Integrated Circuit Assembly: The Ultimate FAQ Guide

I know you’re probably looking for more information about integrated circuit assembly.

A reason this guide will answer all your questions on integrated circuit assembly – keep reading to learn more.

What Is An Integrated Circuit Assembly?

An integrated circuit assembly is a single-unit electronic assembly consisting miniaturized active and passive devices.

Some of the active devices include transistors and diodes while passive devices consist capacitors and resistors.

These devices have interconnections fashioned on a thin semiconductor substrate resulting in a compact chip.

You find this chip can be very small even in the range of millimeters square thanks to the tiny individual components.

An Intergrated Circuit Assembly

An Integrated Circuit Assembly

Is A Microprocessor An Integrated Circuit Assembly?

Yes, it is.

A microprocessor combines the functionality of a CPU into a solitary integrated circuit chip. It executes logical and computational operations in a computer system so that other external circuits can fulfill their expected purposes.

Where Do You Find Use Of Integrated Circuit Assemblies?

An integrated circuit assembly encompasses electrical components like diodes, transistors, and resistors, interconnected to perform a variety of activities. You find integrated circuit assemblies in different electronic devices including:

  • Computers and its peripherals devices such as keyboards and mouse, due to their versatility.
  • Digital cameras, video game consoles and controllers.
  • Encoders and decoders for radio frequency.
  • Headphones, microphones, and speakers including smart speakers such as Amazon Echo and Google Home.
  • Memory storage devices and logic instruments.
  • Processors and amplifiers for video and audio respectively.
  • Smartwatches and other wearables.
  • Televisions, computers, tablets and smartphones.

An Integrated Circuit Assembly In a Laptop

An Integrated  Circuit Assembly In A Laptop

How Do You Carry Out Integrated Circuit Assembly?

You manufacture several integrated circuits simultaneously on a single silicon piece before individually separating the IC chips.

You conduct integrated circuit assembly in a clean, highly controlled environment where the air is free from foreign particles.

The process of integrated circuit assembly adheres to the following process:

Preparation Of The Silicon Wafer

The process begins with the melting of a cylindrical silicon ingot in a vacuum chamber in a vertical position.

Melting eliminates impurities which coalesce at the bottom of the ingot which you cut off leaving the pure part.

Thereafter, you cut round silicon wafers of desired size from the ingot on which you furnish the integrated circuits. You then polish the surfaces before applying silicon dioxide as a coating to prevent oxidation.

Integrated Circuits On Silicon

Integrated Circuits On Silicon


Masking during integrated circuit assembly involves application of layer designs for the silicon wafer’s constituent components.

Masking typically involves image transfer through optical reduction with the use of clear and opaque masks.


You can employ two doping approaches in integrated circuit assembly: atomic diffusion or ion implantation. In atomic diffusion, you create P or N regions by high temperature wafer baking in the presence of an inert gas.

Ion implantation consists of ionizing a dopant gas such as phosphine. Here, a beam comprising dopant ions with high energy forms that you fire at particular areas of the wafer.

Formation Of Successive Layers

You repeat the masking, etching and doping processes for succeeding layers required for your integrated circuit assembly.

For the final layer, you apply a silicon dioxide layer through chemical vapor deposition before depositing an aluminium layer for contacts.

Individual IC Chip Formation

You separate the numerous chips via scoring separation lines on the silicon panel before using a diamond cutter.

To separate the wafers, you might need to break them off along the cut lines before subjecting them to an inspection.


Upon successful inspection, you seal the integrated circuit chips in special plastic bags with no static. You can keep the package chips in storage or ship them off.

Integrated Circuits In A Storage Box

Integrated Circuits In A Storage Box

What Are The Characteristics Of An Integrated Circuit Assembly?

The integrated circuit is a complex device consisting silicon wafers with microscopic designs engraved on them. You can find several thousand transistors, resistors, and other electronic components in these designs.

Some of the characteristics of an integrated circuit assembly include:


You can find integrated circuit assemblies with transistor measurements in the range of nanometers. This allows you to package millions of transistors on a single integrated circuit assembly thereby increasing functionality.


You can employ individual chips to make discrete devices such as light emitting diodes.

Integrated circuit assemblies derive their name from the fact that they combine multiple devices on a single chip.

Integrated circuit assemblies have tiny transistors allowing sub-functions formerly requiring multiple chips possible with just one.


You employ semiconducting materials in integrated circuit assembly. Semi conducting materials are materials that fall between good conductors and insulators.

The most popular semiconductor in use for integrated circuit assembly is silicon. To generate electronic materials with diverse properties, you mix ultrapure silicon with minimal amounts of other elements.


