Thick film CeramicPCB

  • No minimum order required for every Thick film Ceramic PCB
  • Professional services and excellent products
  • 24/7 tech support
  • More than 10 years of experience

Thick film ceramic PCB capability

1.Aluminum oxide Ceramic (Al2O3) 96% or above

2. Aluminum Nitride Ceramic ( AlN )

3.Ceramic thickness: 0.25, 0.38, 0.50, 0.635, 0.76, 1.0mm 1.5mm 2.0mm

4.Min. Trace Space/width: 0.1 /0.1mm

ENEPIG-used-as-a-Surface-Treatment-for-Thick-film ceramic-PCB

Is ENEPIG used as a Surface Treatment for Thick Copper PCB?

Yes, sure. This surface treatment is applied to the bare board surface of the thick film ceramic PCB for two critical functions.

1. To protect the thick membrane conductive track from oxidation
2. To offer the better solderability

Please don’t forget to contact Venture Electronics if you have any enquiry.

Thick Film Ceramic PCB Design Guide

Due to its special features of thick film ceramic PCB, you can’t design that thick film ceramic board following the design rule of common FR4.

Here are simple design guide for your Thick Film Ceramic printed circuit board.
1. Material type: Alumina (96% Al2O3), BeO, AIN;


Usually, the thickness of our Thick film Ceramic PCB can exceed up to 10 Miron up to 10~13um. At the same time, Venture professional engineers can use interchangeable conductor, semi-conductor, conductor, electric capacity, and resistor at the same time while using thick-film technology. 

Venture Thick film Ceramic PCB has a conductor layer materials like gold palladium and silver palladium. Solder mask of our Thick film Ceramic PCB is also available upon your request with >500C working temperature and semi-transparent color. 

Your Leading Thick film Ceramic PCB Supplier in China

Thick film Ceramic PCB, also called a Thick Film Hybrid Circuit is to equip an excellent carbon resistors printing in a Ceramic by using standard PCB processing. These are based novel hydrophobic polyamide resin that is specifically developed to function as a polymeric thick film resistor.

Venture Thick film Ceramic PCB is a technology in which new materials will improve the embedded resistor process by eliminating the requirements of special termination treatment like gold-palladium, silver palladium, or immersion silver.

Venture Thick film Ceramic PCB can be very suitable for applications like:

  • telecom device
  • high-power LED
  • Sensor
  • chip, wafter
  • solar cell
  • street light, high bright light
  • semiconductor process equipment
  • automotive light system
  • high-power electronic semi-conductor module
  • hybrid integrated circuit for automotive
  • electric power transmitter module
  • fuel sendor resistor card
  • anti-block braking system
  • injection system

It also speeds up the process of laser trim with tighter TCRs. It can also optimize performance reliability with a stable binder system. The tolerance of our Thick film Ceramic PCB final trace layout will be +/-10%.

Solder mask of our Thick film Ceramic PCB is also available upon your request with >500C working temperature and semi-transparent color.

Are you a distributor or an electrical engineer looking for a top-quality Thick film Ceramic PCB? Venture can always satisfy your needs!

You can trust our over 10 years of experience in this field! Therefore, you can assure that Venture can provide you great quality products along with the best services.

You don’t have to worry if you have a large-scale or small quantity Thick film Ceramic PCB. Venture offers no MOQ for every Thick film Ceramic PCB order.

Venture also provides flexible payment terms to support your business. Aside from that, we offer competitive pricing and 24/7 tech support and live sales. If you have questions about our Thick film Ceramic PCB, our customer service team will respond within 2 hours.

Contact us for more information about our Thick film Ceramic PCB!

Thick Film Ceramic PCB: The Ultimate FAQ Guide


In this guide, you will learn all the fundamental aspects of thick film ceramic PCB such as features, quality standards, fabrication, trace requirements, and thickness, just to mention a few.

Keep reading if you want to be an expert in thick film ceramic PCB.

What is a Thick Film Ceramic PCB?

Thick film ceramic PCB

Thick film ceramic PCB

A thick film ceramic PCB is a printed circuit board made by applying thick conductive material exceeding ten microns over a ceramic core.

The application process is done repetitively while interchanging the dielectric and conductive material.

A common conductive material used with thick film ceramic PCB is gold which is expensive and therefore limits its use.

