3003 PCB?
There are several uses of RO3003 PCB.
- Power backplanes
- The datalink available on cable systems
- Radar uses in automotive
- Antennas for Global Positioning Satellite [GPS]
- Direct broadcast satellites
- Remote meter readers
- Systems for satellite telecommunications, antennas, and power amplifiers
- Patch antennas available for wireless communication
What are the Different Layers available RO3003 PCB?
There are several layers you can find on RO3003 PCB.
This can be hard to understand but are quite easy and simple.
The layers are:
It is also known as mechanical 1.
The PCB can have several mechanical layers but you need at least one to assemble the board.
It outlines the size of your PCB board.
The fabricator cuts out the PCB in the correct size from the stock material.
It can come in rectangular, round-cornered, or other kinds of shapes.
Rarely will you add detail tooling specifications and other mechanical information on the mechanical board.
Keep out Layer
This layer will highlight the working area of the design.
An example may be drawing back the components 1/2 of an inch from the mechanical layer.
It will identify areas on the board that you should avoid for mechanical or other purposes.
This is the layer that the components interconnect.
Designers spend a lot of time perfecting this layer.
This layer is present on both the outer [top and bottom layers] and an inner layer of the PCB.
Always provide this layer for the fabricator to create the board.
Ground and Power Planes
These are solid copper layers that you will shorted on a fixed potential.
Connect ground planes to the GND and the power planes to one of the onboard voltages.
They are available on the top, bottom, or in the internal part of the board.
These planes provide power and ground on all components.
They can also achieve better performance on specific conditions.
When customizing the PCB, provide all fabrication files that describe the plane within the design.
It is possible to modify ground and power planes for them to contain several copper sections on different potentials.
Also, they will improve the convenience of the planes.
For instance, a plane can have several voltages that will distribute +5 V and -5 V on different sections of the board.
It is also known as the overlay.
They will provide the text designators on the components at the top and bottom of the layer.
Provide additional files to the fabricator when making the top and bottom overlays.
The internal layers do not have the silkscreens as it will make them invisible.
If you plan on not including texts on the board, this layer is optional.
However, the texts are helpful when debugging the PCB in labs.
For example, find the text “R2” when you need to find out the potential of a single terminal of resistor R2.
The text allows one to easily find these parts.
When you have no texts, you need to refer to the designs.
Print blank boxes to enable revisions and serial numbers.
This allows one to write them using a sharpie or use a stamp on the board.
Solder Mask Layers
These are some odd thin and green protective coverings on the top and bottom of the PCB.
They will protect the traces from shorting where there is debris on the PCB.
Not all PCBs have a solder mask layer.
Some are on the top part and others on the bottom part only.
When using a solder mask, provide files for all the layers where you need to achieve this effect.
Also, solder masks are negatives meaning the areas you will not cover will have a solder mask layer.
Solder Paste Layers
This is a material you will use during the soldering surface mounts component on PCB.
Pads on surface mounts components will influence solder paste on the open copper area having no solder mask.
The solder paste comes in handy when the board has several surface mount components.
Solder paste will assist the solder to flow better when it sticks the component pin to the copper on the PCB.
Use a solder paste file on both the top and bottom sides of the design when using surface mount components.
How can you Prevent RO3003 PCB Material from Overheating?
A RO3003 PCB can withstand certain amounts of heat.
The performance of a PCB will plummet when the temperature surpasses this limit, notably at higher temperatures.
Engineers need to prioritize the heat management system.
Heat originates from several sources.
Since the PCB is small and light, the density of the components can produce heat, together with external sources.
The heat may cause the PCB to distort as it expands.
Also, smaller electronic designs may encourage this effect.
Manufacturers make PCB with a high dielectric constant to assist with this matter.
Materials on the PCB may expand at different rates, and the coefficient of thermal expansion [CTE] describes it.
Some options of preventing overheating are:
Using Heavier Copper
This means placing traces deeper into the PCB.
Therefore, the heat will disperse into the PCB and inside thermal vias.
This means using a thicker PCB, which is advantageous in high-current equipment.
Thicker boards need more thermal energy to achieve a high temperature.
This assists in keeping the temperature on the top of the board to a minimum.
Integrate Heat Pipe
This is suitable for compact devices like a smartphone.
It is a cost-effective passive heat transfer method.
Also, it provides better thermal conductivity, vibration-free usage, and no moving components.
The pipe can hold small amounts of fluids like sodium, acetone, water, nitrogen, or ammonia.
The fluid absorbs heat, evaporates, then cools as it reaches a cooler region of the pipe.
Apply Thermal Interface Materials (TIM)
These materials will fill empty spaces between surfaces, which offer a great thermal conductivity than air.
This means the heat transfer between these two surfaces will improve.
Thermal interface materials will provide 100 times better heat conductivity than air.
The electronic industry uses thermal greases as they improve the performance of heat sinks.
Integrate an Active Cooling System
This can be a micro fan that will cool the device.
These cooling fans are the best since the size or voltage of the application does not matter.
The noise the fan produces depends on its size and how fast it spins.
Faster fans will produce more noise.
It is possible to alter fans by using insulating ducts, installing sound-dampening products, or using a rubber on the fan.
What are the IPC Assembly Standards used to Manufacture RO3003 PCB Material?
An IPC standard covers:
- How one should handle electronic assemblies
- Acceptable methods for installing hardware on assemblies.
- The acceptable soldering results.
- Manufacture of surface mounts, through-hole technology, etc.
Here are the IPC assembly standards:
This is the Acceptability of Printed Boards.
When blank boards come from a PCB fabricator, this standard will inspect these boards.
This is the Acceptability Standard for Manufacture, Inspection, and Testing of Electronic Enclosures.
The CM uses this standard when assembling and inspecting the box builds.