Due to the size and sensitivity of the integrated circuit chip, direct handling is impossible. You encase each chip in flat plastic or ceramic blocks linked to a set of microscopic aluminum or gold wires.

External metal pins on the block connect to the internal wires providing a secure mechanical and electrical connection to the system components.

IC chip protection is by the plastic block on which you print the manufacturer’s name and part number and helps in cooling.


An integrated circuit assembly can be as small as 1 square mm to as large as 200 square mm. A chip package is large enough to accommodate the integrated circuit assembly with a thickness ranging from a few millimeters.

What Components Do You Find On Integrated Circuit Assemblies?

An integrated circuit assembly consists of different passive and active devices fashioned on a single wafer. Some of the common electronic components you find on integrated circuit assemblies are:


A capacitor is a two-terminal passive electrical energy storage device that operates in an electric field.

Capacitance describes the effect of a capacitor and a capacitor exists to add capacitance to an integrated circuit assembly.




A diode is an electrical component with a terminal pairing that primarily exhibits unidirectional current flow in integrated circuit assembly. With a diode, you have little resistance in one direction and high resistance in the other.




A resistor is a passive electrical component with a terminal pair which implements electrical resistance in an integrated circuit assembly. Resistors allow you to reduce the flow of current, divide voltages, adjust signal levels, and end transmission lines in a circuit.

Resistors Are Part Of The Integrated Circuit

Resistors Are Part Of An Integrated Circuit


A transistor is a semiconductor device that amplifies or switches electrical signals in an integrated circuit assembly. A transistor usually possesses a triple terminal configuration for connecting to an electronic circuit.

How Can You Classify An Integrated Circuit Assembly Based On Manufacturing Approach?

You can classify integrated circuit assemblies in three categories based on the manufacturing technique you employ:

Thin And Thick Integrated Circuit Assembly

You employ passive components such as resistors and capacitors in these IC types.

However, you separately connect the transistors and diodes in the circuit design.

You make these integrated circuit assemblies by depositing conducting material films on the glass surface or on a ceramic stand.

Monolithic Integrated Circuit Assembly

Monolithic Integrated Circuit

Monolithic Integrated Circuit Assembly

You can form single chip interconnections of active, passive, and even discrete components with this IC assembly type. Monolithic integrated circuit assemblies are in popular use owing to their low cost and dependability.

Hybrid/Multi-Chip Integrated Circuit Assembly

A multi-chip IC assembly consists more than one interconnected chip with both active and passive components contained on an individual chip.

You find such IC assemblies in high-power amplifier applications ranging from 5W to 50W with their performance besting monolithic IC assemblies.

What Raw Materials Do You Employ In Integrated Circuit Assembly?

You find majority of integrated circuit assemblies made of pure silicon chemically doped to give the N and P regions.

Silicon serves as the chip’s substrate while you utilize silicon dioxide as capacitors’ insulator and a dielectric material.

When doping, phosphorus and arsenic are two common N-type dopants while P-type dopants include boron and gallium.

You find connectors between the various components in the IC assembly frequently made of aluminum.

Aluminum or gold thin wire leads connect the integrated circuit assembly to the mounting package. You can use ceramic or plastic materials in the construction of the mounting package.

What Are The Benefits And Drawbacks Of Using An Integrated Circuit Assembly?

An IC assembly is a compact silicon wafer you can employ as an oscillator, counter, amplifier, computer memory, microprocessor or timer. You find the following advantages and disadvantages of integrated circuit assemblies:


  • IC assemblies are incredibly small and more dependable with low power consumption.
  • You can easily replace an IC assembly in the event of failure.
  • These chips are ideal in the operation of tiny signals with an increased capacity to work in high-temperature environments.
  • Where parasitic and capacitance effects are absent, you boost IC assembly’s operating speed.
  • You benefit from close component matching and a temperature coefficient due to bulk production.

IC Assemblies Are Easily replacceable In Times Of Failure

IC Assemblies Are Easily Replaceable In Times Of Failure


  • Failure of a single component in the integrated circuit assembly requires a replacement of the entire circuit.
  • Achieving a low-temperature coefficient is tough.
  • An IC assembly can only operate with a certain amount of power.
  • You cannot create coils or indicators in IC assemblies.
  • It is difficult to achieve low noise and high voltage operation.
  • Power dissipation cannot exceed 10 watts while maintaining operation at low-voltage.
  • Integrated circuit assemblies produce limited power necessitating extension.

How Do You Determine An Integrated Circuit Assembly Part Number?

Reading the component number of an IC assembly is a straightforward procedure allowing you to determine the manufacturer and technical details.

Integrated circuit assemblies individually possess a serial number divided into two parts.

You find the manufacturer’s information captured by the first part with the chip’s technical specifications indicated by the second part.

