Venture
Your Leading Bergquist thermal clad (Bergquist material) Supplier

High-Quality Bergquist thermal clad (Bergquist material)

  • Over 10 years’ experience
  • Reliable Bergquist thermal clad (Bergquist material) supplier in China
  • Excellent quality Bergquist thermal clad (Bergquist material)
  • Competitive rates
HPL-03015
Venture is a trusted manufacturer of HPL-03015 in China for more than 10 years. Our HPL-03015 is manufactured for high-power lighting.
HT-04503
As a professional manufacturer, Venture can give you the best quality HT-04503. We tend to offer HT-04503 that will suit your needs!

Bergquist thermal clad (Bergquist material) PCB Manufacturing service

Venture has over 10 years of experience in manufacturing high quality of Bergquist PCBs.Bergquist PCB is a laminate with aluminum-based copper that has excellent thermal and mechanical properties.

Bergquist Thermal clad provides thermal management solutions for applications. This board can be used in high power density surface mount.

Metal core PCB and standard FR-4 are common circuit board materials used with power LEDs, venture is your best bet to make this board PCB.

Bergquist material
How to Choose

How to Choose the Highest Quality of Bergquist thermal clad (Bergquist material)?

Here are the steps you can follow to choose the highest quality Bergquist material:

– Before choosing the highest quality Bergquist material PCB circuit, first the customer needs to evaluate their budget

– Second need to check the type of material used in the construction to ensure the reliability and durability of the printed board circuit, before selecting the correct type of Bergquist printed circuit board, check the electrical and mechanical properties of the printed board circuit.

What types of Bergquist material are there?

Bergquist PCBs are available in the following types:
Single-sided printed circuit board
Double-sided printed circuit board
Multilayer printed circuit board

Venture can also produce rigid PCB, rigid-flex PCB, HDI PCB, LED pcb with Bergquist material that you need.

The basics of this printed board circuit are the same, and customers can determine the required board according to their own needs, so that they can get good PCB from us.

types

Venture Bergquist thermal clad (Bergquist material)

Venture is a leading manufacturer of popular PCB materials for high-frequency PCB such as Bergquist thermal clad (Bergquist material). We can manufacture different kinds of Venture Bergquist thermal clad (Bergquist material). No matter what you need for your project, we can provide Bergquist thermal clad HPL-03015 and Bergquist thermal clad HT-04503.

Venture Bergquist thermal clad (Bergquist material) are widely used in a wide variety of printed circuit board applications. These applications have a broad range of solutions for reliability-enhancing heat dissipation within modern electronic devices.

We manufacture different specifications for Bergquist thermal clad (Bergquist material) like HPL-03015, AHT-04503, and many more.

Venture: Your Leading Arlon Material Supplier in China

Are you looking for high-quality Bergquist thermal clad (Bergquist material) for your PCB design? You’ve come to the right place! Venture is more than 10 years in providing Bergquist thermal clad (Bergquist material) to different industries throughout the world.

Venture Arlon materials are manufactured such as are soft, compliant, pre-cut pads that reduce assembly stress while providing excellent thermal conductivity.

We manufacture Bergquist thermal clad (Bergquist material) for different industrial applications:

  • Great for liquid gap fillers
  • Good at thermal gap pads
  • Also, perfect for thermal sil-pads

Moreover, Bergquist thermal clad (Bergquist material) from Venture specialize in ceramic-filled fluoropolymers,  fluoropolymers (PTFE), and low loss ceramic hydrocarbon thermoset laminates. It delivers the electrical performance needed in frequency-dependent circuit applications like direct die applications, two-layer systems using FR-4 circuits or thermal clad circuits, DBC replacement, heavy copper, and other applications.

Venture has a full range of complete Bergquist thermal clad (Bergquist material) in stock to meet your standard applications. We know that there are many options when it comes to Bergquist’s thermal clad (Bergquist material) for your PCB.

We can help you select the bestBergquist thermal clad (Bergquist material) and as well as Bergquist thermal clad (Bergquist material) specifications during your design stage.

Please feel free to contact us today for more info!

Bergquist Thermal Clad: The Ultimate FAQ Guide

Bergquist-Thermal-Clad-The-Ultimate-FAQ-Guide

If you have any question about Bergquist thermal clads, you will find the answer right here.

Whether you want to learn about the properties, benefits, uses, design considerations or available surface finishes; the information you’re looking for is right here.

