RO6002

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  • RO6002 manufactured with professional quality

The operation process of RO6002 material

PTFE-based materials are softer than most other rigid printed circuit board laminates and more susceptible to handling damage:Wrinkles, scratches, dents and dents easily. We have been proceeding proper handling:

1) Staff should wear gloves of knitted nylon or other non-absorbent material.Bright impregnation with dilute hydrochloric acid. Degreasing in acetone, methyl ethyl ketone, or vapor degreasing with chlorinated solvents.

2) Rinse with water and bake at 250°F (125°C) for 60 minutes.Repeat the light dip.Keep the work surface clean, dry and completely free of debris.

3) Leave the polyethylene bag or sheet in place through the initial process of shearing, sawing, blanking,and stamping.

The-operation-process-of-RO6002-material
Guidelines-for-Drilling-RO6002

Guidelines for Drilling RO6002

RO6002 laminate is a PTFE-based composite highly filled with ceramic particles and reinforced with glass microfibers.

High ceramic filler loading results in low thermal expansion and good dimensional stability. However, ceramic fillers are also very abrasive to cutting tools, so special care needs to be taken to produce high-quality plated through holes.

Using an excessively worn drill bit can significantly reduce the drilling quality. The recommendations presented below are for obtaining good hole quality when using conventional PCB drilling equipment. The spindle speed capability of ordinary PCB drilling equipment is generally between 15KRPM and 60KRPM.

How we conduct incoming inspection?

1) Open the carton to check the material immediately after receipt.
2) If any transport damage is found, notify the carrier as soon as possible. Our staff will photograph the container and contents to make a claim.

3) All quality problems should be reported to the material supplier as soon as possible, we will contact by phone or in writing.
4) Materials that have not been approved by our inspection department shall be authorized for return.

5) Each box must be labeled with product identification, batch number and leaflet number. This will allow us to maintain full traceability records. Maintaining traceability is often necessary to understand and correct any problems that may arise.

How-we-conduct-incoming-inspection

RO6002 description

Venture RO6002 is manufactured with low loss for superior high-frequency performance. We also designed RO6002 with exceptional dimensional stability. It is achieved by matching the Y and X coefficient of the expansion to copper. This design commonly eliminates the double etching to create a tight positional tolerance.

The low tensile modulus of our RO6002 also minimizes the stress of the solder joint when applied. It also enables the expansion of our RO6002 to be constrained by a minimal amount of low CTE metal. Thus, increases the surface mount reliability.

Your Leading RO6002 Supplier in China

Venture RO6002 is a microwave material with low dielectric constant and low loss. It offers excellent mechanical and electrical properties that are important in designing complicated microwave structures.

Our RO6002 is designed with a thermal coefficient of the dielectric constant that is extremely low. It provides excellent stability need for delay lines, oscillators, and filters.

RO6002 article 1

It is also manufactured with low Z-axis coefficient of thermal expansion. This design ensures superior reliability of the plated through-holes.

Other than that, our RO6002 is manufactured with the following features:

  • Tight and thickness control
  • Excellent mechanical and electrical properties
  • In-plane expansion coefficient matched to copper
  • Extremely low thermal coefficient of dielectric constant
  • Low outgassing

Typical applications of our RO6002 includes:

  • Phased array antennas
  • Beamforming networks
  • Power backplanes
  • Ground-based and airborne radar system
  • Global positioning system antennas
  • High-reliability complex multilayer circuits
  • Commercial airline collision avoidance system

RO6002 article 2

Are you looking for a trusted manufacturer of premium-quality RO6002? No need to worry! Venture has more than 10 years of experience in RO6002 manufacturing. More customers from around the world have relied on Venture as their supplier. You can also trust Venture!

Whether you are a product designer, maker, system integrator, electrical engineer, or retailer, we can always support you through providing budget-friendly RO6002.

We also offer flexible payment terms along with excellent delivery options without minimum order required. More great deals are available if you purchase your RO6002at Venture!

Venture has a supportive customer service team to assist you. We can guarantee you a hassle-free transaction and excellent after-sales service!

For your orders, contact us directly!

RO 6002: The Ultimate FAQ Guide

RO-6002-The-Ultimate-FAQ-Guide

All information you’re looking for about RO 6002 is right here.

Whether you want to learn about the features, uses, limitations, or fabrication process, you’ll find it right here.

Keep reading to learn more.

