What Are The Advantages Of Arlon PCB?
Arlon PCBs offer a number of advantages in different applications, some of the advantages of Arlon PCBs are as follows.
– Greater strength of copper bonds,great dimensional stability
– Low tangent loss,low insertion loss
– Extremely strong chemical resistance,great signal integrity
– Higher antenna efficiency,stable mechanical properties
– Low moisture,Ideal for ER sensitive circuits
– Uniform electrical performance,dielectric constant,Stable temperature
– Cost-effective,limited edge trimming waste
– Suitable for humid environments
The Features Of Arlon PCB
Arlon PCBs have a variety of properties that are common, and some of its features are as follows:
Polyimide is a polymer of Arlon circuit boards. Polyimide consists of monomers from the high-performance plastics category, which makes PCBs resistant to high temperatures.
– High glass transition temperature
Whether the material is Arlon fabric, Arlon laminate, or other IC material.
– Low loss dielectric thermoset
All types of Arlon PCBs have low loss thermosets, which allows the PCB to operate in high RF environments without rapid temperature rise. All Arlon materials, including silicone, polyimide, and PTFE, have low loss thermosets.
How do you validate the Arlon PCB materials?
Arlon PCBs are made of unique chemical composition materials and we need to verify that the sheet required for the application is Arlon sheet.
Arlon materials consist of conductive layers, substrates, etc., but all Arlon laminates and electrical substrates not having the same function, each laminate and substrate has different properties.
The conductive layers of copper are similar to FR-4 PCBs, but with thicker layers. Microwave Arlon’s material is a fluoropolymer. The combination of all materials ensures that the PCB provides the required electrical performance, this material also confirms frequencies in PCB applications such as power amplifier boards, communication systems, base station antennas, etc.
Venture is a professional Arlon PCB manufacturer in China for over 10 years. We render our clients very great products at the most affordable pricing. Typical applications for these materials include advanced military and commercial electronics such as:
- semiconductor testing
- heat sink bonding
- high-density Interconnect (HDI)
- microvia PCBs (i.e. in mobile communication products).
Your Leading Arlon PCB Supplier in China
Venture is a trusted manufacturer and supplier of Arlon PCB which commonly used in communications and military applications.
We manufacture Venture Arlon PCB that is composed of excellent quality laminate materials. Our Arlon PCB is commonly constructed with materials like FR4.
Venture Arlon PCB is known for its superior high-frequency properties. It delivers the electrical performance needed in frequency-dependent circuit applications. The applications include:
- base station antennas,
- phased array radars
- power amplifier boards
- communications systems
- other antenna applications
If you want to request an Arlon PCB and have detailed specifications in mind, we at Venture Electronics are much willing to help you.
Venture Electronics have an expert layout engineer to help you match your schematic files and design drawings. Additionally, we are committed to enhancing prototyping by the production process to deliver and quote.
Whether you are a system integrator, electrical engineer, maker, or product designer searching for a cost-effective Arlon PCB, Venture Electronic is the best choice!
Venture Electronics has more than 10 years of being a turnkey Arlon PCB solution provider in China.
If you are interested in Venture Arlon PCB, feel free to contact us today!
Arlon PCB: The Ultimate FAQs Guide
In this guide, you will find all information you’re looking for about Arlon PCB.
It covers the uses, classification, quality rating, and co-efficient of thermal expansion, among other critical aspects.
Keep reading if you want to be an expert in Arlon PCB.
- What is Arlon PCB?
- Which are the Types of Arlon PCB Materials?
- What are the Applications of Arlon PCB?
- Why is Registration Important in Manufacturing of Arlon PCB?
- What is the Ideal Co-efficient of Thermal Expansion in Arlon PCB?
- Why is Z-direction Expansion an Important Factor to Consider during Fabrication of Arlon PCB?
- What are the Effects of Copper Anodic Filament (CAF) Growth in Arlon PCB?
- When should you use Polyimide Resins in Arlon PCB?
- Which are the Common Types of Polyimide Resins used in Arlon PCB?