The conductive layer is attached to the fine ceramic base by a low sintering process.

In this case, temperature values are kept at about 900 °C.

Nitrogen gas is employed to thwart the formation of an oxide layer over the conductive surface.

This greatly influences the board’s resilience and consequently its quality.

What is the Difference Between the Thick Film and the Thin Film Ceramic PCB?

The difference between the thick film ceramic PCB and the thin film lies in the thickness of the conductive plane.

A ceramic PCB is considered to be a thick film when the conductive surface is over ten microns thick.

For a thin-film ceramic PCB, you find a thickness value of the conductive plane to be lower than ten microns.

Another notable difference is in the fabrication complexity.

Making the thin film ceramic PCB involves more sophisticated equipment that impacts unfavorably on the overall production cost.

What’s more, thin-film ceramic PCBs are usually common in analog circuitry where accuracy and high performance are of utmost concern.

What are the Attributes of Thick Film Ceramic PCB?

Ceramic PCB

Ceramic PCB

The thick film ceramic PCB utilizes aluminium oxide and aluminium nitride for its ceramic substrate base.

The conductive layer is bonded to the substrate at elevated temperatures.

The resulting printed circuit board has good performance with the following qualities:

  • The thick film ceramic circuit board isolates the conductive layer electrically preventing current leakage.
  • You find thermal conduction in the thick film ceramic PCB is efficiently carried out. As a result, heat build-up is an unlikely occurrence.
  • The dielectric properties of the thick film ceramic circuit board are exceptional for reliability purposes such as low constant of dielectric and permittivity.
  • The resulting ceramic circuit board based on the thick film exhibits great strength particularly mechanical, bonding, and adhesive.
  • The thermal coefficient of expansion of the thick film ceramic circuit board easily conforms to that of the attached parts and fixtures.

This way, you realize the response to temperature changes is similar preventing strain.

  • Additionally, you will find that soldering work on a thick film ceramic PCB is easy to carry out.

This is because of the high thermal resistance enabled on the board surface.

  • With a thick film ceramic board, you can implement many different conductive track designs with amazing electrical charge transfer.
  • The circuit board of this design is highly reliable. You can carry out tens of thousands of cycling processes at extreme temperatures.
  • Additionally, this ceramic board type can resist chemical impingement through corrosion.

You find it, therefore, retains its physical integrity on interaction with chemical agents.

  • Dirt and other contaminants cannot affect the performance of the thick film ceramic PCB.

You find this board can resist such contaminants and maintain its functionality.

  • The thick film ceramic PCB can work within a wide temperature range and still be reliable.

The wide temperature range allows for the same performance standards regardless of external conditions.

What is the Thickness of the Fine Ceramic Substrate in Thick Copper Ceramic PCB?

A ceramic substrate such as alumina and aluminium nitride has very high conductivity levels of heat.

Alongside their low dielectric properties, you find these fine ceramic compounds offer exceptional performance relative to their size.

The thickness for ceramic substrates used in thick copper ceramic PCBs can range between 0.2 mm and 1mm.

This allows for faster heat movement while also accommodating miniaturization of designs.

You are also able to customize thickness to your liking with greater values up to 2 mm.

What are the uses of the Thick Film Ceramic PCB?

The thick film ceramic circuit board has exceptional current carrying ability, consequently, you would expect its use in power applications.

There are numerous usages of the thick film ceramic circuit board as follows:

Ceramic PCB

Ceramic PCB

  • The thick film PCB is used in LED devices that have large power demands alongside other power semiconductors.
  • You also find thick film circuit boards in power heavy contraptions such as modules, control, and mixing circuits.
  • Furthermore, you will find microwave contrivances utilizing thick film PCBs in their systems.
  • The automotive industry also puts thick film ceramic circuit boards in use in their electronic systems.
  • Appliances transacting large frequency signals such as power system supplies have thick film ceramic PCBs to back their functions.
  • Solar arrays as power devices utilize thick film ceramic circuit boards in their power transmission modules.
  • Communication systems with solid-state bases employ thick film ceramic PCBs in their electronic structure.
  • Equipment for use in space-related ventures such as satellites applies thick film ceramic circuit boards in their electronic systems.

Can the Thick Film Ceramic PCB be Fabricated in Multiple Layers?

