Blind and Buried Vias
Nowadays our devices are getting more and more portable, at the same time components inside are getting smaller and lightweight, but providing better performance. All these requirements are needed for them to remain functional in a smaller area. This is what blind and buried vias can offer.
What exactly are blind and buried vias?
A blind Vias connects the outer layer to one or more inner layers, but doesn’t go through your whole PCB.
A buried vias connects two or more inner layers, but won’t go through to the outer layer. It is buried within the circuit and completely internal. So it is totally not visible to the naked eyes.
A: Through hole via B: Buried via C and D: Blind Via
What are blind and buried vias advantages?
- Blind and buried vias can help you to meet the high density constraints of lines and pads on a typical design without increasing the overall layer count or your board size
- The vias also help you manage the printed circuit board aspect ratio and limit the change of break out
What are blind and buried vias Disadvantages?
Cost is still the main issue with boards using blind and buried vias, compared to the boards using standard through hole vias. The high cost is due to the increasing complexity of the board and more steps in the manufacturing process. At the same time, testing and precision checks are made more frequently.
Venture engineers can look at your engineering requirements, space needs and the functionality of your PCB to help you reduce costs with buried and/or blind vias.
What are blind and buried vias applications?
In most cases, blind and buried vias are designed in high-density circuit boards (HDI-PCB). HDI PCB (High-density interconnect printed circuit board) is a fast growing part of the PCB industry. It has a higher circuitry density per unit than traditional PCBs. In the past, computers used to fill up an entire room, but now, with HDI technology, you can find HDI boards in laptops, cellphones and watches, as well as other portable consumer electronics such as digital cameras and GPS devices. HDI PCBs play an important role in providing us with a more efficient life.
HDI PCB use a combination of blind and buried vias, as well as micro vias , with our state –of- the-art laser drilling machine (Mitsubishi), laser direct imaging (LDI), we are able to provide you fast delivery services for HDI PCB prototypes. Please check below for our HDI PCB manufacturing capabilities.
|HDI PCB Feature||technical specification|
|layers counts||4 – 30 layers|
|HDI builds||1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D|
|Materials||FR4, Halogen free FR4, Rogers|
|Copper weights (finished)||18μm – 70μm|
|Minimum track and gap||0.075mm / 0.075mm|
|PCB thickness||0.40mm – 3.20mm|
|Maxmimum dimensions||610mm x 450mm|
|Surface finishes available||OSP, Immersion Gold(ENIG), Immersion tin, Immersion silver, Electrolytic gold, Gold fingers|
|Minimum mechanical drill||0.15mm|
|Minimum laser drill||0.1mm advanced|
We’re happy to share everything we know about blind and buried vias from our 10 years experiences. We are trusted by thousands of electronic engineers all around the world through our 100% quality guaranteed policy. With our 2 hours rapid response services from our 24/7 sales and tech support team, and excellent after-sales service, please feel free to contact us anytime.