What is the different between an Isola IS410 PCB and Rogers PCB?
Firstly they both offer unmatchable dimensional stability. What sets them apart is Isola IS410 pcb is more reliable as they are capable of offering better thermal performance because of their flam-retardant feature.
However Rogers PCB, it lacks the flame resistance feature as most of them are non-brominated.
Hence, Isola IS410 is better than Rogers PCB
The advantages when manufacturing with Isola IS410 material.
With a glass transition temperature (Tg) of 180°C, Isola’s IS410 is specially formulated for superior performance through multiple thermal excursions, passing the 6X solder test at 288°C.
IS410 is optimized for enhanced drilling performance, allowing high aspect ratio holes ≤10 mils. Its unique resin chemistry provides CAF resistance and long-term reliability benefits, allowing boards to be built with small feature designs.
Venture Isola IS410 offers high thermal performance. It also offers Tg: 180°C (DSC) and Td: 350°C (TGA @ 5% wt loss).
Our Isola IS410 can also provide excellent performance by various thermal excursions. It can pass 6x @ 288°C. Our Isola IS410 comes with prepreg standard availability. It comes with a panel or roller form and tooling of prepreg panels. Venture PCB by Isola IS410 can meet your standards and PCB requirements!
Your Leading Isola IS410 Supplier in China
Venture Isola IS410 is a lead-free epoxy prepreg and laminates. It is a high-performance FR-4 prepreg and laminate that is specifically designed to support any PCB industry requirements. It is suitable for any higher levels of reliability and lead-free solder.
Our Isola IS410 possesses a glass temperature transition up to 180°C. It is specially designed to provide superior performance in multiple thermal excursions that pass 6X solder tests at 288°C.
Our Isola IS410 comes with prepreg standard availability. It comes with a panel or roller form and tooling of prepreg panels.
We manufacture Isola IS410 is highly optimized for an improved drilling performance. By this, our Isola IS410 enables a high aspect ratio holes of ≤10 mils.
Venture Isola IS410 is equipped with unique resin chemistry. This design allows our Isola IS410 to provide reliable CAF resistance. It also offers long-term reliability for any boards that are built with any small feature designs.
Whether you are an integrator, electrical engineer, or distributor looking for a reliable quality Isola IS410 laminates, Venture is your best manufacturer!
As a professional manufacturer, Venture can offer you more valuable services. For more than 10 years, we are persistent in providing high-quality Isola IS410 at a reasonable cost. We also offer flexible payment terms for your Isola IS410 orders to support you!
Do you have a large-scale or small quantity of Isola IS410 orders? You don’t have to worry because Venture offers Isola IS410 without minimum order required!
We also took advantage of high-technology and advanced equipment. We are also equipped with advanced production facilities. Plus, Venture employed well-experienced and knowledgeable engineers. Therefore, you can assure that Isola IS410 manufactured by Venture are all high-quality!
For more information about our Isola IS410, don’t hesitate to contact us!
Isola IS410: The Ultimate FAQs Guide
This guide has all information you’re looking for about the Isola IS410 PCB material.
So, before you import or fabricate your next Isola PCB, read this guide.
- What is Isola IS410?
- What are the Features of Isola IS410?
- What are the Applications of Isola IS410 Laminate?
- Which are the Types of Copper Foil used in Isola IS410?
- Is Isola IS410 Compatible with Lead-Free Assembly?
- How Does the Glass Transition Temperature (Tg) and Decomposition Temperature (Td) of Isola IS410 Compare?
- Why is Thermal Conductivity (k) of Isola IS410 Important?
- Which are the Key Electrical Properties of IS410 Laminate to Consider?
- How do you ensure Effective Resin Debris Removal During Drilling of Isola IS410 laminate?
- What are the Advantages of High Glass Transition Temperature of Isola IS410?
- How Do you Measure Flexural Strength of Isola IS410 Laminate?
- What are some of the Best Practices During Storage and Packaging of Isola IS410?
- How do you Perform 3-Point Etch back of Isola IS410?
- What Determines the Cure Time During Lamination of Isola IS410?
- Which are the Different Types of treatments for Isola IS410?
- What are the Available Techniques of Desmearing Isola IS410 Laminate?
- How do you Ensure Dimensional Stability During Processing of Isola IS410?
- What is the Coefficient of Thermal Expansion of Ordinary IS410 Multilayer Board?
- Why is the CTE always Greater in the Z-Axis than X and Y Axes of Isola IS410 Laminate?
- Which some of the Industrial Approvals for Isola IS410?
What is Isola IS410?
IS410 refers to a high-performance FR-4 epoxy prepreg and laminate system.
The Isola material supports the requirements of PCB industry for higher reliability levels and trend to utilize lead-free solder.
The design of the Isola laminate facilitates superior performance by multiple thermal excursions.