Yes, it can.

You find the thick film ceramic PCB can be furnished as a single board side and with multiple layers too.

A single-sided thick film ceramic PCB has only one conductive layer.

The layer is populated on one surface while the adjacent surface is used for wiring.

A multilayer ceramic PCB can have up to six conductive layers.

In this formation, the thick film PCB can be made small with an increased circuit density of high-value resistance.

With this ability, the multilayer thick film ceramic PCB can regulate internal temperature values.

Multi layer ceramic PCB

Multi-layer ceramic PCB

How does the Thick Film Ceramic PCB compare to other Ceramic PCBs?

The thick film ceramic PCB is a ceramic PCBemploying a thicker conductive plate.

The increased thickness allows it to enhanced electrical conductivity in signal transfer while improving other thermal and insulation properties.

Other points of comparison include:

  • The thick film ceramic circuit board has a higher capability in conducting heat than a regular ceramic board of similar respect.
  • Another aspect to compare is the expansion coefficient of temperature. The thick film board‘s CTE is closer in values to attached elements than that of the regular ceramic board.
  • The current values conducted on the thick film ceramic board are much higher than standard ceramic PCBs.
  • The thick film allows for more energy transfer per unit area.
  • Combining the fine ceramic substrate with a thick conductive film allows for greater isolation of the distinct layers electrically.
  • When soldering, you find the thick film ceramic PCB surface adheres more to the process. Additionally, the effect of soldering temperature is less than an ordinary ceramic PCB.
  • The loss in frequency signals observed in thick film ceramic PCBs is much less than an ordinary ceramic circuit board.
  • You find better signal management with thick film circuit boards.
  • The circuit density achieved with thick film ceramic PCBs is greater than standard ceramic printed circuit boards. This allows for increased population density to drive performance.
  • With a thick conductive plane, you can expect the thick film board to last longer than a standard ceramic board. There is a reduced chance of track oxidation to hinder conductivity.

What are the Trace Requirements for a Thick Film Ceramic PCB?

The trace of a thick film ceramic printed circuit board refers to the conductive pattern to which electronic components are connected.

Common trace parameters considered include the trace width which is the length across a conductive track.

Also, important is the trace spacing which is the distance provided between adjacent traces.

The trace width can be specified between 0.15 and 0.3 mm and the spacing at 0.2 and 0.3 mm. you note, the smaller the value, the higher the fabrication cost.

Is Laser Drilling used for the Thick Film Ceramic PCB?


Laser drilling is a drilling process that is guided by the use of laser emissions.

Drilling of a thick film ceramic board is necessary for the making of interlayer connections and component placement.

Interlayer connections include plated through-holes used as vias.

Laser drilling finds use on thick film ceramic circuit boards due to the advancements made in technology and the accompanying demands.

You find laser drilling important especially when fabricating miniaturized thick film ceramic PCBs.

Laser drilling is guided by artificial intelligence developments that have simplified processes in the PCB manufacturing industry.

You can carry out the process on large volumes of boards with a high number of hole requirements with close tolerances.

What are the Advantages of Laser Drilling Thick Film PCBs?

Laser drilling has several advantages to thick film ceramic PCBs.

Some of the notable benefits resulting from this technological use are as follows:

  • The laser-guided drilling process is faster and highly efficient.

Additionally, you find that the laser-guided drilling process is more accurate with a high level of precision.

  • With laser drilling, the bond created between the conductive surface and fine ceramic substrate is uninterrupted. Thus, electrical isolation remains steadfast.
  • Besides, the heat generated by the drilling process is much less than the heat generated in mechanical.

You, therefore, find less demand for thermal efficiency.

  • You achieve closer tolerances when employing laser-guided drilling to the tune of micrometers.

In this manner, particular customization can be executed without difficulty.

  • The output realized through using laser-guided drilling is far much higher than other drilling techniques.

The laser equipment used can simultaneously drill multiple holes on board with high precision.

  • When conducting laser drilling, you benefit from higher modulation at a consistent power supply.

Furthermore, the process is highly dependable with few chances of error.

  • There is higher desirability for micro-vias borne through laser drilling than other drilling processes.

This is despite the sophistication level since the efficiency and fast process of stamping is rewarding.