Keep reading to learn more.

What is Bergquist Thermal Clad?

Bergquist Thermal Clad

 Bergquist Thermal Clad

Bergquist thermal clads are substrates that conduct heat and minimize thermal impedance more efficiently and effectively than printed wiring boards.

You will note that they have mechanically robust substrates in comparison to thick-film ceramics and copper bonds.

What are the Key Benefits of Using Bergquist Thermal Clad?

There are numerous benefits that come with the use of Bergquist thermal clads especially in heat management.

You should consider having the Bergquist thermal clads as part of your appliances due to the following benefits.

Quality Compliance

All Bergquist thermal clads are of very high quality and will serve you for a very long time as it releases minimal pollution.

You should note that Bergquist thermal clads are both REACH and RoHS compliant with halogen-free working specifications.

Minimizes Thermal Impedance

You can use Bergquist thermal clads to increase the process of heat conduction as it minimizes thermal impedance.

They have mechanically robust substrates in comparison to thick film ceramics as well as copper which assist in heat conductivity.

Cost-Effective Solutions

You will spend less in the constriction and purchase of Bergquist thermal clads as it involves the elimination of particular components.

Apart from that, you will enjoy simple designs, make smaller devices and avoid the complicated assembly or fabrication processes.

Reduce PCB Sizes

You will also be in a better position to create and build smaller devices especially with the reduction of printed circuit board sizes.

In other words, it reduces components on the printed circuit boards while minimizing material use thus smaller PCB sizes.

Increase Density of Power

You will also enjoy more efficient conduction of electricity through the Bergquist thermal clads due to an increase in power density.

This implies that Bergquist thermal clads have the ability to conduct more power in the most efficient and sufficient manner.

Extends Dies Shelf Life

You can also rest easy as the Bergquist thermal clads assure you of a life extension of the components such as dies.

It provides proper replacements of the fragile components with stronger and more durable parts that have great mechanical durability.

How Does Bergquist Thermal Clad Improve Performance and Durability?

When you look at Bergquist thermal clads, you will realize that they have a very simple design.

The simple design helps in keeping the components of the Bergquist thermal clad and printed circuit boards cool.

Low thermal impedance in Bergquist thermal clad dielectrics helps in outperforming other insulators for power components thus allowing cooler operations.

It also helps in the elimination of thermal interfaces using solder joints that are thermally efficient.

Apart from that, it employs SMDs to improve thermal performance and voltage breakdown in potted assemblies of thermal clads.

In addition to that, it uses the pick and place assembly method which results in creation of strong and durable components.

In the long run, you will use the Bergquist thermal clads in a more efficient manner for a very long time.

Does Bergquist Thermal Clad Help in Replacement of Hardware and Reduction of Board Sizes?

Yes, you can use Bergquist thermal clads to help in the replacement of different types of hardware while reducing PCB sizes.

You will replace quite a number of components on the printed circuit boards such as heat sinks thus making them smaller.

Apart from that, you have the opportunity of eliminating grease and mica insulators under different power devices thus reducing size.

It uses the direct solder mounting method to help in eliminating other components that make PCBs unnecessarily bigger.

In addition to that, the elimination of the above hardware will help in the improvement of heat transfer on PCBs.

What’s more, you can eliminate interconnects using etched traces on the Bergquist thermal clad boards.

Conclusively, you will eliminate the entire sections of the printed wire boards thus making the devices smaller and saves space.

What are the Main Parts that Make Up the Bergquist Thermal Clad?

Bergquist thermal clads are generally ceramic polymer blends with metal base coating and bonded copper circuit layers.

You will use these materials in the elimination of fragile components while increasing superiority in heat transfers.

To perform these functions, you will depend on the three layers of Bergquist thermal clads which consists of the following:

 Bergquist Thermal Clad Substrate

Bergquist Thermal Clad Substrate

Circuit Layer

The circuit layer is the foil that has the printed-out circuits for the transfer of heat and conduction of electric current.

You can use different sizes of circuit layers which range from 0.5 oz to about 10 oz in standard Bergquist thermal clads.

In addition to that, you can also have custom types or sizes of circuit layers that will fit your application requirements.

Dielectric Layer

At the center of the Bergquist thermal clad, you will see the dielectric layer which offers electrical isolation.

