RO4350

  • Cost-effective RO4350
  • Reliable quality RO4350
  • Full range of RO4350
  • Competitive price with flexible payment term

What is the difference between RO4350B PCB and RO4835 PCB?

The biggest difference between the two is that the antioxidant added in RO4835 is 10 times higher than that of traditional thermosetting materials, and meets the requirements of ipc-4103 (high-speed and high-frequency substrate specification).

Rogers RF board RO4835 has added anti-oxidation material, and its anti-oxidation is stronger than RO4350B.

difference-between-RO4350B-PCB-and-RO4835-PCB
PCB-surface-treatment-can-you-apply-on-RO4350

What PCB surface treatment can you apply on RO4350?

The following includes:
*Immersion Silver
*Immersion Tin
*Immersion Gold
*Electrolytic gold or nickle
*Electroless Nickle Electroless Palladium Immersion Gold(ENEPIG)
*Hot air soldering level (HASL)
*Lead free HASL

What are the Components of RO4350 pcb material?

There are three components that make up the RO4350:
* Copper Foil: these are the conductive traces on the RO4350

*Prepreg: this is an important stage material that is sticky and enables the bonding of various laminates or foils

* Copper laminates: this contains prepregs and copper coils that you will laminate and cure.

are-the-Components-of-RO4350-pcb-material

RO4350 description

As a professional manufacturer, we produce RO4350 that is non-PTFE. Our RO4350 doesn’t have the handling required and special through-hole treatments. Venture RO4350 comes with low assemble and processing costs. It is applicable for applications like:

  • RF identification tags
  • LNBs for direct broadcast satellite
  • Spread spectrum communication systems
  • power amplifiers; and more

Your Leading RO4350 Supplier in China

We manufacture RO4350 with low dielectric loss and tolerance. Thus, our RO4350 can offer excellent high-frequency performance. This makes our RO4350 applicable to higher operating frequency requirements.

Venture RO4350 has a stable electrical property than frequency. This able our RO4350 to have repeatable designs that make it ideal for mixed and multilayer dielectric constructions.

Our RO4350 is also equipped with a low thermal coefficient of dielectric constant. Thus, it is best for an application that is sensitive to temperature change.

RO4350 article 1

Besides, we produce RO4350 with low z-axis expansion. This assures reliable quality plated through-hole. Because of that, our RO4350 is applicable to epoxy glass multilayer board hybrid designs.

Moreover, Venture RO4350 has excellent dimensional stability for high production yields and volume manufacturing processes for economical laminate pricing.

Our RO4350 also has a 280°C high glass transition temperature. Therefore, it will not warp during the reflow assembly while ensuring a plated through-hole reliability.

Typical applications of our RO4350 includes:

  • LNB’s for direct broadcast satellite
  • RF identification tags
  • microstrip patch antennas
  • Spread spectrum communication system
  • PCs and cellular base station antennas
  • power amplifiers

RO4350 article 2

Whether you are a retailer or electrical engineer looking for a reliable quality RO4350, Venture is your best choice! We can give you a total solution for your RO4350 requirements!

As an expert manufacturer of RO4350, Venture can always meet your needs! We offer a RO4350 layout, design, and assembly. We have more than 10 years of experience in manufacturing RO4350!

Venture also offers competitive pricing since we manufacture RO4350 in a standard in-house with no outsourcing. Whether you have a large-scale or small quantity of RO4350 orders, you are always welcome at Venture Electronics! We have an approachable customer service team to assist you!

If you have questions and inquires regarding our RO4350, feel free to contact us!

RO4350: The Ultimate FAQs Guide

RO4350-The-Ultimate-FAQs-Guide

This guide will help you understand all the critical aspects bout RO 4350 material such as properties, benefits, uses, performance and quality certification, amongst others.

So, if you have any questions about this Rogers PCB material, you will find the answer right here.

Let’s dive right in.

What is RO4350 Material?

