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FC-BGA Substrate

Venture’s FCBGA package as a substrate layer material is one of the best lined-up products on the market. This type of substrate allows for a more advanced and high-speed connection through its extensive and exquisite wiring design.

Our best-skilled production team and latest technology make it a well-assured large-scale supply with the most precise and accurate specifications.

FC-BGA Package Substrate Features

FCBGA substrate market has dramatically increased because of its capacity to produce a fast connection and reliable circuitry design as a semiconductor for most digital devices.

It has a lot of benefits and advantages in the electronic industry. Having different variations and forms, the best features of Venture’s flip chip BGA include the following:

One-piece lid high-performance flip chip BGA (HP-fcBGA) package.
Download Your FREE
PCB & Assembly Catalog

Download the FREE PCB & Assembly Catalog online today! Venture will be your best partner on the way of bring your idea to market.

Our FCBGA Design Guide

From concept to completion, your project will be under experienced project management, sparing you the hassle of untimely conference calls, communication gaps, language barriers and “real time” information gathering.

We’ll be with you, together bring your project from ideas to market.