RO3035

  • Wide variety of RO3035
  • Superior and High-quality RO3035
  • RO3035 fabricated through advanced technologies
  • Full capacity and services

1.Commonly used Information of RO3

Standard Thickness :0.13mm .0.25mm .0.50mm.0.75mm.1.52mm
Standard Panel Size :305*457mm ,610*457mm

Standard Cooper Clandding:1/2 oz .1 oz,2oz (electrodeposited copper foil . other claddings and panels sizes maybe be avaliale,please kind contact us for more information

Information-of-RO3035
test-techniques for RO3035-PCBs

2.What are the test techniques for measuring the dielectric constant of RO3035 PCBs?

With the development of circuit boards to high frequency and high speed, the accuracy of the control transmission line impedance requirements are also increasing,Venture pay more attention on how to measure and select the dielectric constant , we generally use the following three methods of testing.

●Parallel plate method (capacitance method) and Full-plate resonance method
●Band line resonant cavity method

3.How to store RO3035 laminates?

Venture recommends:
●Do not remove the surface packaging (plastic bags or plastic film) from copper-clad boards.
●Insert the board vertically into the insert frame to reduce the risk of damage to the metal surface
●If there is no condition to place vertically

◎The storage shelf must be sufficiently flat and larger than the surface area of the board ,kept smooth and clean.
◎keep clean the surface of the laminate
◎Ensure that the storage shelf bears less than 50 pounds per square foot
Board must be separated from each other by a soft with frictionless spacer

store-RO3035-laminates

RO3035 description

Venture RO3035 laminates can be fabricated into any printed circuit boards through PTFE standard circuit board processing techniques. We manufactured RO3035 with features like:

  • Low dielectric loss
  • Excellent and uniform electrical properties
  • Stable dielectric constant
  • Low in-plane expansion coefficient
  • High thermal conductivity

Your Leading RO3035 Supplier in China

For more than 10 years, Venture is a professional Chinese manufacturer of top-quality RO3035. We manufacture RO3035 that is a ceramic-filled PTFE high-frequency circuit material.

Our RO3035 is manufactured with excellent mechanical and electrical stability at a competitive price. The mechanical properties of our RO3035 consistent whatever the selected dielectric constant.

RO3035 article 1

Venture RO3035 features low dielectric loss. This allows our RO3035 to be used in applications that require 30-40 GHz.

Aside from that, our RO3035 also has excellent mechanical properties. Because of that, our RO3035 can provide reliable multilayer and excellent strip line board constructions.

We also manufacture RO3035 with uniform mechanical properties. This makes our RO3035 perfect for any multilayer board and epoxy glass multilayer board hybrid designs.

The stable dielectric constant of our RO3035 also makes it ideally suitable for microstrip patch antennas, voltage-controlled oscillators, and bandpass filters.

Additionally, our RO3035 is manufactured with a low in-plane expansion coefficient for excellent dimensional stability. Moreover, we designed RO3035 with high thermal conductivity for increased reliability and lower operating temperature in power amplifier applications.

Venture is committed to making innovations and excellence in manufacturing RO3035. Through our latest manufacturing facilities, tools, and equipment, guaranteed that we can supply you the best quality RO3035!

RO3035 article 2

If you are in need of top-quality RO3035 for your projects or business, Venture is the most trusted supplier! Venture is a manufacturer of high-quality RO3035 in China for over 10 years. We have skilled engineers and designers to produce RO3035.

Whether you are a product designer, maker, system integrator, electrical engineer, or retailer, we can always support you through providing budget-friendly RO3035.

We also offer the best delivery conditions and a very flexible payment term. To add it up, we have a customer service team who works 24/7 for your inquiries and to give you assistance.

For more inquiries regarding our RO3035, contact us directly!

RO 3035: The Ultimate FAQ Guide

RO-3035-The-Ultimate-FAQ-Guide

If you have any question about RO 3035 PCB material, you will find the answer right here.

Whether you want to learn about the features, properties, standards or laminate properties, all information is in this guide.

Keep reading to learn more.