What Are the Features of RO 6002 PCB Laminate?

RO 6002 PCB material

RO 6002 PCB Material

RO 6002 PCB laminate is a high-frequency material fabricated using ceramic-PTFE composite and ideal for use in the microwave and electronic circuits.

It has a low dielectric constant and low loss which offers stable electrical properties and reliable mechanical features.

Consequently, RO 6002 PCB laminate possess the following features:

  • Low loss and low dielectric constant
  • Tight dielectric constant and thickness control
  • The thermal coefficient of the dielectric constant is very low
  • Very low coefficient of expansion along the Z-axis
  • Low in-plane expansion coefficient that matches that of copper
  • Low tensile modulus along the X and Y-directions
  • Low material outgassing
  • Wide variety of metal cladding options to select from

What Are the Advantages of Using RO 6002 PCB Laminate?

RO 6002 PCB laminate possesses superior properties which enables you to design complex microwave structures with reliable and stable mechanical and electrical properties.

Some of the benefits of using RO 6002 PCB laminate include:

  • Ideal for construction of reliable multi-layer PCBs
  • Superior dimensional stability that eliminates the need to perform double etching for the achievement of tight positional tolerance.
  • Suitable for use in high-frequency, high-performance applications because of extremely low loss and low dielectric constant.
  • The coefficient of thermal expansion along the X and Y-axis is very low and matches that of copper. Consequently, it improves the laminate’s dimensional stability and facilities easy and efficient mounting of surface assemblies.

The low CTE also makes RO 6002 ideal for applications that are sensitive to temperature fluctuations.

  • Provision of high quality and reliable plated-through holes as a result of very low Z-axis coefficient.
  • Suitable for use in space applications because of the low outgassing.
  • The stress on solder joints is significantly reduced as a result of very low tensile modulus along the X, Y-axis.
  • The low tensile modulus increase the reliability of surface mounted components because it allows for easy constraining of the laminate’s expansion using a minimal low CTE metal.

Where Can You Use RO 6002 Laminates?

You can use RO 6002 PCB material in a wide variety of high-frequency applications requiring the use of a material having very low loss and dielectric constant.

It is ideal for the construction of multilayer PCB having inter-layer connections, non-polar and flat structures, and microwave PCBs for use in aerospace applications.

Consequently, you can use this PCB material in the following application.

Multilater PCB

Multilayer PCB

  • GPS antennas
  • Phased Array Antennas
  • Complex multi-layer circuits with a high reliability
  • Automatic systems for collision avoidance in commercial airlines
  • Power backplanes
  • Ground and air-based radar systems
  • Beamforming networks

Can You Use RO 6002 Laminates for High-Frequency Applications?

Yes. You can use RO 6002 material in high-frequency, high-performance microwave applications.

Specifically, this PCB material has a very low loss and dielectric constant in addition to superior electrical and mechanical properties making it ideal for high-frequency applications.

What is the Product Specification of the RO 6002 PCB Laminate?

The electrical, thermal, and mechanical properties of RO 6002 PCB material are as follows:

  • A very low dielectric constant of 94 along the Z-axis at 8GHz to 40GHz.
  • Very low dissipation factor of 0.0012 at 10GHz and 23°C along the Z-axis.
  • The Thermal Coefficient of Dielectric Constant is +12 ppm/°C at 10GHz and temperature range from 0 to 100°C.
  • The volume and surface resistivities are 106 Mohm cm and 107 Mohm, respectively.
  • RO 6002 also has a tensile modulus of 828 Mpa at 23°C along the X, Y-axis.
  • The ultimate stress and ultimate strain along the X, Y-axis is 6.9 Mpa and 7.3%, respectively, at 23°C.
  • The material’s comprehensive modulus along the Z-axis is 2482 MPa.
  • It has a low moisture absorption of 0.02% at D48/50
  • RO 6002 PCB laminate has a CTE between -55 to 288°C of 16, 16, and 24 ppm/C along X, Y, and Z-directions, respectively.
  • The thermal conductivity is 0.60 W/m/K at 80°C.
  • It has a high decomposition temperature of 500°C.
  • The material’s density is 2.1 gm/cm3 while the peel strength is 8.9 lbs/in
  • It has a UL94 flammability rating of V-0.
  • It is compatible with lead-free processing techniques.
  • The specific heat of RO 6002 PCB laminate is 0.93 J/g/K.