In addition to electrical isolation, you will depend on the dielectric layer to reduce thermal resistance while offering electrical isolation.

You should make the dielectric layer glass-free because the glass carriers help in the degradation of thermal performance.

There are, however, exceptions such as CML which require the glass components for proper thermal clad handling.

Apart from that, you will also depend on the dielectric layer to connect the dielectric layer and the base layer.

Base Layer

You can use different types of metal to manufacture base layers such as aluminium and copper among others.

In most cases, you will maintain a thickness of 1.57 mm of the base layer material such as copper and aluminium.

Despite that, you have the freedom of choosing any base layer thickness that will fit your application requirements.

You should also note that the base layer materials may not be very important in other applications.

What are Some of the Applications of the Bergquist Thermal Clad?

In the modern world, you will have to use different technological innovations to perform varying technological applications.

Well, you will find Bergquist thermal clads as one of the most important components of such technologies.

Here are some of the applications where you will find the Bergquist thermal clad very important.

Power Conversion Applications

You can use the Bergquist thermal clad in power conversion applications because of the small size and Watt density specifications.

You can choose from the numerous thermal performances of thermal clads that are highly reliable and compatible to mechanical fasteners.

Heat Rail and Forming Applications

In the heat rail and forming applications, you can use the Bergquist thermal clads in audio, automotive, and motor control applications.

It will provide such applications with numerous benefits such as attachment capabilities, surface mount assemblies and superior thermal performances.

Solid State Switches or Relay Applications

Due to the mechanically robust and thermally efficient properties of Bergquist thermal clads, you can use it in solid state switches.

You can comfortably add or mount components on the Bergquist thermal clad to improve the performance of relay applications.

Motor Drive Applications

You should consider using Bergquist thermal clads on motor drive applications due to high watt density and dielectric properties.

It also gives you the freedom to fabricate numerous form factors and implement them into integrated or motor drives.

Light Emitting Diode Applications

Thermal clads have the best properties of providing your LED applications with proper thermal management, long life and light output.

You can also configure it into special shapes, thicknesses and bends that will suit the light-emitting diode applications.

 Bergquist Thermal Clad for LED Lighting PCB

 Bergquist Thermal Clad for LED Lighting PCB

How Do You Ensure that the Bergquist Thermal Clads Ensure Long Term Reliability?

Our main aim is to provide you with a long-lasting and perfectly reliable type of Bergquist thermal clads.

It is the reason why we place new Bergquist thermal clad materials under rigorous 12-18 months tests and qualification programs.

You will note that we have state-of-the-art laboratories where we perform extensive testing on electrical integrity on thermal materials.

Apart from that, we use stringent development procedures and adhere strictly to the quality certification requirements such as UL and ISO.

In our testing procedures, we perform extensive research on adhesion, mechanical properties, temperature cycling, electrical and thermal stresses.

Apart from that we also perform audits alongside front qualification tests on thermal, physical and electrical properties.

What is the Process of Selecting the Right Bergquist Thermal Clad Dielectric Materials?

Selecting the right Bergquist thermal clad dielectric material requires you to look at numerous factors.

Implying that, you have to look at different specifications of Bergquist thermal clads that will suit your application requirements.

Here are the main factors that you will look at when considering the right Bergquist thermal clad dielectric material.

  • Type of Dielectric Layer
  • Thermal Conductivity
  • Electrical isolation Properties
  • Thermal Impedance
  • Watt Density

How Do You Select the Dielectric Layer of Bergquist Thermal Clad?

The dielectric layer holds the most important technology of the Bergquist thermal clad.

Your choice of the dielectric layer will either improve or diminish the performance of the Bergquist thermal clad.

It will provide the Bergquist thermal clad with excellent thermal impedance and electrical isolation properties.

In this case, you will select the dielectric layer by looking at a number of factors such as:

  • Electrical Isolation Properties
  • Ability to resist forms of thermal aging
  • Bond Strength Capabilities

How Do You Measure Thermal Conductivity of Bergquist Thermal Clad?

You can use two different methods in the measuring process of thermal conductivity of Bergquist thermal clads.

The two test methods that you can use to measure thermal conductivity are standardized and non-standardized In-house Test Methods.

Here is a brief explanation of measuring the thermal conductivity of Bergquist thermal clads using standardized test methods.

Standardized Test Method

Here, you will look at different test methods that will determine the thermal conductivity of different materials.