 RO 4350 Material

RO 4350 material

RO4350 laminate refers to fiberglass-reinforced ceramic/hydrocarbon Rogers material which has exceedingly high glass transition temperature.

It is a thermoset PCB material that offers high-frequency performance similar to woven PTFE-based substrates.

The laminate design allows it to offer excellent RF performance and inexpensive PCB manufacturing.

This makes Rogers RO4350 a low-loss laminate that you can produce applying ordinary FR-4 processes.

What are the Properties of RO4350 Laminate?

Here are the main features of RO4350 high-frequency PCB material:

  • Dielectric constant of 3.48 +/- 0.05
  • Z-axis coefficient of thermal expansion of 32 ppm/degrees Celsius
  • Dissipation factor of 0.0037 at 10 GHz

What are the Benefits of RO4350 PCB Material?

The main advantages of RO4350 laminate include:

· High-Frequency Performance

Rogers RO4350 core has the features needed for RF/microwave PCB applications

· Ensure Repeatability

Permits reproducible design of coupling networks, filters, and transmission lines with controlled impedance.

· Low Dielectric Loss

This feature of RO4350 laminate allows its use in many applications that limit the use of ordinary PCB substrates due to higher operating frequencies.

· Low Coefficient of Thermal Expansion

The CTE of RO4350 material is among the lowest and features a stable dielectric constant over a broad frequency range.

Due to this fact, it is a perfect PCB material for broadband applications.

Which are the Types of Glass Fabric Used in RO4350 Laminate?

RO4350 substrates currently come in 1080 and 1674 fiberglass fabric versions.

All the varieties of glass fabric meet similar laminated electrical performance requirements.

What are the Applications of RO4350 Material?

Some of the typical uses of RO4350 laminates include:

  • Broadband Communication Systems
  • Antennas and Power Amplifiers of Cellular Base Stations
  • RF Identification Tags
  • Direct Broadcast Satellite LNBs

Which are the Key Factors to Consider When Selecting High-Frequency RO4350 laminate?

Here are the main factors to consider during the selection of high-frequency Rogers substrate material:

· Dielectric Constant (Dk)

The dielectric point is the beginning point for most PCB laminate selection processes.

You can measure it in all the 3 axes of PCB substrate.

Nevertheless, you often use the Z-direction value at a specific test frequency, like 10 GHz, for contrasting in high-frequency RO4350 applications.

Most RF/microwave PCB applications use laminates having Z-axis dielectric constant values spanning from 2 to 10.

· Controlled Impedance

High-speed PCB materials like RO4350 core will maintain their Dk tolerance +/- 2 percent or better.

This is a very crucial consideration for circuit boards that require routing of tight controlled impedance.

· Signal Performance

Signal performance throughout the PCB is another essential consideration.

Signal loss becomes a significant challenge with increasing transmission line frequencies.

RO4350 substrates can give a lower dissipation factors that as a result aid in minimizing signal loss.

· Dimensional Stability

High-frequency PCB designs should equally keep tight physical tolerances during both their assembly and application.

 High frequency PCB

High-frequency PCB

Thermoset hydrocarbon materials such as RO4350 laminates are an ideal selection for mechanical stability.

· Moisture Absorption

Moisture absorption rating is another important factor to consider.

Even a small quantity of moisture may alter the electrical performance of RO4350 material.

· Thermal Management

High-speed PCB designs commonly endure high heat levels during their operation.

This makes materials like RO4350 substrate extremely robust with exceptional thermal properties.

Therefore, they are the best choice for high-frequency PCB materials for use in harsh environments.

What Determines High-Frequency RO4350 Price?

The three primary factors that greatly influence cost of RO4350 laminate include:

·  Material Type

Being a high-performance PCB material, RO4350 substrate cost will be higher than that of ordinary FR-4 laminates.

· Panel Size

The size and application of RO4350 laminate are 2 of the most essential parameters that affect its price.