- Which are the Non-traditional Arlon PCB Resin Systems?
- Which Applications of PCB require High Performance Arlon PCB?
- Which are the Methods of Measuring Glass Transition Temperature of Arlon PCB?
- How does Dielectric Constant of Arlon PCB affect Signal Propagation Speed?
- What is the Importance of Copper Foil in Arlon PCB?
- What is the Difference Between Electrodeposited Copper Foil and Rolled Copper Foil in Arlon PCB?
- Which are the Factors that Determine the Thickness and Type of Copper Foil to use in Arlon PCB?
- What is Weave Distortion in Arlon PCB Laminate?
- What is Gel Time in Arlon PCB Fabrication?
- Why is Flow Important in Manufacture of Arlon PCB?
- What are No-flow Prepregs in Arlon PCB?
- Are there Low-flow Arlon PCB Materials?
- What is IPC-4101?
- Which are the Arlon PCB quality tests required by IPC-4101?
What is Arlon PCB?
This is a printed circuit board constructed utilizing specialty high performance prepreg and laminate materials.
Arlon PCB needs laminates having specialized mechanical, thermal, electrical, or additional performance features which surpass the ones for ordinary FR-4 PCB materials.
It specifically employ thermoset resin system comprising of high Tg multipurpose low loss, epoxy or polyimide, and low loss prepreg and laminate complex.
The resin structure comes on different substrates constituting non-woven aramid and knitted glass.
Basically, this is a high performance PCB material.
Which are the Types of Arlon PCB Materials?
Some of the common materials used in Arlon PCB include:
- Arlon Polyimide materials
- Arlon 33N Kerimid 701 (VO) Polyimide
- Arlon 35N Kerimid 701 (V1) Polyimide
- Arlon 38N Low Flow Polyimide Prepreg
- Arlon 37N Low-Flow polyimide
- Arlon 84N Multifilm Hole-Fill Prepreg
- Arlon 85N Polyimide (Unmodified)
- Arlon HF-50 Polymide Hole Fill Compound
- Arlon Epoxy materials
- Arlon 47N Low-Flow Tetrafunctional Epoxy
- Arlon 49N Low-Flow Multifunctional Prepreg
- Arlon 44N “Multifilm” Hole-Fill Prepreg
- Arlon 45N Multifunctional Epoxy
- Arlon low cost laminates
- Arlon AR1000
- Arlon AD250
- Arlon AD255
- Arlon AD270
- Arlon AD320
- Arlon AD350
- Arlon AD600
- Arlon CLTE-LC
What are the Applications of Arlon PCB?
Typical applications of Arlon PCB consist of advanced:
- Military electronics such as avionics and high Density Interconnect (HDI)
- commercial electronics
- mobile communication products
Moreover, Arlon PCB Microwave Materials specifically find use in frequency-based uses including:
- Base station antennas
- Power amplifier PCB communications network
- Phased array radars
Why is Registration Important in Manufacturing of Arlon PCB?
Arlon printed circuit board
Also known as dimensional stability, correct registration is stability of both process and product.
This is because all PCB laminate materials contract to some extent on etching.
The best Arlon PCB material would be the type that shrinks minimally on etching.
It should also have uniform and replicable variation that would permit foreseeable considerations for artwork adjustment.
The right Arlon PCB material is one that needs no artwork compensation completely, and invariably register correctly not to need drill adjustment.
In dimensional stability, there is a negligible link between an IPC test and the real registration of a distinct design of PCB.
Registration remains a critical Arlon PCB manufacturing concern for HDI and high layer count designs.
What is the Ideal Co-efficient of Thermal Expansion in Arlon PCB?
Normally denoted in ppm/degree Celsius, CTE needs to be closely equivalent to the expansion specifications of:
- Thermal sheets embedded within the circuit board
- Components to be installed on the surface of PCB
Presently, a CTE of 6.0 ppm/degree Celsius is perfect for leadless ceramic chip carrier fitting. Arlon’s 45NK, which is woven Kevlar strengthened laminate having moderately low resin constituents come nearest to the ideal 6.0 CTE.
