• Full range of RO3006
  • High-quality RO3006
  • The best delivery options
  • Competitive price and flexible payment terms

What quality certification does Rogers RO3006 have?

If you are looking for quality Rogers RO3006 material, Venture Electronics can offer you the RO3006 with the below quality certifications:

1.REACH Certification
2. UL certification
3. CE Certification
4. BSI Certification
5.RoHS Certification


Can you do multilayer with RO3006?

Yes, Venture can do multilayer PCB with RO3006 material. Venture Electronics gets the material from the material agent, as well as the pre-preg material and produces the blank circuit boards. If you want Venture to build for your projects, you will enjoy the advantages as below:

1. No Minimum order quantity
2. Reasonable price
3. 100% on time delivery
4. Excellent quality that you will enjoy
5. Quick turn in 3 days

Is there other Rogers material other than RO3006 material?

Yes there are many material except RO3006. Such as: RO3003. RO3010, RO3035, RO3210 in series#3.

They all have the advantages of following:
1) Lowest loss commercial laminates
2) Available in a wide range of Dk (3.0 to 10.2)
3) Available both with and without woven glass reinforcements
4) Low Z-axis CTE provides plated through-hole reliability


RO3006 description

Venture is an expert manufacturer of RO3006 in China for more than 10 years. Our 10 years of experience means that we can manufacture the highest-quality RO3006. We manufacture RO3006 with the following features:

  • low dielectric loss
  • volume manufacturing process
  • stable dielectric constant
  • uniform and excellent mechanical properties

Your Leading RO3006 Supplier in China

Venture manufactures RO3006 that is a ceramic-filled PTFE high-frequency materials intended for RF and commercial microwave applications.

Our RO3006 is specifically designed to provide outstanding mechanical and electrical stability at an affordable rate. We designed RO3006 with a low dielectric loss so that it can be perfect for applications with 30-40 GHz.

RO3006 article

Its superior mechanical properties allow our RO3006 to offer extremely reliable multilayer and stripline board constructions.

It is also equipped with uniform mechanical properties that make it suitable for multilayer and epoxy glass multilayer board designs.

Aside from that, our RO3006 is fabricated with a low in-plane expansion coefficient for a reliable surface mounted assemblies and superior dimensional stability.

To offer economical RO3006 laminate pricing, it undergone a volume manufacturing process. Typical applications of our RO3006 includes:

  • remote meter readers
  • direct broadcast satellites
  • pager and cellular telecommunication system
  • automotive collision avoidance system
  • power backplanes
  • datalink on cable systems
  • patch antennas; and more

RO3006 article 2

If you want a high-quality RO3006 for your business or project, don’t hesitate to rely on Venture! For more than 10 years, Venture became a professional in manufacturing RO3006! We are a trusted Chinese supplier of RO3006!

We also offer flexible payment terms along with excellent delivery options without minimum order required. More great deals are available if you purchase your RO3006 at Venture!

Venture has a supportive customer service team to assist you. We can guarantee you a hassle-free transaction and excellent after-sales service!

For your orders, contact us directly!

RO 3006: The Ultimate FAQ Guide


If you’re looking for RO 3006 PCB, read this guide.

You’ll find all information you’re looking for right here.

Keep reading.

What are the Features of RO 3006 Laminate?

RO 3006 PCB laminate materials is a PTFE composite filled with ceramics and specifically designed for superior electrical and mechanical stability.

It possesses the following key features:

  • Low Coefficient of Thermal expansion along the X, Y, and Z planes.
  • Low dissipation factor
  • A dielectric constant of 15 +/- 0.15 which is stabilized over a wide range of temperature
  • Superior mechanical versus temperature properties
  • Easy to manufacture in large volumes

PCB material

 PCB material

Why use RO 3006 Laminates?

RO 3006 PCB laminate possesses excellent mechanical and electrical properties for cost-effective applications.

Below are some of the benefits of using RO 3006 laminates:

  • High-quality materials with ISO 9001 certification
  • Cost-effective compared to other RO PCB laminates
  • The mechanical properties are comparable to other RO 3000 series laminates. This feature enables the easy and efficient design of multi-layered boards.
  • Ease of volume production makes laminate pricing economical
  • Has a lower in-plane expansion giving it superior dimensional stability and enables efficient and reliable mounting of surface assemblies.

Furthermore, this property also makes RO 3006 laminate suitable for use temperature-sensitive application.

  • It is ideal for the construction of multi-layer boards and strip lines.

Where can you Use RO 3006 Laminates?