  • Laser drilling has minimal material wastage due to the clean process. You, therefore, find reduced affluence that could present a potential harm to the environment.
  • Using laser radiation ensures the board surface is unaffected by the rigors of mechanical drilling. Consequently, a smooth surface is ensured with a very low ratio accounting for coarseness.

How do you drill Thick Film Ceramic PCB using Laser?

Vias on PCB

Vias on PCB

The laser drilling process is carried out by the use of laser machines.

These are powerful high power equipment that release pulse waves in short bursts.

The result is the realization of an intense energy output that extracts material from the highlighted target location creating a hole.

Normally, the process described above is referred to as ablation and can be achieved either photo-thermally or photo-chemically.

When ablation is carried out photo-thermally, the holes are bored by the precipitous absorption of laser radiation via the fine ceramic.

On the other hand, ablation is photo-chemically carried out by the chemical amalgamation of laser radiation with excited photons.

The particle length of the radiation is typically about five hundred nanometers while the photon energy at over three electron volts.

A major limitation of the ablation technique is the possibility of a disruption of the ceramic substrate’s molecular continuity.

The result can be the dispersing of stray energized molecules that can penetrate the board structure forming minuscule holes.

Can a Thick Film Ceramic PCB use Silicon Nitride as the Ceramic Base?

As a matter of fact, yes.

You find silicon nitride as a fine ceramic that provides a substrate with remarkable qualities for use in thick film ceramic PCBs.

Silicon nitride has good flexural strength with a large resistance to fractural forces.

Additionally, you would expect no less than an outstanding thermal performance from a thick film PCB with a silicon nitride base.

Thus, this type of thick film ceramic PCB is highly reliable achieving hermetic capability after only a thousand thermal cycles.

Furthermore, the thick film ceramic circuit board with a silicon nitride ceramic base enjoys high isolation capabilities.

It exhibits great tolerance to dielectric breakdown voltage up to five thousand cycles during a thermal cycling test.

The temperature range when carrying out a cycling test for silicon nitride is between -55°C to 180°C.

What are the Conductive Materials used for the Thick Film Ceramic PCB?

The thick film ceramic PCB engages the use of conductive layers that are thicker than ten microns.

Such thickness ensures the thick film ceramic PCB can support functions drawing large power.

You find the followed materials utilized for the conductive material of a thick film ceramic PCB:

  • Gold which has excellent conductive properties concerning electrical charge transfer and is not easily affected by oxygen.

The main limitation to its use, however, is its high cost.

  • Silver, whose resistivity to electric charge flow is very low making it an excellent conductor.

It is also comparatively cheaper than gold. Silver, however, has poor resistance to oxide formation.

  • Palladium offers impressive electrical conductivity, especially when combined with gold or silver. It also does not impede soldering activity.

Can a DBC Ceramic be Furnished as a Thick Film Ceramic PCB?

DBC stands for directly bonded copper.

This kind of ceramic board has copper plates affixed to the fine ceramic substrate base.

This process is typically carried out in elevated temperature conditions.

Sometimes for increased thermal performance, both substrate surfaces are bonded with copper plates.

A DBC ceramic PCB is unlikely to be furnished as a thick film ceramic PCB.

You find the thickness of a thick film ceramic PCB is much lower than that of the DBC ceramic.

Additionally, silver and gold are more popular explored for the conductive plane of the thick film ceramic PCB.

However, both ceramic PCB types are used in large power demanding applications.

Why is Aluminium Nitride Preferred for Thick-film Ceramic PCBs?

Ceramic PCB with aluminum nitride

Ceramic PCB with aluminum nitride

You find aluminium oxide and aluminium nitride as the popular fine ceramic materials used as substrates for thick-film ceramic PCB.

While aluminum oxide is cheaper costing less than aluminum nitride, the latter is preferred for its impressive overall properties.

With aluminium nitride, you find it forms a lighter substrate material compared to an aluminium oxide of the same thickness.

Furthermore, the thermal conduction property of aluminium nitride is higher than alumina. This enables faster dissipation of heat in the board structure.

How does Directly Bonded Copper compare to Thick Film Ceramic PCB?