Other materials like Copper-Invar-Copper distributed constraining sheets, non-woven aramid reinforcement and quartz reinforcement attain figures as reduced as 9 to 11.
This is a significant advancement over 17 to 18 for traditional epoxy or polyimide laminates.
The latter have demonstrated acceptable and stable in a number of designs of Arlon PCB.
Why is Z-direction Expansion an Important Factor to Consider during Fabrication of Arlon PCB?
In principle, expansion in the Z-direction needs to equal that of plated through hole copper (around 17 ppm/degree Celsius).
This is essential in preventing destruction of the plated copper in the course of thermal excursions due to process steps like solder reflow.
The co-efficient of thermal expansion of most traditional Arlon PCB materials ranges from 50 to 60 ppm/ degree Celsius below the Tg.
PCB materials with high Tg such as polyimide experience reduced general Z-direction expansion (approximately 1.1 percent from 50 to 250 degree Celsius).
This is in contrast to ordinary epoxy systems, which experience around 3 to 4 percent Z-direction expansion because of their higher Tg.
What are the Effects of Copper Anodic Filament (CAF) Growth in Arlon PCB?
Copper Anodic Filament across adjoining plated through holes might result in short circuits and sporadic execution in Arlon PCB.
This occurs when a mix of physical pathway, steady voltage difference between holes, physical pathway and ionic residues drive electro-migrated copper deposition across a glass fiber.
CAF is specifically an important factor in high performance PCBs that will function continuously for long duration like in high end servers.
It has been difficult defining practical Pass-Fail specifications, and CAF problems can be as much connected to PCB manufacturing as to material selection.
Engineered glass lacquer technology, appropriate resin formulation, and enhanced processing may intensify resistance to CAF creation.
When should you use Polyimide Resins in Arlon PCB?
Polyimide resins are utilized in PCB process or application where high temperature is anticipated.
The polyimide’s high glass transition temperature makes it the right PCB material to utilize in the following environments or applications where:
- High temperatures operationmight lead to potential flaws within plated through holes. Using polyimides minimize general stress in a hole as a result of solder reflow, thermal processing, and the like.
- The PCB will be subjected top routine repair, or where you will frequently detach and re-solder components. Polyimide prevents lifting of pad and added destruction due to recurrent temperature application.
- The application of Arlon PCB needs exposure to extreme temperature conditions.
Which are the Common Types of Polyimide Resins used in Arlon PCB?
There exist three general types of polyimides commonly used in Arlon PCB, including:
- Pure Polyimide incorporating Second generation polyimides, like Arlon 85N that lack brominated flame retardants, which minimize thermal stability.
Serve as the ultimate in temperature resistance and thermal stability.
- Third Generation Polyimides, including Arlon’s 33N and 35N. They offer stronger resins having enhanced flammability resistance.
Boosted polyimide cures in the two types of Arlon PCB materials have facilitated shorter cures and lower temperature than ordinary “pure” polyimides.
- Filled polyimide complex like 84N by Arlon are utilized in applications requiring clearance holes in printed circuit boards having ground planes or metal cores.
Role of the filler is to minimize resin shrinkage.
This reduces formation of crack in filled sections either when curing or when you subsequently drill the clearance holes.
- Low-Flow polyimides constituting epoxy resins together with the needed catalysts, bismaleimide resins, accelerators suitable to the formulation and flow restrictors. Examples include Arlon’s 37N and 38N that are blended polyimides having Tg about 200 degree Celsius.
They are utilized fundamentally within rigid-flex applications.
Here, you need polyimide materials for reliability, normally in military and commercial flight applications.
- Fourth Generation improved polyimides having reduced ambient moisture sensitivity and advanced copper foil adhesion.
Besides, these types of Arlon PCB polyimides also have advanced registration stability and minimized z-direction expansion.
Which are the Non-traditional Arlon PCB Resin Systems?
The need for enhanced loss and dielectric features has necessitated the development of blended PCB variety and use of non-conventional resin systems.