You should, however, note that the results of the tests can be different if you use varying methods of testing.

In that case, you should consider using similar test methods especially in the comparison of different substances.

In standard test methods, you will follow the ASTM D5470 and ASTM E1461 test guidelines and methods.

ASTM D5470 is a guarded hot plate test method that will provide analytically derived test values without the use of approximations.

ASTM E1461 is a laser flash diffusivity method that looks at thermal diffusivity as the test method while calculating thermal conductivity.

Are there Non-standard In-House Test Methods for Thermal Conductivity of Bergquist Thermal Clad?

Absolutely, apart from the standard test methods, you can also explore the non-standard test methods for Bergquist thermal clads.

You can achieve different thermal conductivity values by using non-standard methods or in-house methods on the Bergquist thermal clads.

For instance, in case you choose similar dielectric methods, you can come up with different and higher thermal conductivity values.

This is possible through stack-up tests or laminate tests on the base layer of the Bergquist thermal clad.

You can also modify the test by employing other materials of the substrate for the purpose of obtaining different results.

You should, however, note that these test methods do not provide the best and most accurate thermal conductivity results.

What Determines the Electrical Isolation of Bergquist Thermal Clads?

In power applications, you will focus on the electrical isolation of the Bergquist thermal clads.

You will determine the electrical isolation of Bergquist thermal clads by looking at the dimensions.

Bergquist thermal clad dielectrics are available in varying thickness levels from 38 micrometres to 229 micrometres.

Implying that the thickness of the Bergquist thermal clads are the greatest determinants of electrical isolation.

You will also choose the most suitable thickness depending on the isolation requirements of Bergquist thermal clads.

In addition to that, you must also look at the design considerations of Bergquist thermal clads to determine the right thickness.

How Does Thermal Impedance Determine Watt Density of Bergquist Thermal Clads?

There is a very interesting relationship between thermal impedance and watt density of Bergquist thermal clads.

You will look at thermal impedance as the most appropriate measurement that determines the watt density of Bergquist thermal clads.

You will depend on thermal impedance to measure the temperature drop across the stack-up for every watt of heat flow.

In case of a lower thermal impedance, you will get lower junction temperatures thus increasing the efficiency of heat travels.

What are the Considerations of Dielectric Performance in Bergquist Thermal Clads?

You should look at the dielectric performance of the Bergquist thermal clad by looking at specific considerations.

Some of the dielectric performance considerations that you should pay close attention to are:

Peel Strength of Bergquist Thermal Clads

You will realize that the peel strength of the Bergquist thermal clads becomes weaker as the temperature increases.

In other words, the peel strength of Bergquist thermal clads depend greatly on the operating temperatures of the thermal clad applications.

Storage Modulus of Bergquist Thermal Clads

You should also note that an increase in operating temperature translates to a decrease in storage modulus.

It is important to make a choice of Bergquist thermal clad that will best suit your operating environment.

Coefficient of Thermal Expansion of Bergquist Thermal Clads

The coefficient of thermal expansion also increases with an increase in temperature around the operations environment.

You will perform thermochemical analysis to help in the measurements of dimensional stability of different materials as the operating temperature changes.

What Happens to Bergquist Thermal Clads Materials Operating Above Tg?

In case you operate the Bergquist thermal clads above the glass transition temperature, electrical and mechanical properties begin to change.

Some of the mechanical properties that you will note changing are:

  • Copper foil peel strength reduction
  • Increase in coefficient of thermal expansion
  • Decrease in in Thermal clad storage modulus

In case you choose a dielectric with glass transition temperature below operating temperatures, you might reduce residual stress.

Here, there is a great potential that you will reduce residual stress in solder joints, dielectric interfaces, and other interconnects.

Aluminum Bergquist Thermal Clad

 Aluminum Bergquist Thermal Clad

Which is the Recommended Operating Temperature of Bergquist Thermal Clad?

The best operating temperatures of Bergquist thermal clads will depend on your choice of the dielectric.

In case you are working in high-temperature applications, you will use HT Bergquist thermal clads.

In other words, the operating temperature of Bergquist thermal clads is not constants.

It will vary according to the type of Bergquist thermal clad materials that you choose.

What are the Design Considerations of Bergquist Thermal Clad Baseplates?

During the designing process of Bergquist thermal clad baseplates, you have to look at specific considerations.

Here are the main considerations that you should pay close attention to.