You find the following benefits associated with directly bonding copper compared to a thick film ceramic PCB:

  • Directly bonding copper to a ceramic PCB will result in a bond with enhanced adhesive strength.
  • Additionally, this type of ceramic circuit board has the added feature of large current transfer. This necessitates its use in high power applications.
  • You also find that you can combine both ceramic substrate surfaces with a copper plate. This structural modification allows the use of the bottom plate as a heat sink augmenting the efficiency in thermal conductivity.
  • When used in power diodes, the copper bonded ceramic PCB strengthens the dielectric capacity and stability of the material. The working temperature and related cycling remain unchanged yet.
  • The structural strength of the ceramic PCB that is copper bonded is great with resistance qualities against surface distortion.
  • You experience impressive solderability with the fair surface that is void of defects such as bumps and cracks.
  • Having a thick copper plate as the allows you to design intricate patterns for the conductive path. This can be accommodated by the resultant board’s impressive temperature cycling.

How does a Thick Film Ceramic PCB Function in a Solar Battery?

Ceramic PCB in solar battery system

Ceramic PCB in solar battery system

When employed in a battery package for solar systems, the thick copper ceramic PCB is harnessed as a photovoltaic concentrator.

High-temperature bonding is used to furnish the thick film substrate for the battery pack.

The thick film is attached to the fine ceramic substrate without the need for an active adhesive agent.

The nature of the bond is molecular such that it appears as a single formation.

This structure enhances the electrical isolation of the circuit board.

Additionally, you find the thick film ceramic PCB used in solar systems for batteries made of elaborate conductive tracks.

These paths are developed by using a chemically assisted etching process and especially laser-guided cutting which enhances the accuracy levels.

Furthermore, you find the strength of the bond can withstand a cycling test conducted at elevated temperatures for several cycles.

More so, the impressive dielectric qualities of ceramic and the low CTE allow the battery pack to bear temperature changes.

What is the Process Flow of the Thick Film Ceramic PCB?

The fabrication of the thick film PCB involves the depositing of a thick conductive layer over the fine ceramic substrate.

The process typically encompasses the preparation of the substrate which is usually an aluminium oxide or aluminium nitride.

The fine ceramic substrates are first prepared by scoring holes via a drilling process.

The boring process can be carried out by manual drill machines or be a laser-guided process.

Holes formed on the substrate surface are according to the board design and application.

On completion of the scribing process, the substrates are cleaned.

Cleaning ensures drilled material and other bits and parts on the surface are removed in the preparation of laying the thick film.

Contaminants such as dust and other particulate fragments are also eliminated.

To lay the thick film, the ceramic substrate is patterned with the conductive path design using a screen printing methodology.

This way, the thick film will adhere to the ceramic substrate without the need for an adhesive.

The substrate is then dried while sintered at low temperature.

How is the Quality of the Thick Film Ceramic PCB Ascertained?

Quality is vital for the general determination of a thick film ceramic PCB’s reliability.

A quality board will carry functions expected of it effectively and efficiently without performance difficulties.

In examining the board for quality, checks have to be made along the thick film ceramic PCB’s fabrication process.

In this manner, areas of deficiency on the board are caught early on and remedied.

Consequently, a final inspection will involve oversight of the final board process.

The quality of the thick film ceramic board is identified by inspection and comparison to expected standards.

Board inspection can be carried out via visual examination which can be physically or automatically done via cameras and/or x-rays.

Additionally, an inspection can be electrically conducted by employing test probes.

An electrical assessment is useful in highlighting inherent board defects such as circuit deficiencies otherwise not visible.

You find a visual board review cannot highlight such failings.

Is Immersion Gold used as a Surface Treatment for Thick Copper PCB?

Yes, it is.

The surface treatment is applied to the unpopulated board surface of the thick film ceramic PCB for two essential functions.

You find the protection of the thick film conductive track from oxidation during the soldering process as the foremost reason.

The other reason is to provide a decent surface that guarantees good solderability.

Immersion gold as a surface finish involves using chemical means to attach gold particles on the thick film conductive track.

You find the solderability property of immersion gold is remarkable.

Additionally, the use of immersion gold ensures the thick film’s signal transfer capability is not affected.

Not to forget, this surface finish is highly resistant to oxide formation.

At Venture Electronics, we strive to give you high quality and reliable thick film ceramic PCBs.

For any questions or inquiries, contact Venture Electronics now.

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