They may employ completely different cure technique, for example, peroxide cures.
These systems may use PCB materials that traditionally were not used in conventional PCB, like blends with polyphenylene ether/polyphenylene oxide, polyolefins, etc.
Some of the non-traditional Arlon PCB resin systems include:
- 25N resin
- 25FR resin
These resin systems provide enhanced electrical features, though they need a modified process of lamination due to their peroxide cure mechanism.
Which Applications of PCB require High Performance Arlon PCB?
A high performance laminate is a type of PCB laminate that executes functions which cannot be attained utilizing ordinary FR-4 materials.
There exist a number of uses of PCB that need high performance Arlon PCB.
- Applications with special thermal specifications, either since they’ll function ceaselessly or sporadically in extreme temperature conditions.
Furthermore, if the PCB will have to manage high power concentrations within small areas.
- High speed digital uses usually need high layer count or large multilayers Arlon PCB that are extraordinarily complex to fabricate.
Such circuit boards may require advanced electrical features like minimized dielectric constant to boost speeds of signal propagation.
This entail PCBs with sophisticated imprinted patterns needing accurate registration.
- PCB needing SMT technology with controlled thermal expansion features.
- Boards having tightened or distinctive electrical specifications, particularly those that require definite regulated impedance.
- PCBs which will function at RF/microwave frequencies, thus need materials having low dielectric constant or low loss.
These features are getting increasingly essential since most applications are managing high frequency and high quantity digital data.
- Circuit boards which need high density interconnection (HDI).
Also, where you need to laser-drill materials to form microvias from the exterior to layers two and three.
Which are the Methods of Measuring Glass Transition Temperature of Arlon PCB?
There are several techniques of measuring thermal transition temperature of Arlon PCB consisting of:
- Surface Strain Gauges
- Thermo-Mechanical Analyzer
- Dynamic Mechanical Analyzer
- Quartz Tube Dilatometer
- Differential Scanning Calorimetry
The figures attained by every method will differ, since every technique determines a moderately distinct feature or mix of features.
Due to the wide accessibility of TMA equipment, it has become the technique of choice.
The method provides better and reliable results if carried out by an expert applying keen sample preparation methods.
TMA is the recommended method of measuring glass transition temperature of Arlon PCB, because it measures expansion and CTE properties.
These are direct index of the strains exerted on a plated through hole.
How does Dielectric Constant of Arlon PCB affect Signal Propagation Speed?
Dielectric constant of Arlon PCB material dictates the relative speed at which electrical signal will flow within the material.
The speed of signal is inversely proportional to the dielectric constant square root.
A low dielectric constant of PCB leads to a high speed of signal propagation.
On the other hand, a high dielectric constant leads to slower speed of signal propagation.
What is the Importance of Copper Foil in Arlon PCB?
The copper foil in Arlon PCB has a number of functions.
The main role is being a circuit route that carries impulses from one section to another, enabling linkage of several modules on the PCB.
It equally functions as ground and power covering.
Moreover, copper films may assist in carrying unnecessary heat away from power devices.
What is the Difference Between Electrodeposited Copper Foil and Rolled Copper Foil in Arlon PCB?
Electrodeposited copper foil refers to ordinary copper utilized in PCB industry.
It is precipitated from emulsion at definite current and voltage states onto an in motion steel or titanium drum.
It is eventually stripped from the drum.
The grain structure developed by this operation creates the copper dendritic “tooth” on the “bath section” of the foil.
The drum section assumes the even character of the glossy surface of the drum on which you plate it.
Conversely, rolled copper is produced through passing a copper strip via continuously tinnier and tinnierapertures within a rolling mill.
This is done till the copper strip attains the required thickness.
This type of copper used on Arlon PCB is smoother and you can make it very flexible through annealing.
Due to its smoothness, the bond of rolled copper to laminates is entirely based on the characteristic of treatment it gets.
Furthermore, the bond also relies on the mechanical or adhesive features of the resin system you are bonding it to.
In addition, this type of copper has a differing grain structure compared to electrodeposited copper and will impress at varying rate.
