PCB X-Ray Inspection for Hidden Solder Joint Reliability
Years of Experience
Electronics Components
Successful Projects
Experienced Engineers
In high-density PCB assemblies, many critical solder joints—such as those beneath BGA, CSP, QFN, and other bottom-terminated components—are completely hidden from visual or optical inspection. That’s why Venture integrates real-time X-Ray Inspection into our PCBA quality process to detect internal defects that would otherwise go unnoticed.
X-ray inspection (AXI – Automated X-Ray Inspection) allows us to look “through” the board and verify the structural integrity of every hidden solder joint. This is especially crucial for mission-critical applications where even a single void or short can lead to product failure.
What Our X-Ray Process Detects
Solder Voids – Internal air gaps in solder joints that weaken electrical/mechanical strength
Bridging and Shorts – Especially in dense BGA and QFN layouts
Insufficient Solder – Caused by poor stencil transfer or reflow issues
Component Misalignment – Chips or BGAs that have shifted during placement or reflow
Delamination or Layer Cracks – In multilayer PCBs after reflow or thermal stress
Our Capabilities
High-resolution real-time imaging with microfocus X-ray sources
360° tomographic viewing for complex assemblies
Precise defect localization for targeted rework or failure analysis
Full traceability integrated with SPC and batch documentation
X-Ray Inspection for Hidden Solder Joint Reliability
X-ray inspection is often the last checkpoint before boards move to functional testing or customer delivery. It gives you peace of mind that even what you can’t see has been fully inspected and passed to the highest standard.
Whether you’re building next-gen IoT modules or automotive-grade control boards, our PCB X-ray inspection service ensures zero-defect production with total visibility.
PCB & Assembly Catalog
Download the FREE PCB & Assembly Catalog online today! Venture will be your best partner on the way of bring your idea to market.