What Are the Features of RO 3035 PCB Material?

A high-quality RO 3035 PCB Laminates has the following properties:

Rogers PCB material

Rogers PCB Material

  • Low dielectric constant and loss tangent
  • Excellent and stable mechanical and electrical properties
  • The dielectric constant s stable over a wide range of frequency and temperature
  • The thermal conductivity is high
  • Low coefficient of expansion
  • Compatible with lead-free processing techniques
  • Easy to manufacture in large volumes

What Are the Benefits of Using RO 3035 PCB Material?

RO 3035 is a core product from RO 3000 circuit laminates whose designs provide exceptional mechanical and electrical stability at affordable prices.

Using RO 3035 materials manufactured by Rogers Corporation will deliver the following benefits:

  • Operate at higher radio frequencies of between 30 to 40GHz due to low dielectric loss.
  • Ideal for fabricating excellent strip lines and reliable multilayer boards as a result of uniform mechanical properties over a wide range of frequencies.
  • Ideal for the construction of bandpass filters, voltage-controlled oscillators, and microstrip patch antennas because of the stable dielectric constant.
  • An excellent choice for manufacturing highly reliable power amplifiers with lower operating temperature
  • Globally available and thus is suitable for use in a multi-site production

Why is RO 3035 PCB Laminates Suitable for Use in The Following Applications?

RO 3035 high-frequency PCB laminate is an ideal material for the fabrication of top-notch, quality PCBs for use in commercial microwaves, and radiofrequency applications.

As a result, RO 3035 PCBs are ideal for use in the following applications:

High frequency PCB material

High-frequency PCB material

Communication Systems

RO 3035 laminate comes from a line of prime PCB laminate materials, that is, the RO 3000 series.

These products are suitably fabricated for commercial microwave and RF applications at competitive prices.

RO 3035 is suitable for the construction of high-quality communication materials because it provides stable electrical and mechanical properties over a wide range of frequencies.

You will use for:

· Power Amplifiers

This material offers superior electrical properties which play a critical role in the provision of efficient and optimal power output.

Such properties include; high thermal conductivity, low loss tangent, extended aging when subjected to heat, and provision of stable electric features under heat.

Digital Communication Control Circuitry

You will need precision circuitry that can maintain the integrity of high-speed signals when operating advanced microwave communication systems.

To this account, RO 3035 PCB laminate provides a low dielectric constant and loss tangent that supports lower crosstalk, higher data rates, and faster switching.

These factors coupled with low conductor loss rolled copper can enable you to expand the performance of RO 3035 for application up to 77 Gbps.

Power Amplifiers

You can use RO 3035 PCB laminate materials to fabricate PCBs for use in high power amplifiers that transmit cellular signals and IOT and mobile users.

RO 3035 PCB laminate offers high thermal conductivity and low loss tangent.

These properties enable the design and fabrication of PCBs for power antennas that can provide higher data rates without reducing coverage area for cell sites.

Antenna Systems

RO 3035 offers superior PCB qualities that provide design solutions in the case of demanding requirements of automatic radar systems and military antennas.

Consequently, RO 3035 PCB laminate offers a very loss tangent at a high frequency.

Thus, you can use this PCB material to manufacture highly reliable and Antenna materials with consistent performance

You will use it in the following applications:

Patch Antennas

RO 3035 material has a stable dielectric constant over a wide temperature and frequency range and precision thickness control.

These properties make the product suitable for constructing conformal antennas and thick antenna structures.

Phased Arrays

RO 3035 offers low and stable dielectric constant and loss tangent which is desirable construction of phased-array antennas.

It also possesses stable electrical and mechanical features, characteristic of other RO 3000 laminate series, making it ideal for the construction of high-speed digital PCBs and multilayer RF PCBs.

Conformal Antennas

Rogers materials offer ideal substrate options for the fabrication of conformal antennas which are associated with non-planar requirements.

These material options are usually “soft substrates” and ideal for constructing products like small diameter cylinders with simple curvatures.