You can use RO 3006 laminates for fabricating PCBs for use in a wide variety of applications. Some of these applications include:

  • Automotive radars
  • Antennas and power amplification for cellular telecommunication systems
  • Antennas for global positioning satellites
  • Wireless communication patch antennas
  • Cable system’s datalink
  • Direct broadcast satellites
  • Power backplanes
  • Remote meter readers

How does RO 3006 Compare to its Counterparts in the 3000 Laminate Series?

RO 3006 material has a dielectric constant of 6.15 ± 0.15 while the other 3000 laminate series have either 3.0, 3.5, or 10.2.

You can also fabricate small size circuit boards using RO 3006 material compared to low Dk materials such as RO 3003 and RO 3035 materials.

 Roger PCB

 Rogers PCB

What Product Safety Concerns are there for RO 3006 Laminate?

You should follow the following tips to ensure that you maintain high levels of product quality and reduce risks of workplace accidents.

  • Ensure that you wear appropriate protective gear to avoid inhalation, skin or eye contact, and inhalation of the dust created during machining.

Though the glass filaments are not classified as carcinogenic to humans, eye and skin contact can cause mechanical irritation.

Inhalation will irritate the respiratory system and has characteristics of polymer or metal fume fever.

  • Avoid processing RO 3006 laminate above the material decomposition temperature to prevent the emission of toxic fumes.

The fumes can present catastrophic effects on employees with underlying health issues.

Otherwise, inhalation can cause flu-like symptoms accompanied by muscle aches, chills, and fever that will last for 24 hours or more.

  • Fire will emit toxic fumes that can be dangerous to firefighters and employees.

In case of fire break out, ensure that you have a surplus supply of breathable oxygen.

Also, wear protective gear and eye goggles to protect you from irritating dust particles.

  • Ensure that you follow the appropriate product disposal guidelines outlined by your local regulatory bodies.

Do not direct the wastes into sewer systems and soil or surface water. Also, avoid unnecessary burning without appropriate safety measures.

  • Ensure that you suit yourself with ideal protective gear during routine handling operations.
  • Install appropriate ventilation systems to provide sufficient protection to employees in the work stations against exposures.

In case the available ventilation system is inadequate or is lacking, then use respirators approved by NIOSH.

  • In the case of exposure, then you can conduct effective first aid as listed below.
    • In case of inhalation of toxic fumes or dust, then move the victim to fresh air and seek medical attention when the symptoms persist.
    • Immediately flush your eyes with continuous running water for 15 to 20 minutes when your eyes come into contact with the dust.
    • Also, flush your skin after removing the contaminated clothing in case of skin contact with dust particles. Avoid rubbing your eyes or skin in both cases.
    • Always seek medical assistance when you ingest the dust.

How does RO 3000 PCB Laminates and RO 3200 PCB Laminates Compare?

RO 3000 PCBs have been fabricated using RO 3000 laminate series.

These series of laminates are uniform, filled PTFE composites ideal for the provision of homogeneous electrical and thermal properties.

On the other hand, RO 3200 laminate series provide similar electrical and thermal properties with the added advantage of easy handling and registration control.

These added advantages arise from glass reinforcement which is added to the principal constituent for RO 3000 series laminates.

Rogers PCB Material

Rogers PCB

What are the Fabrication Guidelines for RO 3006 Laminates?

You should observe the fabrication guidelines provided for RO 3000 laminates when working RO 3006 laminates.

You can use these fabrication guidelines to constitute both double-sided and multi-layered boards.

Consequently, the following key considerations will come in handy.

· Storage

You can store RO 3006 material indefinably under a favorable ambient environment.

To store the materials in original shipping containers, you need to:

  • Select a flat surface for stacking the cartoons away from moving handling equipment. You can stack the cartons with the bottom part facing down though you can also stack them on their sides if you don’t place heavy materials on top.
  • Do not exceed five cartoon stacks to prevent excessive pressure on the lowermost cartoons.

Once you remove the RO 3006 laminates from their original shipping containers, then you should observe the following:

  • Store the thin layers with the original sealing within the polythene bags and with the polythene sheets adhering to the thicker cores.

The sealing protects against mechanical damages, corrosion, and oxidation of the metal layers.

However, the anti-tarnish layer will not protect RO 3006 laminates with thick copper plates.

As such, you can observe some discoloration on your laminates, especially when the storage conditions are of high humidity and temperature.

You can remove the oxidation through standard PCB fabrication processes such as chemical exposure (micro etch) or mechanical (deburr).

  • Place the panels on edges in slotted shelving units while maintaining a vertical clad surface.

This technique reduces the risk of metal surface damage by providing easy access to laminates.