Moreover, rolled copper has lower dissipation factor in comparison to ED copper foil due to a phenomenon referred to as surface effect.
This makes it suitable for RF and microwave applications.
However, majority of the rolled copper foil within the laminate sector is utilized in elastic PCB.
They are typically bonded using acrylic adhesive to a polyimide sheet, in which its ductility is critical to the application.
High frequency Arlon PCB
Which are the Factors that Determine the Thickness and Type of Copper Foil to use in Arlon PCB?
As an Arlon PCB designer or fabricator, you must establish a number of features of the PCB.
These board characteristics will dictate the thickness and copper type to utilize:
- The board’s power management specifications, since slim will not manage as much power as compared to thicker copper.
Furthermore, excessive power channeled via a small cross section might lead to overheating and burnout;
- Line loss and characteristic impedance are influenced by thickness and dielectric constant of the laminate.
The area of cross section of the copper foil utilized equally affect line loss and impedance of the PCB.
All these factors need to be put into consideration during design calculations.
- Spacing and size of copper traces supposed to be impressed on the various layers of Arlon PCB.
Narrow spacing and extremelythin lines will typically need finner DSTF or copper to reduce damage in the course of etching;
- The amount of heat dissipation that the copper should manage, particularly in the interior layers. Heavier copper foil have more capability to dissipate heat.
- Factors like bonding of interior layer, among others that might need specific copper finishes or attributes;
- In RF/microwave Arlon PCB uses, courseness of the copper foil surface will affect loss properties of a conveyance line.
Therefore, copper foils with lower profile are usually recommended where system loss is crucial.
- When copper is utilized for lamination of lamination, the finish of copper foil is important and should be feasible with the resin complex applied.
What is Weave Distortion in Arlon PCB Laminate?
Weave distortion happens when a few of the fill yarns in the Arlon PCB laminate are out of true.
The fill yarns ought to be at right angle with warp yarns that are usually under pressure and stay straight in the course of handling.
There is possibility of formation of rippled or twisted condition of laminate or multilayer if distortion in some of the yarns occur.
Therefore, it is important to have non-deformed yarns within the raw fabric.
Furthermore, you need to ensure alignment of the yarns in one prepreg sheet relative to the other, or warpage can happen.
What is Gel Time in Arlon PCB Fabrication?
Gel time is the period at a specific temperature that a resin takes to transform to gelled condition from free-flowing fluid.
Normally denoted in seconds, epoxy gel time is an estimate indicator of the time period the prepreg will flow in the course of lamination.
The higher melting points of pure polyimides always lead to improperly defined gel points.
However, this can be changed when the temperature you perform the gel time is modified above 171 degree Celsius.
Why is Flow Important in Manufacture of Arlon PCB?
“Flow” refers to a semi-quantitative evaluation of the melting and flow of the resin during the process of lamination.
Actual resin flow is essential to the lamination process of the Arlon PCB and can be impacted on greatly by laminating conditions.
Therefore, you should be guided by IPC flow test figures but you should not observe the guide with excessive value.
Actual flow amount quantity attained will influence features like bond to internal layer of copper and interlaminar bond.
It also impactfusion of laminate to electrodeposited copper utilized in the fabrication of laminate.
Similarly, actual flow amount as well affect the general prepreg effectiveness as a bonding panel.
Therefore, the Arlon PCB should exhibit uniform flow characteristics to ensure repeatable fabrication performance.
What are No-flow Prepregs in Arlon PCB?
Low-flow prepregsrefer improved prepregs instrumental in minimizing their flow.
This is crucial in situation where it is unacceptable for the bond line to have a resin “bead”.
No-flow prepregs popularly find use in rigid-flex lamination and heat sink bonding.
In these applications, several cut-out sections cannot withstand flowing in of resin.
In some instances, you can place IC die within the cut-out region.
In certain instances, beads of resin hinder secondary processes.
Are there Low-flow Arlon PCB Materials?