Generally, the amount of circuits needed for the associated device determines the RO4350 material size.

· Number of Layers

Obviously, high-speed Rogers PCBs having 3 or more layers incur higher production costs than those comprising of only 2 layers.

Typically, RO4350 PCBs having many layers need significantly more work to produce.

In addition, type of finish and hole sizes are some of the other factors affecting RO4350 substrate price.

Is Rogers RO4350 Suitable for Multilayer PCB Construction?

Yes, you can use RO4350 dielectric materials in fusion with FR-4 laminates prepregs to obtain a performance upgrade of traditional FR-4 multilayer designs.

Utilizing RO4400 series prepreg, it is possible to perform multilayer PCB construction using RO4350 cores.

The prepreg family is the best option, due to its high post-cure glass transition temperature, for Rogers multilayers needing sequential laminations.

RO4400 prepregs that have fully cured are able to handle multiple lamination cycles.

Moreover, FR-4 feasible bond requirement allow the prepreg and FR-4 prepreg to fuse into non-uniform multilayer constructions utilizing single bond cycle.

How can you Reduce Insertion Loss in RO4350 Material?

Here are some of the ways you can minimize insertion loss in RO4350 laminate:

  • Utilizing wider traces
  • Ensuring looser coupling (i.e. providing wider spacing between traces)
  • Using thicker dielectrics (thicker and more core/prepreg layers)
  • Lowering the dielectric constant of RO4350 PCB material

The first 2 factors tend to reduce routing density, which as a result normally needs more laminate layers, increasing RO4350 cost.

Besides, the third factor increases the cost as well, while the last one means using more exotic materials that also increases the cost.

Moreover, you also need to consider the following additional factors that will influence insertion loss to ensure acceptable system margins:

  • Trace surface roughness
  • Humidity
  • RO4350 laminate topologies (i.e. via effects, type and number of connectors, back drilling, routing lengths)
  • Temperature
  • Any variances and defects in the Rogers material

Which are the Parameters that Influence Impedance Control in High-Frequency RO4350 PCB?

The factors affecting impedance control in RO4350 laminates include the following:

· Trace Width

Trace width describes the copper foil width together with its coating.

Impedance tends to decrease with increased trace width.

Trace width

Trace width

When developing specifications for the RO4350 circuit board, you establish trace width on factors such as temperature rise and capacity.

It is possible to design based on your desired impedance.

· Copper Thickness

The thickness of copper on the RO4350 substrate also affects impedance.

Typically, an increase in copper thickness leads to a decrease in impedance.

Therefore, you can reduce impedance by increasing copper thickness and weight.

Conversely, higher impedance implies reducing the copper thickness and weight.

· Dielectric Thickness

This refers to an insulating material thickness between traces.

There is a logarithmic relation between impedance and dielectric thickness.

A significant rise in thickness is prone to produce modest impedance increases.

On the other hand, you can decrease impedance by considerably reducing the dielectric material thickness.

· Dielectric Constant (Dk)

The dielectric constant of RO4350 laminate tends to fluctuate inversely with frequency.

High-frequency laminates with controlled impedance should have a low and steady dielectric constant.

A more demanding dielectric constant can always influence impedance in uncertain ways.

Which are the Factors Affecting Conductor Loss of High-Frequency RO4350 Laminate?

The parameters influencing conductor loss in RO4350 laminates consist of:

· Frequency

Most of the electric field interaction happens between the ground plane top side and the bottom surface of signal conductor.

At high frequencies, there are more condensed electric fields and RO4350 substrate uses less area of the ground plane for the ground return path.

Also, at both high and low frequencies, there is the current concentration at signal conductor bottom corners.

The conductor area with current density will be reduced at a higher frequency, which is as a result of skin effects.

Basically, with increasing frequency, there is less use of the mass and much of the current density resides in the conductor skin.

· Laminate Thickness

The effect of laminate thickness is because of the ratio of conductor and dielectric losses.