  • In case your storage facility does not allow you to stack the laminates vertically, then ensure the following:
  • Remove all debris from the laminate’s surface
  • Keep flat, smooth, and clean shelves
  • Maintain the shelf loading to below 50 pounds @ square feet
  • Use a shelf that is larger than the area of the panel you are storing
  • Use soft, non-abrasive separator sheets to interleave the panels

· Handling

You should follow proper handling procedures to avoid damage to RO 3006 laminates since it is softer compared to most rigid PCB fabrication materials.

Consequently, you should follow these steps for better results:

  • Maintain a clean, dry, and debris free working surface
  • Do not remove the polythene sealing during initial processing procedures including sawing, shearing, punching, and blanking
  • Use flat carrying trays that are interleaved with soft and sulfur-free paper to transport the cores between work stations during processing.
  • Thinner cores lack the ability to self-support using a single corner or edge. Consequently, you can only pick these panels using two edges to avoid the risk of dimensional dielectric distortion and permanent crease.
  • Put on non-absorbent material or nylon gloves when handling RO 3006 laminates. Skin oils in bare hands are slightly acidic and can corrode the material.

Similarly, fingerprints are very problematic to remove because using a standard brightener dissolves the corrosion but leaves residues of corrosive oil in copper.

This causes the reappearance of fingerprints either in hours or days.

You can successfully remove fingerprint through:

  • Using dilute hydrochloric acid for bright dipping
  • Degreasing in methyl ethyl ketone or acetone. You can also vapor degrease using chlorinated solvents.
  • Rinse using water and bake at 125°C for 60 minutes until completely dry.
  • Repeat the bright dipping procedure.

· Preparation of Inner Layers

You can use multiple tooling systems with RO 3006 laminates.

These can include either internal or external pinning, slotted or round pins, post-vs pre-etch punching, or multiline vs standard tooling.

The choice of a particular method solely relies on the capabilities and preferences of your facility and the product’s final registration.

You should always retain copper in the vicinity of the tooling holes despite the method used.

Generally, you will improve the registration of RO 3006 material when you retain as much copper as possible around the holes.

· Preparing Surface for Photoresist Applications

You should use chemical processing constituting a micro etch and organic cleaner to prepare the copper surfaces for coating with fil or liquid photoresist.

You can also use a conveyor spray system that has suspended abrasive materials in the solutions to prepare the copper surfaces.

However, using mechanical scrubbers will give you the best results when using thick cores, that is (0.060″ and above).

You should reduce the pressure to avoid laminate distortion or creating deep scratches that affect the function spacing between planes of copper.

· Photoresist Application

You can use either of the following traditional methods to apply liquid or dry film photoresist.

  • Dip or spray coating
  • Roll lamination
  • Screening

· Processing DE

You can use standard copper etchants, strippers, and developers used for processing epoxy glass materials.

Since RO 3006 material is filled with ceramics, it will require more intense rinse and bake processing as determined with the next sequence process.

· Oxide Treatment

You should follow the recommendation of your adhesive system supplier when selecting the best oxides and oxides alternatives.

You should follow high temperature and high caustic processes with intense rinsing and baking of the inner layers.

Rogers PCB Material

 Rogers PCB Material

Final Preparation

If you provide sufficient substrate surface protection after copper etch, then you won’t need to use sodium or plasma processes to apply special pre-treatment of the etched surfaces.

You should bake the inner layers at between 110°C to 125°C for 30 to 120 minutes to remove volatile substances before MLB bonding.

Multilayer Adhesive Systems

You can use a broad range of thermosetting and thermoplastic adhesive systems for RO 3006 laminates.

However,  the best overall choice also depends on other factors such as flow characteristics, electrical performance, required bond temperatures, and ease of processing.

Multilayer Bond Cycles

This depends on the selected adhesive system’s requirements.

You need to apply pressure while cooling through thermoplastic films.

Processing outer layer/double-sided circuits and PTHs

 Rogers PCB

Rogers PCB Material


You should drill double-sided boards as one-ups or stack them into heights that are compatible with the flute length of your drills.

You can use sheeted aluminum, phenolic composites, or phenolic coated metals as entry and exit layers.

You should use a surface speed of between 150 to 300 SFM and chip loads of between 0.001″ and 0.003″ per revolution.

The tool diameter determines the drill speed and the slower speeds usually accompany finer diameter drills.

When drilling double-sided and multi-layer boards, use a retract rate of 300 and 500 IPM.

You should also use 700 and 1000 IPM when drilling double-sided constructions.

The tool life should depend on the cross-section hole’s inspection.

