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The Gerber format is an open 2D binary vector image file format. It is the standard file used by printed circuit board (PCB) industry software to describe the printed circuit board images: copper layers, solder mask, legend, etc.

According to IPC-2226, HDI is a printed circuit board with a higher wiring density per unit area, compared to conventional printed circuit boards (PCB). Compare to conventional PCB technology, HDI PCBs have finer lines and spaces ≤ 100 µm / 0.10mm, smaller vias (<150 µm) and capture pads <400 µm / 0.40mm, and higher connection pad density (>20 pads/cm2).

In the new definition of IPC-T-50M, a microvia is a blind structure with a maximum aspect ratio of 1:1, the terminating on a target land with a total depth of no more than 0.25mm,which measured from the structure’s capture land foil to the target land.

A buried via hole is a hole that runs between one or more inner layers. The buried via holes are normally mechanically drilled.

General speaking, the thicker the copper base, the wider the track should be. One key rule is that with a 18 µm copper base the track should not be narrower than 0.1 mm(0.1mm), and also if with a 105 µm copper base the track should not be narrower than 10 mil(0.25mm).

The aspect ratio refers to the relationship between the diameter of the hole and its length. For example, for an 8:1 “aspect ratio” that means the hole’s diameter is 0.20 mm in a 1.60 mm thick PCB.

Reactive flame retardant means chemically bound to the epoxy and will not dissolve and migrate out of the product as part of the waste deposit.

It is difficult to give a precise answer, we recommend you to choose a higher grade material where there are more than 6 layers and thicker than 1.6 mm.