How Does R0 6002 PCB Laminate Compare with RO 6010 PCB Laminates?

Both RO 6002 laminate and RO 6010 laminate are members of RO 6000 series laminates which are fabricated using ceramic-PTFE composites.

Whereas RO 6002 laminate is a low loss and low dielectric material of 0.0012 and 2.94, respectively, RO 6010 is a low loss (0.0023), but high Dk (10.2) material.

How Does RO 6002 Compare with RO 3000 laminate Series?

Both RO 6002 and RO 3000 series laminates are ceramic-PTFE composite laminates having very high PTFE composition.

RO 6002 corresponds to RO 3003 laminate which also has a low loss and dielectric constant.

Both materials have low CTE, matching that of copper, giving them excellent dimensional stability.

You can use both RO 6002 and RO 3000 PCB laminates for high-performance, high-frequency applications beyond 40 GHz.

RO 3003

RO 3003

How Does RO 6002 Compare with RO 4000 Laminate Series?

RO4003C

RO 4003C

You can use either RO 6002 or RO 4000 series laminate to fabricate high-frequency circuits for use in high-performance applications.

However, RO 4000 series laminates are made of glass-reinforced hydrocarbon/ceramic whereas RO 6002 laminates are made of ceramic-PTFE composite.

You will not need to use special surface treatments such as sodium etch for RO 4000 series as you would for RO 6002 laminate.

RO 4000 series are also more rigid compared to RO 6002, making the latter more susceptible to handling damages.

RO 6002 has superior electrical properties compared to RO 4000 series laminates.

What Are the Standard Thickness and Panel Size for RO 6002 PCB Laminates?

The specified RO 6002 PCB laminate thickness is the dielectric thickness of the material excluding the thickness of copper cladding.

RO 6002 PCB laminate is available in a wide range of material thickness.

Similarly, you can also select the most desirable panel size from the wide range of laminate sizes produced for this material.

The following are the dielectric thickness and thickness tolerance for RO 6002 PCB laminates

  • 005” ± 0.0005”
  • 010” ± 0.0007”
  • 020” ± 0.001”
  • 030” ± 0.001”
  • 060” ± 0.002”

Furthermore, the above dielectric constants are delivered in diverse panel sizes to meet the fabrication needs of individual manufactures.

The RO 6002 PCB laminate panel sizes are as follows:

  • 457mm X 305mm (18”X12”)
  • 457mm X 610mm (18”X24”)
  • 457mm X 915mm (18”X36”)
  • 457mm X 1.219m (18”X48”)

How Can You Select the Optimal Laminate Thickness for RO 6002?

You should consider the following factors when selecting the desired thickness of RO 6002 laminates.

  • Thickness of the copper foil
  • Number of PCB layers
  • Type of signal and vias
  • Conditions of the operating environment
  • Capabilities of the manufacturer’s drilling equipment
  • The depenalization method used by the manufacturer

What Copper Cladding Options Are There for RO 6002 PCB Laminate?

The copper cladding of RO 6002 dielectric material ensures that the final product has enhanced properties to facilitate optimal product performance.

RO 6002 PCB laminates have diverse types of copper foil that differ in thickness, weight, and characteristics.

Optimizing the performance and reliability of your circuit requires that you have an in-depth understanding of these features before placing your order.

Therefore, the following copper claddings are available for RO 6002 PCB laminate.

  • ¼ oz. (8µm) in electrodeposited option.
  • ½ oz. (17 µm) in both electrodeposited and rolled copper foil option
  • 1 oz. (35 µm) in both electrodeposited and rolled copper foil options
  • 2 oz. (70 µm) in both electrodeposited and rolled copper foil option

Unclad options of similar material grade are also available, that is, 0.020” and higher thickness.

RO 6002 PCB laminate also comes with options for alternative thick metal claddings from materials such as aluminum, brass, and copper.

· Electrodeposited (ED) Copper Cladding

You will deposit copper foil on a titanium rotating drum from a copper solution connected to a DC voltage source.

The clad lamination process of standard ED copper foil enhances its adhesion to the dielectric interlayer.

Besides, the treatment also protects the copper from oxidation by acting as an anti-tarnish agent.

· Rolled Copper

You can use the successive cold rolling process to produce rolled copper.

The operation produces copper foils by subjecting pure copper billets through successive reducing rolls to extend the length and reduce copper thickness.

Besides, the condition of your rolling mills will influence the surface smoothness of your copper foils.