Heat Spreading and Coefficient of Thermal Expansion

In this case, you will look at the different type of materials that you will use in making the baseplate.

You should know that different types of metal have varying heat spread capabilities.

You will have to choose the best type of metal with the most suitable heat spreading capabilities for your application requirements.

Solder Joints and Coefficient of Thermal Expansion

You can minimize solder joint fatigue through the proper selection of the base layer materials that will match component expansion.

Implying that you should have a proper match of the right materials with the right coefficient of thermal expansion.

Dimensions on Base Plates

When looking at the dimensions on the baseplate, you will consider the length of the circuit and the thickness of the circuit.

You can choose the most suitable dimensions that will suit your application requirements even though we have standard dimensions.

Electrical Connections on Baseplates

Here, the material that you will choose will also determine the results that you will get from the baseplate connections.

You should consider choosing copper as the most suitable material that provides thermal and electrical efficiency.

Surface Finishes on Base Plates

You can also improve the image or the outlook of the base plate by having a proper surface finish on the base plates.

The standard surface finish that you will find on copper and aluminium is the commercial quality brushed surface.

Size of the Standard Thermal Clads

Well, just like the variations in dimensions, the size of the base plate that you choose is also important.

The standard sizes that you can choose from are:

i. 18 inches (457mm) x 24 inches (610mm) with a usable area: 17 inches (432mm) x 23 inches (584mm)

ii. 18 inches (457mm) x 25 inches (635mm) with a usable area of 17 inches (432mm) x 24 inches (610mm)

iii. 20 inches (508mm) x 24 inches (610mm) with a usable area of 19 inches (483mm) x 23 inches (584mm)

How Much Does the Bergquist Thermal Clad Cost?

The price of Bergquist thermal clad will depend on a number of factors.

One of the most important factors that you will look at is the quality of the materials.

Since copper and aluminium are the most effective materials for base layers, the cost will definitely be high.

On the same note, you will pay a higher price for copper base layers in comparison to the cost of aluminium products.

In addition to that, size factors also play a very important role in Bergquist thermal clad materials.

The bigger the size of copper or aluminium, the higher the amount of money you will pay for them.

What are Some of the Surface Finishes for Bergquist Thermal Clad?

Well, to improve the image of your Bergquist thermal clad, you can use different types of surface finishes.

Here are some of the surface finishes that you can choose from for your Bergquist thermal clads.

  • Hot Air Solder Level (HASL) Surface Finishes
  • Lead-Free Hot Air Solder level (HASL) Surface Finishes
  • Organic Solderability Preservative (OSP) Surface Finish
  • Immersion Silver (Au) Surface Finish
  • Immersion Tin (Sn) Surface Finish
  • Electroless Nickel Immersion Gold (ENIG) Surface Finish
  • Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) Surface Finish
  • Electrolytic Wire Bondable Gold Surface Finish
  • Electrolytic Hard Gold Surface Finish

How Many Standard Sizes of Bergquist Thermal Clad Do You Have?

You can decide to choose from the standard sizes of Bergquist thermal clad or come up with custom sizes.

Here are the standard sizes of Bergquist thermal clad that you can choose from.

  • 18 inches (457mm) x 24 inches (610mm) with a usable area: 17 inches (432mm) x 23 inches (584mm)
  • 18 inches (457mm) x 25 inches (635mm) with a usable area of 17 inches (432mm) x 24 inches (610mm)
  • 20 inches (508mm) x 24 inches (610mm) with a usable area of 19 inches (483mm) x 23 inches (584mm)

The custom sizes that you will choose will depend greatly on the application requirements or specifications.

How Do You Select Circuit Layers for Bergquist Thermal Clad?

There are particular things that you have to pay close attention to when selecting circuit layers for Bergquist thermal clads.

Bergquist PCB Thermal Clad

 Bergquist PCB Thermal Clad

Here are some of the factors that you will look at when you choose Bergquist thermal clads.

Capabilities to Carry Current

It is important to look at the capabilities of current-carrying of the Bergquist thermal clad circuit layer.

You will look at the capabilities of carrying a current of the circuit layer because it provides the component mounting surface.

It also serves as a printed circuit that interconnects different components thus the requirement for current-carrying capabilities.

Capabilities to Spread Heat

You must also look at the capabilities of different materials in the spread of heat through the thermal clad.