Active Electronically Scanned Array (AESA)

RO 3035 PCB laminate material is ideal for the fabrication of an AESA application.

This is because it supports the efficient construction of multilayer boards that are characteristic of AESA applications.

RO 3035 also has stable electrical and mechanical features that enable controlled phase accuracy over temperature and frequency.

The low in-plane expansion and excellent thermal conductivity also enhance reliability over power cycling.

Antennas for Hand-Held Devices

Modern handheld devices possess Wi-Fi and cellular antennas that use frequencies in the range of1 to 6GHz.

These devices usually possess high-performance antennas that can access the internet through either local Wi-Fi access points or global mobile networks.

Similarly, the antennas should also enable the devices to act as mobile hotspots.

To provide reliable high-performance antennas, you will need PCB laminates with precise dielectric properties, conductor width, and spacing.

RO 3035 has a low dielectric constant and loss tangent that is suitable for fabricating precise and reliable RF PCBs.

Furthermore, it provides stable dielectric constant versus temperature and stability overheat, making it ideal for use in challenging environments where mobile devices operate.

Is RO 3035 PCB Laminate Environmentally Friendly?

Yes, RO 3035 PCB laminates very safe for the environment and health of the handling personnel.

Specifically, RO 3035 laminates are compatible with lead-free processing methods and compliant with RoHS.

Besides, it also uses halogen-free fire retardant technology.

· RoHS Compliance

Compliance with RoHS (Restriction of Use of Hazardous Substances) ensures that your RO 3035 PCB laminate contain the allowable limits specific hazardous substance.

These substances are contained in the European Directives 2002/95/EC and Directive 2011/65/EU, also known as RoHS and RoHS2 directives, respectively.

Compliance with RoHS directives limits the use of these hazardous substances.

The substances can pose a risk to the environment and human health in the case of inadequate e-waste treatment.

Furthermore, the directives also increase the quantity of e-waste that undergoes proper treatment while reducing volumes to be disposed of.

· Halogen-free Fire Retardant Technologies

RO 3035 PCB laminate is halogen-free materials that adhere to the standards of IEC 61249-2-21 that outline requirements for constructing halogen-free PCBs.

Halogen compounds such as chlorine, fluorine, and bromine have been previously used in the manufacture of PCBs for various reasons.

Most importantly, you can use them to enhance the flame retardant properties of the PCB laminate.

Halogen-free laminates should contain less than 900 ppm of bromine or chlorine and cumulative less than 1500 ppm of halogen-based materials.

However, these compounds have more disastrous effects on human health and the environment which outweigh their benefits.

The compounds are highly reactive and form salts.

They also produce toxic chemicals and dioxins when released into the e-waste systems and can be extremely deadly carcinogens.

What are the Properties of a Quality RF PCB Material?

When selecting a PCB substrate for the construction of your radio frequency PCB, you should consider both system requirements and material requirements.

The following material parameters are highly desirable:

Radio frequency material

 RF PCB

  • Low insertion loss
  • Low dielectric constant
  • High thermal conductivity
  • Smoother copper surface
  • The dielectric constant and dissipation factor should remain consistent over the operating bandwidth.
  • The dissipation factor and dielectric constant should show good stability over a wide temperature range.
  • The decomposition temperature should be high
  • Low in-plane and stable Z-direction coefficient of thermal expansion
  • Low water absorption
  • Tight dielectric tolerance

What Is the Difference Between RO 3035 Process Dielectric Constant and RO 3035 Design Dielectric Constant?

Rogers Cooperation uses different methods to test the dielectric constant (Dk) of their PCB laminate materials which result in two sets of Dk values.

The process Dk value for RO 3035 PCB laminate results from testing the material using tests methods defined by IPC.

This method confirms whether the material’s dielectric performance meets the test limits set for manufacturing.

On the other hand, Design Dk values arise from the microstrip differential phase length method, which is a defined test method for Rogers Cooperation.

Consequently, this type of testing utilizes the microstrip transmission line that is accustomed to the customer’s real design.

The process Dk value is usually the real dielectric constant of the material and always a little higher than the design Dk value.