You can start by observing the ’12-inch rule” which recommends replacing the tool after drilling 12 inches of a multi-layer substrate.


To limit the risks of copper burring, use limited hit counts, conservative drilling parameters, and entry materials that are flat and rigid.

Your cores will be ready for subsequent processing if you drilled them properly.

You should always go for chemical micro etch if you need to deburr.

Otherwise, select a hand pumice scrub over suspended abrasive spray and conveyorized mechanical deburr when you have to use a mechanical process.

· Preparation of Through-hole

You can remove debris that is loosely attached to the holes using the hydro-honing or vapor process.

The processes involve passing water with suspended abrasives through the holes.

You should apply either plasma or sodium pre-treatment on RO 3006 laminates before depositing a conductive seed layer.

The pretreatment helps avoid substandard metal adhesion and plated voids.

· Metallization

You can use traditional direct deposit or electroless copper metallization for RO 3006 laminates.

Unless you used plasma to prepare the walls of holes, then bake the cores at 110°C-125°C for 30 to 90 minutes.

· Final Surface

You should rinse the material in warm water for 30 minutes and bake it at 125C for one hour, under a vacuum before application of a solder mask.

You can use a wide variety of solder masks such as HASL, OSP, Sn, Ni/Au, and Ag for RO 3006 material without experiencing any incompatibility issues.

What are the Product Specifications for RO 3006 PCB Laminates?

RO 3006 laminate possess the following characteristic feature:

  • The process dielectric constant and design dielectric constant at 10 and 8GHz, respectively are 6.15 ± 0.15 and 6.50.
  • The dissipation factor along the Z plane at 10GHz and 23C is 0.0020
  • The Thermal Coefficient of Er along the Z-axis is -262 ppm/C at 10GHz for temperatures between -50C to 150C.
  • RO 3006 material has dimensional stability of -0.11 and 0.11 mm/m along the x and y planes, respectively
  • It also has a volume and surface resistivity of 105
  • The tensile modulus along the X and Y planes is 1498 and 1293 MPa, respectively at 23C.
  • The specific heat of RO 3006 is 0.86 j/g/K
  • It has one of the lowest moisture absorption values among the RO 3000 series of only 0.02%
  • The thermal conductivity is 0.79 W/m/K at 50C.
  • RO 3006 ha a very high decomposition temperature, that is 500 °C TGA.
  • It also has a material density of 2.6 gm/cm3 at 23C.
  • It has a low copper peel strength in comparison to other RO 3000 series of only 7.1 lb/in
  • The UL-94 flammability rating is V-0 and is compatible with lead-free processes

How long can RO 3006 Laminate last

The RO 3006 laminate can last indefinitely when stored appropriately under ambient room conditions.

The temperature should range between 13 to 39C.

However, storage under high temperatures and humidity can easily degrade the product.

Similarly, the operational life of the RO 3006 PCB can last the entire product’s service life if the operating conditions are conducive.

Harsh environments will enhance the rate of deterioration.

What Factors Affect the Performance of RO 3006 Laminates?

The efficiency of RO 3006 PCB material is affected by these factors:

  • The laminates thickness
  • The type of solder mask used
  • The surface finishing used
  • Size and roughness of the copper surface
  • The environmental conditions where the product operates

 RF PCB material

RF PCB material

Is RO 3006 material a good RF PCB material?

Yes, RO 3006 PCB laminate is a cost-effective PCB laminate specifically designed for use in RF applications and commercial microwaves.

It’s suitability for use in RF applications arise from the exceptional electrical performance and stable, consistent mechanical properties.

The dielectric constant versus temperature and frequency is very stable.

Also, the product’s mechanical properties do not shift with changing temperature.

These properties enable PCB designers to fabricate high-quality multilayer PCBs without experiencing warpage and reliability issues.

What should you Consider when Selecting RO 3006 Laminates?

Ensure that you take insightful consideration of the following key factors when selecting RO 3006 laminate for use in the fabrication of a PCB.

· Product Performance

Ensure that you match your product’s needs and the electrical, mechanical, and thermal properties of the RO 3006 laminate.

Consequently, the performance of the RO 3006 PCB laminate will also depend on other factors such as panel thickness and types of solder masks, and surface finishing used.

RO 3006 material is ideal for fabricating multi-layered boards that should operate at different dielectric constant.

This is because you can easily use different series of RO 3000 series for different layers without experiencing functionality problems.

· Manufacturability

RO 3006 laminate is compatible with multiple fabrication processes used for standard PCB fabrication without the need for special equipment.