What Factors Determine the Choice of Particular Copper Cladding for RO 6002?

Selecting copper cladding options for your RO 6002 laminate can be challenging.

The same type of copper foil processed using different treatment options will deliver varying circuit performance.

You can select either electrodeposited copper foil or rolled copper foil.

Each has specific advantages and disadvantages.

Electrodeposited copper PCBs exhibit better performance in applications with higher mechanical stress.

On the other hand, PCBs fabricated with rolled copper is better suited for applications where the primary concern is the thermal shock.

The thickness of the copper foil primarily depends on the amount of current passing through it which also relies on the frequency of operation.

Other factors that will influence the choice of a particular copper foil include:

  • Surface roughness of copper
  • Desired PCB’s final insertion loss
  • Propagation properties of electromagnetic waves
  • Purpose of the PCB

How Can You Fabricate RO 6002 PCB Laminate?

You will use the fabrication guidelines provided by Rogers Corporation for fabricating RT/duroid® high-frequency laminates.

These guidelines include:

Packaging

You should ship RO 6002 laminates in corrugated cardboard containers.

Protect the materials with self-adherent polythene sheets, sheets for filler cardboards, and poly-bubble packs that are vacuum-sealed.

Storage

You can store RO 6002 laminates indefinitely at normal humidity levels and between 18°C to 30°C.

RO 6002 will remain inert to corrosive atmospheric pollutants and high humidity.

However, directly exposing the dielectric material to high humidity, marine salts, and sulfur oxides will exuberate the speed of corrosion and oxidation of the metal claddings.

You can store the materials either in the original shipping cartons or separately after removing the original cartons.

Handling

RO 6002 laminates are less rigid than most PCB laminates and therefore prone to damage when not handled with care.

Consequently, you can observe the following tips when handling RO 6002 laminates.

  • Remove all debris from your working surface to avoid scratching and forming pits or dents on the laminate’s surface.
  • Put on non-absorbent gloves like knitted nylon because your normal skin oil is slightly acidic and will corrode the surface of RO 6002 laminates.
  • Always pick the panels using two edges as the thinner cores are not stiff and can easily get distorted when picked with a single corner.
  • Do not remove the polyethylene sheet or bag when subjecting the laminate to initial handling processes involving sawing, shearing, punching, etc.
  • Transport the cores using flat carrying trays with laminates interleaved with soft papers.

The interleaving papers must be sulfur-free.

Avoid using vertical racks during transportation unless they are slotted and deliver sufficient vertical support.

Surface Preparation

Remove the self-adhering polyethylene sheets and all adhesive residues before drilling in a double-sided process or before final copper cleaning in a single-sided process.

Use a lint-free cloth that has been soaked in alcohol to wipe out adhesives.

Isopropanol (70% to 100%) will give effective results because they are non-toxic and also non-flammable.

You can use commercial microetchants and cleaners to remove copper oxides.

Avoid mechanical cleaning methods because they will scratch the surface of your laminate and cause the laminate to develop stress cracks under unfavorable environments.

However, when conditions demand abrasive cleaning, ensure that you apply minimal pressure and acknowledge the risks of potential material distortion.

Tooling Holes

You can drill, punch, and rout tooling/pinning holes following standard procedures.

Avoid Smearing

Your drilling parameters must be tightly controlled and employ conservative tool life expectations to avoid smearing because it cannot be readily removed.

Use the vapor honing technique to dislodge the re-deposited debris.

Construction of Stacks

You can use pressed phenolic composites boards as entry and exit drilling materials when fabricating individual or stack layers of RO 6002 laminates.

Keep the total thickness into the exit material below 70% of the flute length.

The total thickness includes the thickness of core material, entry material, and the penetration material.

Drill Type

Use carbide drills to reduce the cutting edge’s wear to the lowest levels. You can use conventional drill styles but with an included slip of 130°C.

To reduce re-deposition of smear, use the undercut drill styles with reduced flute diameter, i.e, 0.65 mm.

Use new drills for optimal results.

Otherwise, thoroughly examine and grind with precision the re-pointed drills before use.

Drill Parameters

Use the optimal surface speed of the tooling of 250 to 300 SFM and 0.045 mm to 0.070 mm per revolution.

Maintain a retract rate of 400-500 inches/minute.

Change the drill bits every 30 cm drill on the dielectric material.