However, the effects of copper roughness always slow down the propagation of signal waves which reduces the processes Dk to a little bit below the design Dk value.

The difference between the process Dk value and the design Dk value highly depends on the roughness of copper.

Also, the difference results from the effects of copper type and roughness on the design Dk values.

Using a rougher copper will affect your design Dk more, resulting in higher design Dk values than when you use smoother copper.

Using a smoother copper at the manufacturing stage delivers a design Dk value that is very close to the process Dk value.

How Can You Measure the Dielectric Constant of RO 3035 PCB?

You can use several methods to determine the Dk values of RO 3035 PCB laminate.

There are more than 20 methods available for determining the Dk of a PCB material.

You should select a testing method that is widely accepted as industry standards and capable of supporting high volume measurements within a short time.

You can use the IPC defined test methods, such as stripline homogeneous resonators at 10 GHz.

This method will give you accurate material design Dk values when you use it for modeling purposes like computer design software.

However, other methods like stripline methods will deliver more accurate simulation results.

This is true when you are testing your design at a different frequency or different circuit structures.

The dielectric constant values of RO 3035 PCB material will depend on the following factors.

  • Copper type and specific material thickness
  • The surface roughness of copper

You should note that RO 3035 laminate is a composite of several individual materials including PTFE and ceramics.

Each of these materials has its specific Dk values because they have different electrical susceptibilities and polarization potential.

Consequently, you should use the Dk values you get or those presented in datasheets as approximate values.

Hence, use them as guidelines when fabricating high-frequency PCB designs and not as strict rules.

How Does RO 3035 Laminate Compare to RO 3003 Laminate?

RO 3000 PCB laminate series possess consistent and stable mechanical and electrical properties irrespective of the Dk values.

Henceforth, you will easily develop multi-layer boards using laminates with different Dk values at each layer without experiencing reliability and war-page problems.

The comparison of RO 3035 and other RO 3000 laminate series are described in the table below:

Typical values  
PROPERTYRO 3035RO 3003RO 3006RO 3010DirectionUnits
Process Dk3.50 ± 0.053.00 ± 0.046.15 ± 0.1510.2 ± 0.30ZNA
Design Dk3.63.06.511.2ZNA
Dissipation factor0.00150.00100.00200.0022ZNA
Thermal Coefficient-45-3-262-395Zppm/°C
Surface Resistivity107107 105105MW
Volume Resistivity107107105105MW•cm
Dimensional Stability-0.11     0.11-0.06

0.07

-0.27

-0.15

-0.35

-0.31

X

Y

mm/m
Moisture Absorption0.040.040.020.05%
Thermal Conductivity0.500.500.790.95W/m/K
Decomposition Temperature500500500500°C TGA
Density2.12.12.62.8gm/cm3
CTE (-55 to 288C)17

17

24

17

16

25

17

17

24

13

11

16

X

Y

Z

ppm/°C
FlammabilityV-0V-0V-0V-0
Lead-Free Process CompatibilityYESYESYESYES
Copper peel strength10.212.77.19.4lb/in

What is the Thermal Coefficient of Expansion of RO 3035 Laminate?

The thermal coefficient of expansion is also known as the Coefficient of Thermal Expansion (CTE) of a material.

This property measures the unit change in the dielectric material’s size with an increase or decrease in heat.

Typically, a PCB laminate will expand volumetrically, that is, in-plane in the X-Y direction and out-of-plane in the Z-direction.

The material should exhibit the lowest expansion in the X-Y direction.

Consequently, RO 3035 PCB material has one of the lowest in-plane expansion of 17 ppm/°C for both X and Y directions.

This low in-plane expansion characteristic that resembles that of copper gives RO 3035 laminate excellent dimensional stability.

The advantage thereof is the ability to efficiently mount the surface assemblies and compatibility with temperature-sensitive applications.

RO 3035 also has a low Z-axis CTE of 24 ppm/ °C, which is ideal for the provision of reliable plated-through holes even under the harshest of conditions.