A thinner RO4350 laminate will exhibit greater conductor losses, and vice versa.

· Dielectric Constant

Dielectric constant as a feature will not impact on conductor loss.

Nevertheless, for matched impedance PCB, you will need to increase conductor width if you use RO4350 laminate with lower DK.

This helps in maintaining similar characteristic impedance.

Therefore, increasing the conductor width will reduce the conductor losses.

· Plated Finish

The plated finish applied to the RO4350 circuit is another important consideration for conductor loss.

Some of the PCB finishes lead to more conductor losses compared to others and are usually frequency-dependent.

The common ENIG finish will typically lead to more conductor losses in the case of the microstrip transmission line.

The reason for higher losses at certain frequencies is the presence of skin depth within the nickel layer.

Nickel is substantially less conductive compared to copper.

To prevent conductor loss in the RO4350 substrate, you can use a silver finish since it features the same conductivity as copper.

Therefore, the finish leads to a negative effect on conductor losses.

· Copper Surface Roughness

Copper surface at the copper-substrate boundary is often rougher than the copper airside for the microstrip transmission line.

This is because most PCB fabricators prefer using rougher copper to ensure a better substrate bond.

The conductor losses increase if the copper skin depth is close to copper thickness, which coincides with the surface roughness.

Rougher copper has more surface area that will extend the propagation path, hence more loss.

To ensure lower conductor losses, you can use copper-clad laminate having a smooth surface.

However, the bond strength will reduce if the RO4350 laminate features smoother copper.

Therefore, to minimize conductor losses, use copper-clad laminate having a smooth surface and silver finish.

Moreover, less PCB loss will result in less generation of heat.

How Do You Prevent CAF Failure in RO4350 Core?

There exist numerous different steps you may take to reduce the chance of CAF failure in RO4350 laminate.

Preventing conditions facilitating CAF development will assist avoid it.

Let’s look at some of the considerations you should factor in:

· Humidity and Moisture

Raised humidity results in increased moisture content, which in turn lowers the CAF performance of RO4350 substrate.

Additionally, since it needs an electrolyte, increased moisture content raises the possibility of CAF failure.

· Processes Leading to Acid Contamination

Processes applied during RO4350 laminate manufacturing may introduce acid contaminants, which raises the possibility of CAF formation.

For example, acid residues introduction during plating operation or use of certain soldering fluxes.

· Bias and Voltage

High voltage bias will substantially reduce possibilities of CAF development because bias voltage is what encourages the reaction.

Similarly, greater voltages will as reduce CAF performance.

· Pre-Existing Defects

Pre-existing flaws like misregistration, voids, contamination fracturing, and wicking can as well form pathways for troublesome filaments.

You should be keen during hole drilling to ensure that you do not damage the RO4350 laminate.

Such damage may form these routes by leading to wicking, cracks, and other flaws.

Such damage can create these pathways by causing cracks, wicking and other defects.

Feed rate, drill speed and other parameters influence the likelihood of occurrence of these issues.

Furthermore, partial defects like partial bridging between elements can equally contribute.

High temperatures increase the chance of damage coupled with CAF formation.

· Materials

RO4350 material is another vital factor that affects CAF failure.

Utilizing CAF resistant materials is among the most efficient means of preventing CAF development and failure.

PCB laminates featuring high heat resistance incline to resist CAF development better.

Often, Rogers laminate producers utilize resin systems and glass finishes to avoid CAF formation and increase insulation resistance.

Both materials are instrumental for this role, however, resin systems serve a more substantial effect than glass finishes.

For that matter, applying the two together may be a perfect solution.

Moreover, DICY-cured resin might have a lower probability of promoting CAF growth compared to phenolic-cured resin.

Finished fibers exhibit lower chances than loom-state and heat-cleaned fibers to develop CAF.

Loom-state fibers exhibit the highest possibility of CAF growth.

Fiber distribution, cleanliness, and hydrolysis resistance that aids in preserving glass-resin bonds affect the efficiency of silane coatings or glass fabric.