Deburring

You can minimize the occurrence of copper burring by using flat and rigid entry/ exit materials, limited hit counts, and use a new drill.

Following strict and conservative drill parameters also do the trick.

Give preferential to chemical preparations and when you have to use hand pumice scrubbing or other mechanical options, apply minimal force to avoid material distortion.

Hole Preparation

Remove the loosely re-deposited hole debris through hydro- or vapor processes.

Ensure that you provide sufficient support during the process.

You have to perform surface activation treatment before depositing the conductive layers to prevent the occurrence of poor metal adhesion and avoid plated voids.

You can pretreat the surface of RO 6002 laminates using either plasma or sodium treatment.

When you use sodium treatments for RO 6002 laminates, ensure that the treatment period is below 30 seconds.

Metallization

You can deposit the conductive seed layer by using the electroless copper process or its alternatives such as shadow, Crimson, and Blackhole.

You should apply flash-plate fabrication using copper with a thickness range of 0.0025-0.0076mm before metal surface preparation for photoresist.

Resist Strip/Etch

Use standard strip solutions and etchants.

Support thin boards using a frame or leader board.

Follow the final strip with complete rinsing for up to 30 minutes in 70°F+ deionized or distilled water and baking at 125°C for 30 or 60 minutes in vacuum and air, respectively.

Do not wipe the imprints of the dendritic tooth of copper claddings that remain on the post-etch surface of the cores.

Application of Solder Mask

You can use commercially available, photo imageable solder masks on RO 6002 laminates.

However, you have to preserve the post-etch surface and bake the cores before coating application.

If you will selectively silver screen your solder mask, then use an epoxy-based solder mask.

Final Metal Surface

RO 6002 is compatible with all final surface finishing technologies. Ensure that you limit the fluxes exposure time to below 30 minutes before HASL or reflow.

What Safety Measure Should You Put in Place While Using RO 6002 Laminates?

You have to follow the safety measures prescribed by Rogers Cooperation when fabricating PTFE composite based laminates.

Strict observation of these measures will significantly reduce the chances of hazards, especially during machining and bonding operations at elevated temperatures.

· Machining

Do not SMOKE in the machining area.

Always wash your hands and change clothes when leaving the machining area to avoid the transfer of electrostatically charged particles to smoking areas.

These particles can exceed 1600°C, thus imparting fume fever in smokers.

Do not burn the scraps and dispose of them by landfill as per the local regulations.

Place all the scraps in containers and label ‘DO NOT INCINERATE’.

Ensure that you provide sufficient ventilation if machining is providing high temperatures.

· Bonding

You should ventilate the press area as a precaution to potential temperature control malfunctioning and errors in set temperatures.

It will ensure that the bonding temperature does not exceed 300°C.

· Health Concerns

Avoid subjecting RO 6002 PCB laminate to very high temperatures that exceed the decomposition temperature.

At such a temperature, the material releases very toxic fumes which can potentially cause permanent human injury.

The toxicity of products from high temperature is more dangerous because PTFE has a limiting oxygen index of 95.

Besides, the high temperatures also make the fumes and smoke very corrosive.

Inhalation of particulates originating from machining can cause polymer fume fever symptoms, expressed as influenza-like features.

Can You Use RO 6002 PCB in a Nuclear Radiation Rich Environment?

The main concern is using RO 6002, a ceramic-PTFE composite in space applications where the nuclear radiation is very high.

PTFE in particular is more susceptible to damage when exposed to nuclear radiation because of its lower cohesive forces adhering to its molecular chain.

Nuclear radiation damages PTFE by reducing its molecular weight.

The reaction is catalyzed by oxygen and therefore the lack of oxygen in space minimizes the radiation damage.

Besides, the reduction in molecular weight primarily affects the mechanical properties of the laminate and to a lesser extent the electrical properties.

Henceforth, the effects of radiation are not expected to affect the electrical performance of RO material given that metallic components provide additional mechanical support.

What is The Temperature Rise Estimation for RO 6002 Material?

Temperature rise estimation is the estimation of the potential rise in temperature of conductor traces found in devices fabricated using RO 6002 laminates.

The devices might be built-in stripline or microstrip RO 6002 configurations.

Besides, the temperature rise is vital when the bias lines need to remain as narrow as possible to maintain their characteristic impedance and yet also possess high current levels.

Temperature rise is very critical in the case of high power levels in radio frequency applications.