What Lead-Free Processing Techniques Can You Use to Fabricate RO 3035 Laminates?

You can observe different SMT assembly processes that come in handy when producing RoHS compliant PCBs.

You can consider the following:

· Materials

Consider using alternative surface finishing that does not contain lead such as organic solder preservatives or lead-free hot air soldering.

Ensure that your solder masks are thermally stable

Use pure tin as the etch resist

· Assembly

Reflow:

  • Optimize the reflow profile for your RO 3035 material.
  • Avoid infra-red ovens and use the conventional ovens
  • Check your equipment’s temperature range and maintain good temperature control
  • You can perform the process under an inert gas atmosphere

Soldering

  • Use inert gas atmosphere
  • Ensure your wave design is optimized
  • Take account of increasing copper levels in the process of replenishing bath
  • Optimize your equipment to resist damage from high temperatures

Health and Safety

  • Do not expose yourself to lead fumes
  • Use the appropriate protective measure to account for the high temperatures used
  • Ensure that you appropriately select the solder alloys
  • Avoid unnecessary excess solder temperatures which can damage your equipment

Why is RO 3035 Laminates UL 94 Flammability Rated V-0?

UL 94 flammability standards are guidelines that describe flammability safety for plastic materials that are parts in appliances and devices.

These standards were released by Underwriters Laboratory and describe whether a material will spread or extinguish flame once you ignite the specimen.

V-0 flammability test is a vertical test, typically conducted on a laminate strip measuring 5 inches long and 0.5 inches wide. You can vary the thickness.

Following the test conditions recommended by Underwriters Laboratory, your RO 3035 must meet the following standards to be rated UL 94 V0 flammability compliant.

  • RO 3035 must not burn beyond 10 seconds with flaming combustion after removing the burner
  • The cumulative combustion time for the five specimen replicates should not exceed 50 seconds
  • Any RO 3035 specimen should not burn up to the holding clump
  • Dripping flaming particles must not ignite the cotton indicator placed below the specimen
  • After removing the second burning flame from the RO 3035 specimen, the glowing combustion must last less than 30 seconds.

What Are ASTM Standards for PCB Fabrication?

There are several ASTM test methods that you can use to test the properties of RO 3035 PCB laminates.

ASTM laboratory testing standards help harmonize test methods.

It does so through specifying standard designs, dimensions, and types of equipment and apparatus for use in testing various aspects of PCB laminate.

Following these standards will enable you to ascertain quality and workmanship.

What is The Decomposition Temperature of RO 3035 Laminate?

Rogers PCB material

Rogers PCB material

The decomposition temperature (Td) of a PCB laminate is the temperature at which the laminate starts to chemically decompose.

Usually, it is the temperature at which the material has lost 5% of its original mass.

This Rogers PCB laminate has a very high Td of 500°C TGA which makes it suitable for high-frequency application.

Specifically, high-frequency applications require more power and thus highly likely to produce high-temperature situations.

Your RO 3035 PCB laminate is capable of maintaining optimal operation under such stressful, high heat situations.

Similarly, the high decomposition temperature (Td) of RO 3035 PCB laminate makes it compatible with lead-free processing techniques.

These techniques usually operate at about 30°C above the traditional lead processing techniques, that is, about 260°C.

Unlike the glass transitional temperature (Tg) which permits the material to revert to its original conditions once the temperatures cool, Td doesn’t.

It is an irreversible process that distorts the material’s dielectric property forever.

When considering RO 3035 PCB laminate for your application, ensure that your operating temperatures can be higher than Tg but lower than Td.

How Long Can You Store RO 3035 Laminates?

Just like any other RO 3000 series laminate, you can store RO 3035 PCB material indefinitely under normal ambient conditions.

You can either store your RO 3035 laminates in their original shipping cartons or remove them from the original shipping containers and store them on shelves.

