Vertical Probe Card
Our extensive expertise in the design and manufacturing of vertical probe cards ensures superior performance in wafer testing. Vertical probe cards are engineered to accommodate higher currents and frequencies, providing enhanced signal and power integrity.
About Vertical Probe Card Characteristic
- Versatile Probe Options: Includes vertical and vertical MEMS probes suitable for pitches as fine as 80 µm.
- Fine Grid Arrays: Supports grid arrays with pitches down to 80 µm, facilitating extensive multi-site testing (X8–X16).
- Ultra-High Pin Counts: Accommodates pin counts ranging from 20,000 to 30,000 pins.
- Flip-Chip Bump and Cu Pillar Probing: Optimized for both types of probing, capable of carrying up to 1A per probe.
- High-Temperature Compatibility: Ensures minimal probing force, preserving solder cap integrity and reliability in back-end packaging processes.
Vertical Probe Card Probe Capabilities Comparison
| Probe Specifications | |||||||
|---|---|---|---|---|---|---|---|
| Probe Type | MEMS | Cobra φ 75 | Cobra φ 63 | Cobra φ 50.8 | Cobra φ 41 | Wire φ 30 | Wire φ 20 |
| Probe Material | Nickel Alloy/Palladium Alloy | P7/P7+ | P7/P7+ | P7/P7+ | P7/P7+ | P7/P7+ | P7/P7+ |
| Minimum Pitch | 40um | 150um | 125um | 100um | 80um | 50um | 40um |
| Recommended OD | Customzied | 150um | 120um | 100um | 80um | 70um | 60um |
| Tip Shape | Flat/Sharp/Round | Flat/Sharp/Round | Flat/Sharp/Round | Flat/Sharp/Round | Flat/Sharp/Round | Flat/Sharp/Round | Flat/Sharp/Round |
| Contact Force (@ 0D 50um) | Customzied | 5±2.5gf | 4±2gf | 3±1.5gf | 2±1gf | 1.5±1gf | 0.7±1gf |
| Current Carrying Capacity | Customzied | P7:600MA | P7:500MA | P7:450MA | P7:350MA | P7:275MA | P7:190MA |
Contact Us Today!
Explore our advanced Vertical Probe Card solutions today to elevate your chip testing capabilities with precision and efficiency.