Does RO 6002 PCB Laminate Require After Etch Stress Relief?

RO 6002, in typical behavior of PTFE based laminates, will exhibit some shrinkage after etching off copper.

Shrinkage comes from the difference in CTE of copper and the ceramic-PTFE composite.

Generally, this shrinkage is usually small enough to ignore in most circuits but can cause troubles in large circuits.

Henceforth, you can correct this process through the double-etching procedure.

Consequently, double etching involves two separate steps of image and etching with an inter-step baking cycle between them.

The baking process accelerates the rate of residual shrinkage.

You will get rid of approximately 90% of the etch shrinkage before performing final etching and remain with minimal movements that can be ignored.

How Can You Prevent Chemical Contamination of RO 6002 PCB Material?

Chemical contamination occurs when you expose the dielectric material to low surface energy solvents having non-volatile components.

These chemicals sip into the microvoids in the ceramic filler and PTFE interface and have to be thoroughly rinsed to prevent excess dielectric loss or staining.

Consequently, you can remove the chemicals following these procedures:

  • Minimize exposure of RO 6002 laminate to solvents with lower surface energy that have non-volatile solvent.
  • Prevent accumulation of non-volatile materials through frequent dump rinsing.
  • If RO 6002 dielectric material is exposed to water-soluble solvents with non-volatile components or low surface energy solutions, then soak it in hot distilled water (70F) for 15 minutes.
  • A dielectric material can also be exposed to solvents containing non-volatile components and insoluble in water.

In such a case, soak the material in a soluble organic solvent for 15 minutes then thereafter soak it in hot distilled water for another 15 minutes.

Can You Fabricate a Multilayer PCB Using RO 6002 PCB Laminate?

Yes, RO 6002 PCB laminate has excellent mechanical and electrical properties that favor the fabrication of complex multi-layer circuit structures.

You should use thermoplastic adhesive systems such as Rogers 3001 film or Dupont’s FEP films when the electrical properties of your applications are critical.

You will use direct bonding to construct a homogenous multilayer circuit because RO 6002 laminates are also thermoplastic resin systems.

Otherwise, you can use thermoset adhesive systems such as FR-4 prepregs when the electrical properties of your system are not so critical.

What Is the Tensile Modulus of RO 6002 Laminate?

Tensile modulus a mechanical property of the RO 6002 PCB laminate which indicates the material’s stiffness.

By definition, it is the ratio of stress along an axis to strain, along that axis.

Stress is the force per unit area and strain is the material’s deformation as a result of applied stress.

Therefore, the tensile of RO 6002 laminate refers to the maximum amount of stress that RO  6002 laminate can handle before rapturing

Consequently, RO 6002 PCB laminate has a very low tensile modulus of 828 Mpa at 23°C along the X, Y-axis.

The low tensile modulus enhances the surface mount reliability by reducing the solder joints-applied stress.

Further, it also allows you to constrain the laminate’s expansion using a metal with a minimal CTE of only 6 ppm/C.

What Are the Limitations of RO 6002 Laminate?

RO 6002 dielectric material has the following limitations.

 RO PCB Material

 RO PCB Material

· Price

RO 6002 low loss and dielectric material are multifold more expensive compared to standard PCB fabrication material like FR-4 material.

Though the initial purchase price of the material is high, it also delivers higher performance in applications demanding quality performance.

· Special Through-hole Preparation

RO 6002 PCB material is fabricated using ceramic-PTFE composite and thus has to undergo special pretreatment processes characterized by PTFE- based laminates.

You have to perform the pretreatment before applying the conductive seed layer like direct metallization or electroless copper.

If you don’t perform surface treatment before the electroless copper deposition, then you will end up with poorly formed plated voids and metal adhesion.

· Rigidity

RO 6002 PCB laminate material, like most other PTFE-based materials, is soft and therefore more prone to handling damages.

Their fragile nature makes them difficult to handle and thus you have to take more care to prevent potentially damaging the materials.

How Long Can RO 6002 PCB Laminate Last?

RO 6002 laminate can last indefinitely when stored under normal humidity levels and ambient room temperature (18C TO 30C).

However, exposing the dielectric material to elevated humidity and temperatures and degrading environmental conditions makes the material susceptible to corrosion and oxidation.

At Venture Electronics, we help you get high-performance RO 6002 PCB materials.

Contact us today for any questions or inquiries about RO 6002 PCB laminate material.

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