You will also benefit from economies of scale associated with volume production of RO 3006 laminates.

Since the decomposition temperature of RO 3006 laminate is almost 500C, you can easily use lead-free fabrication processes that utilize very high temperatures.

· Material Availability

You should ensure that your supplier has enough stock of RO 3006 laminates before initiating full production.

Appropriate planning will help you avoid additional costs associated with importing the material overseas and downtime.

· Cost

RO 3006 laminate is a cost-effective laminate material with superior electrical and mechanical stability.

Consequently, you can use the material for competitively priced commercial microwaves and radio frequencies without exaggerating product prices.

· Environmental Protection

RO 3006 is compatible with lead-free processing techniques which makes it suitable for use where environmental protection and human health is a primary concern.

How can you Determine the Quality of the RO 3006 Laminate?

You can use different industry standards outlined by the Institute of Printed Circuit Boards to determine the quality of the RO 3006 laminate.

Consequently, these techniques are subdivided into six major sections that address different laboratory test methods that you can use to test PCB laminate quality.

They include:

  • Methods for reporting and measurement analysis
  • Method for visual test
  • Methods for dimensional test
  • Methods for chemical tests
  • Methods for mechanical tests
  • Methods for electrical tests
  • Methods for environmental tests

Can you use RO 3006 Laminates for High-frequency Applications?

Yes, RO 30006 PCB laminate is a high-frequency material that is ideal for fabricating PCBs for use in RF applications and commercial microwave applications.

What Factors Contribute to the Superior Mechanical and Electrical Properties Exhibited by RO 3006 Laminates?

The mechanical stability arises from the low in-plane expansion characteristic of RO 3006 laminate that matches that of copper.

Furthermore, RO 3006 laminates will maintain stable dielectric properties over a wide range of temperatures.

This eliminates the step-change in the dielectric constant that characterizes PTFE glass laminates at near room temperatures.



What is the CTE of RO 3006 Laminate?

RO 3006 exhibit characteristic product CTE along the X and Y planes of 17 ppm/ °C and 24 ppm/ °C, which is characteristic of RO 3000 laminate series.

What are the Benefits of using PTFE Based Laminates like RO 3006 Laminate?

PTFE based PCB laminates possess numerous key benefits compared to standard FR-4 PCB material. They include but not limited to:

  • Suitable for fabricating high-frequency PCBs
  • Superior thermal management properties
  • Have high transitional and decomposition temperature
  • Low coefficient of thermal expansion
  • Higher flexural strength
  • Resistant to most chemicals and solvents
  • Excellent adhesion of the plated through holes
  • Low water absorption
  • Ideal for the fabrication of multi-layered boards, etc.

What are the Advantages of RO 3006 Laminate CTE?

Since this CTE closely corresponds to the CTE of copper, these Rogers material possesses superior dimensional stability with characteristics after etch and bake shrinkage below 0.5 mils @ inch.

On the other hand, it has a CTE along the Z-axis of 24 ppm/ °C.

This low value is ideal for the provision of reliable plated through-hole even under harsh thermal conditions.

What Factors Influence the Cost of RO 3006 PCBs?

The factors below will significantly influence the cost of RO 3006 PCBs.

· Size of the Board

You will pay more for a bigger RO 3006 PCB board compared to a smaller size.

The bigger the size the more the panels required thus the higher the cost of raw materials.

· Number of Layers

The more layers the higher the cost.

The cost of multilayered PCB is higher because it consumes more resources in terms of raw materials, construction time, and workmanship.

Boards with more layers also consume more resources to drill compared to thinner boards.

· Construction Material

The cost of RO 3006 is competitive to that of standard PCB laminate materials.

Even though you might pay more, the initial cost will be compensated for by superior product performance, even under harsh operating conditions.

You can also use hybrids RO 3006 PCBs that help you save on materials cost.

· Surface Finishing

The cost of applying some types of surface finishing are costlier than others because they provide higher product protection and longevity.

· Sizes and Number of Holes

The smaller the holes the more challenging they are to drill and so is the price.

This is because tiny holes require skilled labor and special tooling.

You will also pay more when your PCB contains more holes because they will also consume more energy.

· Aspect Ratio and Thickness of the PCB

Thicker PCBs use thicker RO 3006 panels that are costlier, more time-consuming, and more difficult to produce than the thinner counterparts.

· The Minimum Trace Space

RO 3006 PCBs with less than are 5 to 10% costlier compared to PCBs with larger trace gaps.

In short, before you consider RO 3006 PCB, you should consider everything in this guide.

However, if you have any question, feel free to contact Venture Electronics.

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