When storing in original packing containers, then you should observe the following:

  • Keep the cartons stack on sides if nothing heavy is placed on top or bottoms down away from moving and handling equipment.
  • Do not exceed five cartoon stacks to avoid exerting excessive pressure on the lowermost box

In case of storage after removing the original shipping container, observe the following:

  • Store the thin panels while still attached to the adhering polythene sheets and bags. The polythene will offer protection against oxidation, corrosion, and mechanical damage.
  • Store the panels in slotted shelving while maintaining a vertical clad surface to ease access and prevent any risks of metal surface damage.
  • Where vertical sacking is not possible then:
    • Store horizontally on clean, smooth, and flat shelves
    • Use shelves that are larger than the full area of the panel you are storing
    • Remove all debris from the laminate’s surface.
    • Do not exceed a shelf loading of more than 50 pounds/ft2
    • Use a soft, non-abrasive separator sheet to interleave the panels

What Factors Affect the Performance of RO 3035 Laminates?

The efficiency of RO 3035 laminates depends on several factors.

Some of these factors depend on the inherent features of the material while others depend on the conditions of the operating environment.

Consequently, how good your RO 3035 material perform will rely on:

  • Thermal management efficiency of the PCB
  • The dielectric constant temperature coefficient
  • The insertion loss include radiation loss, dielectric loss, conductor loss, and leakage loss
  • The roughness of the copper surface
  • The dissipation factor
  • The thickness of the copper
  • Thermal conductivity of the laminate
  • The thickness of the laminate
  • Type of cladding used
  • The type of solder mask or surface finishing used

Can You Use RO 3035 Laminates to Fabricate Multi-Layer Circuit Boards?

Yes.

RO 3035 PCB material is an ideal material for constructing multilayer PCBs.

This material has stable mechanical and electrical properties that easily complement the features of other RO 3000 laminate series.

The stability makes it easy to fabricate a multilayer PCB using laminates with a different dielectric constant for each layer.

You will not experience any functionality problems and war-page as a result of incompatibility.

You can use this type of PCB in applications that operate at a different dielectric constant over a wide range of frequencies and temperatures.

Why is Thin RO 3035 Laminates More Suitable for Fabricating PCBs for Use in High-Frequency Applications?

Using thinner PCB laminates have both advantages and disadvantages that you should carefully consider before settling for the decision of using thin laminates.

Some of the key advantages of using a thinner laminate are the reduced weight and low profile making them ideal for use in portable and mobile devices.

Thinner laminates are also desirable for higher frequencies, that is, 30 GHz and above.

They will help prevent unwanted signal propagation modes that are characteristic at such high frequencies.

The unwanted traveling waves can distort the intended circuit wave propagation.

Thinner RO 3035 PCB laminate has a very low dielectric constant and loss tangent.

You can use a wider conductor when your RO 3035 has a low Dk value and you need to maintain controlled impedance lines.

Do RO 3035 Laminates Have Any Limitations?

RO 3035 PCB material is costlier than standard FR-4 PCB material.

The higher cost is due to higher manufacturing costs associated with PTFT based laminates.

RO 3035 is also highly susceptible to oxidation and corrosion when stored or when operating under high temperature and humid conditions.

What Factors Should You Consider when Disposing of RO 3035 Laminates?

You should follow the regulations laid down by your local authority on how to dispose of RO 3035 PCB laminates.

Alternatively, you can follow the recommendations of the Waste Electrical and Electronic Equipment Directive (WEEE).

The directive is Highlighted under European Community Directive 2012/19/EU and addresses issues associated with the collection and recovery of electronic type wastes.

Accordingly, you should have a system of collecting the used PCBs and returning them to the manufactures and designers for recycling.

Rogers 3000 series laminate

Rogers 3000 laminate

Why Should You Buy Your RO 3035 Laminates From China?

Importing your RO 3035 PCB laminates from China will offer you numerous cost-benefit advantages compared to buying from any other destination

Chinese companies will deliver the materials to you at a cheaper price which will enable you to make substantial profit margins when selling at home.

You will also be able to get wide variants of the laminate’s availability and complementing products.

The quality is up to standard and the delivery time is very fast.

For any questions or inquiry about RO 3035 laminates, contact the Venture Electronics team now.

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