How Does An Integrated Circuit Assembly Differ From A PCB?

You embed an integrated circuit assembly on the printed circuit board via a soldering process. You therefore observe that the PCB serves as the IC assembly’s carrier.

A printed circuit board (PCB) provides electrical connection to components allowing specific functionality.

An integrated circuit assembly is a loaded component fashioned to perform a certain function.

Therefore, you can say an integrated circuit assembly is a single chip containing a general-purpose circuit. It’s a complete package that fails when damaged internally. Contrarily, you can connect different components to a PCB and even replace them when broken.

What Logic Gates Can You Employ With An Integrated Circuit Assembly?

An electronic device that performs logical processes defines a logic gate with the inputs and outputs in binary form (0,1). You can allocate logic gates into three categories of basic gates, universal gates, and exclusive gates.

Basic Gates

Includes NOT, OR, and AND gates and you utilize them for basic functions.

Exclusive Gate

The X-OR and X-NOR gates are the two types of exclusive gates found in IC assemblies.

Universal Gates

The NAND and NOR gates are the two types of universal gates you employ in integrated circuit assemblies. They are “universal” because you can use these gates to build any gates, whether basic or exclusive.

What Types Of Integrated Circuit Assemblies Do We Have?

There are several types of integrated circuit assemblies. You can classify IC assemblies as follows based on their intended applications:

Digital IC Assemblies

Digital IC assemblies are those that only work at limited distinct levels rather than operating at numerous levels of signal amplitude.

You create them with a large number of digital logic gates that accept binary or digital data as inputs.

Digital Integrated Circuit

A Digital Integrated Circuit

Analog IC Assemblies

These IC assemblies function over a continuous spectrum of signals and include linear and radio frequency IC assemblies.  Over a large continuous analog signal range, you can find the relationship between voltage and current nonlinear.

Mixed Signals IC Assemblies

You create mixed IC assemblies by combining analog and digital integrated circuit assemblies on a singular chip.

What Are The Generations Of Integrated Circuit Assembly?

We’ve been through various IC assembly generations from inception, each with a number of transistors and logic gates. The following is a list of the IC assembly generations and their capacities.

  • SSI: Small-scale Integration uses logic gates ranging from 1 to 12 with a few transistors (tens) on a chip.
  • MSI: Medium-scale Integration consists of hundreds of transistors on an IC chip and between 13 and 99 logic gates.
  • LSI: Large-scale Integration comprised transistors in the thousands (500 to 20,000) on a chip at about the same cost as MSI. Logic gates range from 100 to 9,999.
  • VLSI: Very-large-scale Integration employed transistors ranging from 20,000 to 1,000,000 and logic gates ranging from 10,000 to 99,999.
  • ULSI: Ultra-large-scale Integration numbers 1,000,000 transistors and 100,000 logic gate.

What Packages Can You Use With An Integrated Circuit Assembly?

You find the application of two package types with IC assemblies:

Through-Hole Mount

These have lead pins soldered on one side and secured on the reverse side of the board. These packages are large and mostly used to balance board space and cost constraints.

Through Hole Integrated Circuit

Through Hole Mount In IC

Surface Mount

This packaging type engages mounting technology using small IC assemblies. You attach the ICs on the surface of the board via special board areas called solder pads.

Integrated Circuits With Surface Mount technology

Integrated Circuits With Surface Mount Technology

How Does An Integrated Circuit Assembly Work?

An integrated circuit assembly works in similarity to a timer, oscillator, or microprocessor.

The hundreds of components on an IC assembly carry out various functions in order to execute a defined process.

Logic gates, which work in binary form, find use in IC assemblies. A low signal sent to a component via a digital IC assembly produces a “zero” value, while a high signal produces a “one” value.

Analog and linear IC assemblies have permanent values. Consequently, an electronic component connected to a linear IC can use any value and output another value.

What Is Metrology During Integrated Circuit Assembly?

Metrology refers to a process of measuring numbers and volumes, mostly through the use of metrology equipment.

In IC assembly, you measure the first and second layer patterns shot overlay put onto a wafer ensuring accuracy.

Why Is Inspection Of An Integrated Circuit Assembly Necessary?

Inspection allows you to check for compliance or non-compliance in an IC assembly, including abnormality or unsuitability, according to certain criteria.

Inspection allows you to detect particles or flaws present on a wafer and also their positional coordinates.

What Etch Systems Do You Use For Integrated Circuit Assembly?

An etch system allows you to mold preferred designs on an IC thin-film using liquid or ionic chemical reactions, and gases.

You can employ wet or dry etch systems the former using acid or alkali with the latter employing high-vacuum plasma.

For all your PCB requirements and specifications, contact Venture Electronics now.

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