In other words, you should choose materials that will help in the faster and easier spread of heat through the thermal clad.

You will also look at the thickness of the foil and dielectric materials that you will use on Bergquist thermal clad.

Implying that, an increase in material thickness brings about an increase in heat spreading capabilities.

What Electrical Design Considerations Do You Look at in Bergquist Thermal Clads?

You should also pay attention to the electric design considerations of the Bergquist thermal clad.

Since the Bergquist thermal clad also has materials that conduct electricity, you need to pay attention to electrical properties.

In this case, the main considerations that you will have a closer look at are:

Proof Test of the Electrical Design

You should perform a proof test on the Bergquist thermal clad to ensure that there are no defects.

It is important to place the number of proof tests at a minimum to reduce exposure of dielectric to high voltage.

Breakdown Voltage of the Electrical Design

Here, you will look at the potential differences where dielectric failure occurs under particular conditions.

You must also place it in electrical insulating materials that are between two different types of electrodes.

It is important to be very careful because the breakdown is permanent and you may not have the ability to recover.

Leakage Current HiPot Testing

You should know that not all the boards in use usually tests alike due to variation in dielectric thickness, and board layout.

It is important to make all the insulated metal substrates resemble parallel plate capacitors during HiPot testing procedures.

Creepage Discharge and Distance

Due to the presence of metal-based layers on Bergquist thermal clads, you will have to look at creepage discharge and distance.

In this case, you should consider using proof testing abilities to ensure that you have proper results pf creepage distance and discharge.

What are the Main Assembly Recommendations of Bergquist Thermal Clad?

Well, there are two main assembly techniques that you should look at for the Bergquist thermal clad.

You will look at solder assembly technique considerations and connect technique considerations.

Let’s have a look at the solder assembly techniques that you have to pay close attention to.

Solder Assembly Techniques

You have to place additional consideration on the solder joint requirements in the assembly of Bergquist thermal clads.

In that case, you will look at the surface finishes as well as the thickness and application of solder plates.

Surface Finishes

There are different types of surface finishes that you can use on the Bergquist thermal clads.

Thickness and Application of Solder Pastes

For long term reliability, it is important to look at final solder joint solder fillet requirements, thickness and component alignment.

It is also very important to have a look at the quality specification standards including IPC-A-610 quality standards.

Which Connection Techniques Do You Use on Bergquist Thermal Clad?

It is also extremely important to have a look at the connection techniques in the assembly of the Bergquist PCB.

Here, you should consider using designs that will capture metal pins without rigidity especially in large major connections.

 Bergquist Thermal Clad Connectors

 Bergquist Thermal Clad Connectors

Some of the connection techniques that you will use are:

Pin Connectors

You will use the pin connectors especially when you are using the FR4 substrates for proper connection.

It helps in the generation of proper stress relief in the solder joints thus improving overall performances.

Power Connections

Here, you will use lead frame assemblies that are soldered to the printed circuit and then bent for shell accommodation and encapsulation.

You can also opt for the stress relief designs and plastic retainers suitable for proper higher amperage.

Custom Connectors

You also have the freedom of choosing the right type of connections that will fit your personal requirements.

In this case, you can design a personal connection that will fit the Bergquist thermal clad connection requirements.

Edge Connectors

Here, you should consider finishing interfacing conductors using electrolytic hard gold plating over sulfamate nickel plating.

You should also include a 45-inch chamfer especially when you are using an edge connector.

What are the Solutions for Surface Mount Applications of Bergquist Thermal Clad?

There are two main solutions for surface mount applications of Bergquist thermal clads.

Here are the main solutions that you will use for surface mount applications of Bergquist thermal clads.

Hi-Flow

You can opt for a Hi-flow family phase change that offers easy application thermal interfaces on different surface-mount packages.

At phase-change temperatures, Hi-flow materials will change from solid and then flow with very little pressure.

It will help in the maximization of wet-out thus increasing heat transfer thus replacing the messy thermal grease.

The main materials that you will use in Hi-flow are DC/DC converters and power modules.

In addition to that, you will realize that the Hi-flow materials are manufactured without or with foil carriers.

SIL-PAD

This is the benchmark that you will use for the thermal interface materials as they are electrically insulating and thermally conductive.

You will have it in different custom shapes, rolls and sheets and also in different thickness levels.