Resin systems having advanced pure-resin components, enhanced chemical stability (comprising of hydrolysis resistance) and low moisture absorption display better CAF performance.

Other material-associated factors consist of type of solder mask and finish type.

· Design

The design and construction of RO4350 laminate equally serve an instrumental purpose in establishing its CAF resistance.

Materials with smaller spacing between voltage-biased elements tends to fail quicker in comparison to those having larger spacing.

However, it is common that this influences the second stage of CAF growth process.

Coupled with line-to-line and hole-to-hole spacing, drilled holes size and copper thickness in plated thru-holes affect CAF resistance.

Moreover, more biased features equally increase the possibility of CAF growth.

Additionally, anodic vias also exhibit faster failure compared to cathodic vias.

Their weft and warp direction also serve a role in CAF failure in RO4350 laminate.

You will realize higher CAF resistance if you stagger the vias at a 45-degrees angle.

The presence of voids, wicking, glass stops, and other elements after fabrication can serve pre-existing routes for CAF formation.

Other procedures that may increase the chances of CAF growth in RO4350 substrate consist of reflow and desmear operations.

Since several factors impact CAF performance, it is important to consider CAF at each step of the RO4350 laminate manufacturing process.

Optimizing the Roger material for CAF resistance produces a more dependable end product.

What is the Difference between Impedance Watching Impedance Control in Rogers RO4350 Laminate?

 RO 4000 PCB

RO 4000 Series PCB

· Impedance Watching

This describes a situation where your RO4350 laminate designer delineates impedance control trace.

The PCB manufacturer then adjusts dielectric height and trace width accordingly.

After approving the specifications, the supplier then starts the manufacturing of the RO4350 circuit board.

To verify the impedance, you can ask for a time-domain reflectometry test at a fee.

· Impedance Control

Typically, you request for impedance control if the RO4350 laminate design features tight impedance tolerances which might be difficult to achieve on the initial attempt.

When the manufacturer capability nears dimension specifications, it may be difficult to guarantee target impedance on the first trial.

In the impedance control scenario, the Rogers laminate manufacturer produces the RO4350 board putting their best to attain target impedance.

Subsequently, they perform a TDR test to confirm if the process is successful.

If it, on the contrary, they make the necessary adjustments and test again till they attain the required impedance.

Does Copper Profile Affect Electrical Performance of RO4350 Core?

Yes, Rogers copper foil can influence the propagation constant of RO4350 laminate.

Higher profile copper foils result in an apparent rise in the effective dielectric constant of the Rogers substrate material.

Laminates having the greatest profile foil show a DK increase of almost 10 percent.

The copper profile effect on insertion loss may be very big.

How Does Rogers 4350 vs. FR4 Compare in terms of Electrical Features and Performance?

FR-4 material serves as the traditional PCB substrate providing a broadly efficient balance between manufacturability, performance, electrical properties and cost.

FR 4 PCB material

 FR4 PCB Material

However, if electrical characteristics and thermal management are crucial to your PCB design, then Rogers 4350 is the best choice.

In applications where thermal management is critical, RO4350 laminates offer dielectric properties than standard FR-4 PCB substrates cannot deliver.

This is so whether it is cellular, microwave, RF, or high-speed PCB designs.

The low loss Rogers laminate and prepreg material ensure greater performance in your high-demand printed circuit board applications.

Besides, the laminates guarantee a low signal loss, lower dielectric loss, reduced cost of circuit fabrication and appropriate for quick-turn prototyping.

Moreover, Rogers 4350 substrate has lower chances of exhibiting dielectric breakdown in comparison to FR-4 laminate.

How do you Ensure Good Thermal Management in High-Frequency RO4350 Material?

Thermal management of Rogers laminates involves removal of heat from sensitive design areas that may experience performance degradation/damage due to heat.