This is the Requirements and Acceptance for Cables and Wire Harness Assemblies.
The CM is to use this standard to manufacture cables as per your specific PCB assemblies.
- IPC 7711/7721C
This is the Rework, Modification, and Repair of Electronic Assemblies.
Use the information in this document to repair and rework PCBAs to IPC standards.
What are the Components of RO3003 PCB Material?
Here are the components that manufacturers use to make RO3003:
This is a B stage material that is sticky and enables the bonding of various laminates or foils.
- Copper foil
These are the conductive traces on the RO3003 PCB.
- Copper laminates [Core]
This contains prepregs and copper coils that you will laminate and cure.
How does Single Layer and Multi-layer RO3003 compare?
A single layer RO3003 PCB has components on one side of the board and the conductor on the opposite side.
They are suitable for simple equipment since no wires can cross for the circuit to operate optimally.
Also, they are cheap to manufacture than multi-layer RO3003 PCB.
Besides, they are simple to design and produce.
A Multi-layer RO3003 PCB has a single or several conductor patterns within the board hence increase surface area for wiring.
Multi-layer is suitable for computers, heart monitors, GPS systems, X-ray equipment, mobile phones, etc.
Also, multi-layer RO300 are expensive to manufacture, complex to repair, and take a long to manufacture.
What should you Consider when Selecting RO3003 PCB Material?
Here are some considerations that will assist when selecting this material:
This is suitable when the space is small, and the material needs to bend.
Also, when you require light boards and the PCB has to withstand extreme conditions.
These are suitable when strength is vital.
It is also easy to repair and maintain when you have clear marks on the components.
Besides, they are good when you are producing large volumes and eliminating connectors.
The signal paths will have a good organization.
Flexible and Rigid Materials
They are suitable for:
- RF identification tags
- Automotive radar and sensors
- Cellular antennas for base stations
- Power amplifiers.
These are suitable in:
- When the price is a priority
- When you are prototyping
- When using applications that need low-speed digital circuits
- When designing complex multi-layer PCB
What Properties Should you Consider when Choosing RO3003 PCB Laminate?
Dielectric materials make up PCB laminates.
Here are the properties of the dielectric materials worth considering:
Glass Transition Temperature (Tg)
This is the temperature where the PCB substrate will change from a glassy rigid state into a soft deformable state.
The SI unit of Tg is in Degree Celsius [°C].
Decomposition Temperature (Td)
This is the temperature where the material will chemically decompose.
The SI unit is in Degree Celsius [°C].
Thermal Conductivity (k)
This defines the capability of a material to conduct heat.
Low thermal conductivity relates to low heat transfer.
High thermal conductivity relates to high heat transfer.
The SI unit is in Watts/meter Kelvin [W/mK].
Coefficient of Thermal Expansion (CTE)
This is the rate at which a PCB material will expand when it heats up.
The expression is in parts per million [ppm] that expands for each degree Celsius of heat.
The SI unit is PPM/°C.
When the temperature of the material rises over Tg, the CTE will rise.
Dielectric Constant (Dk) or Relative Permeability (Er)
This is the ratio of the material’s electric permeability to the free spaces’ electric permeability.
Loss Tangent (tanδ) or Dissipation Factor (Df)
This is the tangent of the phase angle that is between the dielectric’s resistive and reactive currents.
Dielectric loss increases with an increase of the dissipation factor.
A low dissipation factor produces fast substrates, while large dissipation factors produce slow substrates.
What Factors will Influence the Copper Foil that you will Use in RO3003 PCB Laminate?
This depends on:
Material Properties of Copper
- The copper thickness varies between .25 oz to 5 oz.
- Copper purity is a percentage of copper within the copper foil.
Copper foils with electronic grades have a purity of around 99.7%.
- Copper-dielectric interface profile where a low profile produces low signal copper losses at a high frequency.
- Copper foils with a low profile which is suitable in low loss high-frequency usages.
Types of Copper Foil
- Electro-deposited copper is copper that produces rigid PCBs.
- Rolled copper that is thin since you manufacture it between heavy rollers.
They are suitable for producing flexible and rigid-flex PCB’s.
- Copper foils with a low profile which is suitable in low loss high-frequency usages.
How can you Choose the Best RO3003 PCB Material?
- Choosing materials that share the same dielectric constant [Dk].
- Ensure you match the coefficient of thermal expansion [CTE].
- Choose materials that have a lower moisture absorption capability.
- Avoid using FR-4 when it comes to high-frequency usages.
- Select flat and tight weave substrates for high-speed or high-frequency applications.
How Can you Effectively Design RO3003 PCB Material?
One can design using the following steps:
- Begin by using a good PCB software
- Fabricate and eliminate concentrating on components that are close together.
- Employ a width calculator to determine the thickness and width of the traces.
- Choose between surface mount technology and through holes.
- Ensure the design is accurate and all parts fit correctly.
- Place decoupling capacitors near the power and ground pins of the integrated circuits.
- Improve the layout of the switching regulators.
- Avoid the blind and buried vias.
What Quality Standards should RO3003 Comply with?
These standards include:
- ISO 9001:2008
- RoHS [Restrictions of Hazardous Substances]
How can you Achieve Smooth RO3003 PCB Assembly?
The manufacture and assembly of RO3003 PCB are two different entities.
This is because they need their specific processes and equipment.
These steps ensure quality and they are:
- IPC certification
- Offshore assembly
- Involve a PCB assembling operator
- Prioritize features
- Consistent labels
- Use the best tools
- Prioritize lead time
- File formats
Is RO3003 A High Frequency PCB Material?
Yes, RO3003 is a high-frequency PCB material.
Now, we hope you did find all information you were looking for about RO3003.
However, if you have any question, or inquiry, Venture Electronics team is here to help – contact us now.