There are several Arlon PCB polyimide and epoxy low-flow materials optimized for a number of end user requirements and applications:
- 37N Polyimide Low-Flow vital in applications requiring rigid-flex PCB. They have a glass transition temperature greater than 200 degree Celsius.
- 38N Polyimide Low-Flow which is a 2nd generation low-flow having improved adherence ability to polyimide panels. They also boast of adjusted rheology to widen its process flexibility, with Tg greater than 200 degree Celsius.
- 47N Tetrafunctionalimproved epoxy No-Flowideal for use in bonding heat sink in several PCB uses. These types of Low-flow Arlon PCB materials have a Tg of 130 degree Celsius.
- 49N Multifunctional Epoxy No-Flow perfect for applications needing high temperature epoxy rigid-flex PCB. They comprise of applications employing modern adhesiveless flex products.
- 51N Lead-Free Epoxy Low-Flow uses an advanced resin system which satisfies the IPC recommended specifications applied inLead-Free solderability board uses.
Moreover, you can find thermally conductive Arlon PCB epoxy prepregs that you can use in low-flow applications due to their high filler loading.
However, they require slight process modification in heat-rise and pressure.
- 91ML: A Lead-Free complex having a 1.0 W/m-K Tc and Tg of 170 degree Celsius.
- 92ML: ALead-Free structure having a 2.0 W/m-K Tc and Tg of 170 degree Celsius.
What is IPC-4101?
IPC-4101 refers to the PCB sector standard for specifying PCB products and describing the features of materials.
The basic definition of laminate in IPC-4101 comes as the Slash Sheet.
You will find in the slash sheet the name of the specific materials together with the definition of minimum vital features requirements.
IPC 4101 integrates line call-out mechanism that allows spelling out of the type of prepreg or laminate.
The system also describes the basic features of that Arlon PCB material.
The line call-out mechanism for laminates incorporate information about weight and type of copper foil, base thickness, base material, and other important features.
Nevertheless, it does not include specific fabrications nor does it specify values for various other attributes that should be considered.
Which are the Arlon PCB quality tests required by IPC-4101?
IPC-4101 specifies various categories of quality tests for PCB.
You are required to perform Qualification Retention testing and Qualification testing at an authorized external laboratory.
The tests must be carried out at the indicated frequencies and a reported produced.
Retention of qualification needs you to do routine PCB testing in every sections.
The rate of these tests differ and might be needed monthly or quarterly on each lot.
The Arlon PCB quality test can be performed through a professional external lab or in-house.
The examinations should be done employing the right ASTM, UL or IPC test methods.
For Arlon PCB laminates, the quality test specified by the IPC-4101consist of tests on:
- Surface finish (scratches, pits, wrinkles, and dents)
- Base material condition after impressing of copper
- Bow and twist
- Thermal stress resistance
- Volume and surface resistivity
- Water absorption
- Dimensional stability
- Peel strength
- Dielectric strength (Right angle to PCB laminate)
- Flexural strength
- Dielectric breakdown
- Dielectric constant (permittivity) and Dissipation factor)
- Arc resistance
- Q resonance (in case needed in microwave applications)
- Average CTE
- Fungus resistance
- Glass transition temperature
- Chemical resistance
The slash sheet specifies requirements for independent materials.
For Arlon PCB prepregs, the stipulation requires testing for:
Arlon printed circuit part
- Dicyandiamide crystals presence (for epoxy systems)
- Volatile content
- Flammability and other properties of prepregs
- Electrical strength
Moreover, there is Lot Acceptance testing which refers to testing that must be carried out on each lot of the Arlon PCB material.
The description of a lot differs slightly though is basically all the material manufactured at similar time utilizing similar raw materials lots.
Lot tests comprise of basic PCB tests like:
- Resin content
- Flow and volatiles, and
- Laminate tests including copper peel, thermal shock resistance, thickness, and optical examination of surfaces of copper surfaces for inclusions and scratches.
In short, there are many factors you should consider when importing Arlon PCB.
Here at Venture Electronics, we design and fabricate high performance Arlon PCBs.
Contact us today for all your OEM Arlon PCB needs.