Fundamentally, there exist 2 general categories of manufacturing thermally managed RO4350 laminates:

· Post-bonded Laminate

In post-bonded laminate, you first fabricate the circuit layers and then bond the ground plane firmly to the dense heat sink layer.

The heat sink layer has adequate heat capability to totally draw up all heat produced during the RO4350 board operation.

You then connect the ground plane layer to all passive and active electronic elements of the circuit that would produce heat.

This ensures the laminate efficiently transmits heat from different heat-producing sources to the heat sink.

Plated thru-holes link the laminate layers.

The PTHs transmit generated heat to the base ground plane bonded to the heat sink body.

Also, the Rogers substrate then emits the heat accumulated by the heat sink to ambient air, away from electronic components of the board.

Nevertheless, the heat sink features certain serious structural stability challenges.

For instance, the thin molten sweat solder layer bonding ground plane and heat sink surface present problems.

There is a limit to the reliability of bonding between the two surfaces due to difficulty in controlling molten solder flow.

This may form open circuits due to a lack of solder linking ground plane and heat sink surface.

Moreover, the sweat soldering method needs fine-tuning several process parameters like:

  • Flatness/planarity between layers of RO4350 laminate you are bonding
  • Solder Composition
  • Solder Volume
  • Bonding Temperature
  • Solder Flow
  • Pressure

In addition, solder joints are highly prone to failure because of temperature excursions common with high-frequency Rogers RO4350 laminates.

·  Pre-bonded Laminate

In pre-bonded RO4350 laminates, the materials come with their layers already fused with a dense heat sink.

The heat sink has sufficient heat size to absorb heat produced by numerous elements and efficiently emit to the surrounding.

The numerous blind holes in the RO4350 substrate helps in transferring the heat produced within various circuit layers to the heat sink.

For pre-bonded variety, it includes a composite material comprising of relatively soft RO4350 substrate and a thick metal plate.

Optimal parameters for the mechanical processing of the materials differ greatly, since the metals to select from may feature varying plating properties.

The key factor for effective thermal management of RO4350 high-frequency laminate is the plating of a blind hole.

Also, the copper should plate evenly in the wall of hole, and be if possible 1 mil or grater within the hole wall.

Is it Advisable to V-Score RO4350 Material?

 Rogers PCB material

 Rogers PCB Material

There are lots of challenges when it comes to V-scoring of high-frequency laminates such as RO4350 material.

First, certain high-performance laminates are extremely soft and somehow fibrous.

This makes them not good candidates for V-scoring since V score involves 2 round saws facing one another.

For that matter, any fibrous PCB material like RO4350 laminate will probably get ripped up.

Moreover, the Rogers material will not break as required since high-frequency laminates are exceedingly flexible.

Though others might be more rigid, most resemble lead sheets used to flash house chimney.

The other concern is the presence of copper all through to the margins on these kinds of PCB laminate designs.

This makes it hard to V-score through copper since the process will detach a greater percentage of the copper from the substrate.

Furthermore, some high frequency RO4350 laminate designs are very thin.

Yet, V-scoring comprises of 2 circular blades pointing to each other.

You need to observe some minimum distance between the 2 blades before they touch each other.

Therefore, with thin PCB material, it is difficult to perform a considerable cut into the laminate without compromising the minimum distance.

For that matter, it would be a bad idea to V-scoring this type of Rogers substrate material, though the process improves the RO4350 performance.

Hence, V-scoring high-frequency laminates is not a good idea.

Which are the Quality Certifications for RO4350 Laminate?

Some of the quality certifications that RO4350 laminate materials should comply with include:

  • ISO Certification
  • UL Certification
  • CE Certification
  • REACH Certification
  • RoHS Certification
  • ITAR Certification
  • IEEE Certification
  • IPC Certification

In short, there are many factors to consider when choosing RO 4350 PCB materials.

At Venture Electronics, we help you get the best material for all your PCB applications.

For any inquiries or questions on Rogers PCB material, contact us now.

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