You can also use the SIL-PAD in SMT applications including the following:

i. The interface between different thermal vias in printed circuit boards

ii. Heat sink interfaces to different surface mount packages

Where Do Thermal Solutions of Bergquist Thermal Clad Come Together?

There are two thermal solutions where the Bergquist thermal clads come together.

You can either choose between BOND-PLY and LIQUI-BOND or Gap Fillers and GAP PADS.

Here is a brief explanation of the two points where thermal solutions of Bergquist thermal clads come together.

BOND-PLY and LIQUI-BOND

In this family, you will find materials that are electrically isolating and thermally conductive. You will find it in adhesives that are pressure sensitive or laminating formats.

Some of the applications where BOND-PLY and LIQUI-BOND come in handy are:

i. Bonding of bus bars in different electronic modules and sub-assemblies

ii. Attachment of metal base components to heat sinks

iii. Bonding of heat sinks to different graphic chips, ASIC, as well as CPU packages

iv. Bonding of flexible circuits to thermal planes and rigid heat spreaders

v. Attachment of printed circuit boards to different housing

Gap Fillers and GAP PADS

In this case, you will find lines of thermally conductive materials in liquor or pad dispensation formats.

It exhibits various degrees of compression deflection and thermal conduction.

Here are some of the typical applications of the Gap Fillers and GAP PADS.

i. You can use it on semi-conductors such as BGA or QFP.

ii. You can also use it in between a substrate or printed circuit board and a chassis, heat spreaders or frames.

iii. In spreading of heat to other types of heat spreaders

iv. On sensitive devices for interfacing pressure

What are the Different Configurations of Bergquist Thermal Clad?

There are quite a number of configurations that you can have for the Bergquist thermal clad.

Some of the configurations that you can choose from are:

Custom Circuit Configurations

You can have your personal design parameters that will fit your application requirements or specifications.

Some of the construction parameters that you can choose from include:

i. Recommendations for artwork

ii. Thickness of the dielectric

iii. Requirements of the base metal as well as mechanical configurations

iv. Weight of copper

v. Layouts of the solder mask

vi. Varying and common circuit finishes

vii. Singulation or tooling options

Panel Form Configurations

In this case, you will look at the different dimensions such as base metal sizes as well as the thickness options.

Some of the standard dimensions that you should consider looking at are:

i. 18 inches x 24 inches or (457mm x 610mm)

ii. 18inches x 25 inches (457mm x 635mm)

iii. 20 inches x 24 inches (508mm x 610mm)

You should also look at the foil thickness which ranges between 18 to 350 micrometres.

In addition to that, you should also look at the base plate metals which are:

i. Aluminium 6061-T6 or aluminum 5052-H34 in varying standards from 0.020 inches to 0.190 inches or (0.5mm to 4.83mm)

ii. Copper 110 Full-Hard in varying standards from 0.020 inches to 0.125 inches or (0.5mm to 3.2mm)

Sheet and Roll Format Configurations

In this case, you can have the circuit metal laminate which uses a ceramic filled polymer to form the bonds.

It will form a very strong and thermally conductive bond to the metal heat spreaders thus forming a perfect prepreg alternative.

Here are the standard dimensions for the sheet and roll format:

i. 24 inches (610mm) of the Roll Standard

ii. Maximum roll length of 2000 inches or (610m)

iii. Sheets 18 inches x 24 inches or (457mm x 610mm) and 20 inches x 24 inches or (508mm x 610mm)

Apart from the standard dimensions, you can also opt for custom dimensions for the sheets and rolls.

What is the UL Certification Directory of Bergquist Thermal Clad?

Well, you can refer to the UL certification to help in providing the right quality details about Bergquist thermal clads.

It will give the right quality details about the materials used in the certification process of Bergquist thermal clads.

Apart from that, it will provide you with the quality requirement details on polymeric materials and wiring of printed circuits.

Which Quality Certifications Do Bergquist Thermal Clad Adhere To?

In addition to the UL quality certification, there are numerous other types of quality certifications.

Here are the other types of quality certifications for Bergquist thermal clads.

  • ANSI/AHRI Quality Certifications
  • RoHS Quality Certification
  • International Standards Organization (ISO) Quality Certifications
  • CE Quality Certifications

At Venture Electronics, we will help you find high-performance Bergquist thermal clad for your PCB fabrication needs.

Contact Venture Electronics today for all your Bergquist thermal clads requirements.

Scroll to Top