Optimization of Isola IS410 ensures improved drilling performance enabling high aspect ratio through holes of ≤10 mils.
Featuring unique resin system, it offers CAF resistance with the advantage of long-term reliability of PCB fabricated with compact feature designs.
Isola PCB Material
What are the Features of Isola IS410?
Some of the main features include:
- Uses square weave E-glass
- Laminate come as full size panel or sheet with thickness ranging from 0.05 to 3.2 mm
- Prepreg comes in panel or roll form
- Has Glass Transition Temperature (Tg) of 180 degrees Celsius
- Copper weight range from ½ to 2 oz.
- RoHS Compliant
- Has Dielectric Constant of 3.97 and Dissipation Factor of 0.02
What are the Applications of Isola IS410 Laminate?
Typically, IS410 find use in the following areas:
- Aerospace and Defense
- Automotive and Transportation
- Consumer Electronics
- Industrial and Instrumentation
- Networking and Communication Systems
Which are the Types of Copper Foil used in Isola IS410?
The common copper foil types employed in IS410 are:
- Reverse Treat Foil (RTF)
- HTE Grade 3
Is Isola IS410 Compatible with Lead-Free Assembly?
Yes, IS410 can withstand the elevated temperatures of soldering and reflow in lead-free solder systems.
The temperatures might be between 30 to 50 degrees Celsius greater than standard lead-tin systems.
It meets the characterization specifications for lead-free systems.
It ensures high thermal resistance (T288 and T300), Tg>155 degrees Celsius, Td >330 degrees Celsius and overall CTE <3.5%.
Moreover, Isola IS410 meets the newer requirements of lead-free assembly.
Therefore, it will guarantees a “margin of safety” throughout the range of higher temperatures of lead-free solder.
How Does the Glass Transition Temperature (Tg) and Decomposition Temperature (Td) of Isola IS410 Compare?
Decomposition temperature refers to the temperature at which IS410 chemically degrades.
The point when the laminate loses a minimum of 5 percent of mass, and is denoted in degrees Celsius.
It is an important parameter during Isola PCB assembling.
This because changes to properties of a material when it reaches or exceeds its Td are not reversible.
Conversely, Tg refers to temperature range through which the materials transforms from a glassy, inelastic state to a soft, flexible state.
Different from Td, when the laminate cools down, its features revert to their initial state.
However, similar to decomposition temperature, you also express glass transition temperature in degrees Celsius.
Therefore, select a PCB material where it is possible to operate in a temperature range greater than Tg but below Td.
In most cases during PCB assembly, solder temperatures range from 200 to 250 degrees Celsius.
For that matter, make sure the decomposition temperature exceeds this range.
Luckily, Isola IS410 has a Td of 350 degrees Celsius.
Why is Thermal Conductivity (k) of Isola IS410 Important?
Isola PCB Material
Thermal conductivity describes the ability of the IS410 to conduct heat.
Low values of thermal conductivity implies low heat transfer whilst high conductivity signifies high heat transfer.
The thermal conductivity of Isola IS410 is 0.5 W/mK, which is relatively lower in comparison to copper.
Thermal conductivity of copper is of 386 W/mk.
For this reason, the copper plane layers will carry away more heat in a PCB compared to the IS410 material.
Which are the Key Electrical Properties of IS410 Laminate to Consider?
Here are the main electrical properties that you must consider when selecting Isola IS410:
· Dielectric Constant (Dk)
Also known as relative permittivity (Er), dielectric constant of PCB laminate is essential for impedance and signal integrity considerations.
These are crucial parameters for electrical performance in high-frequency applications.
The dielectric constant of IS410 is 3.97, which differs with frequency and often decrease with increasing frequency.
However, Isola Is410 laminate experiences less change in Dk compared to others.
· Dissipation Factor (Df)
Also referred to as Dielectric Loss Tangent (Tan δ), Df measures the power lost because of the Isola material.
A lower Df signifies less power loss.
The dissipation factor of Isola IS410 is 0.02, and it as well varies with frequency.
Loss tangent of the PCB material increases with increasing frequency.
Df is not often a vital factor for digital circuits, with the exception of very high frequencies beyond 1 GHz.
Nevertheless, it is a very essential consideration for analog signals, since it dictates the extent of signal attenuation.
Therefore, it impacts on signal to noise ratio at different points across signal traces.
· Volume Resistivity (ρ)
Also known as electrical resistivity, volume resistivity determines the insulation or electrical resistance of an Isola IS410 laminate.
The higher the resistivity, the least readily the material permits electrical charge movement, and vice versa.
The volume resistivity of IS410 is 8.0 x 108 MΩ-cm after moisture resistance and 3.6 x 108 MΩ-cm at elevated temperature.
Being a dielectric insulator, the Isola laminate should feature very high resistivity values.
As you realize temperature and moisture affect volumetric resistivity to some degree.
· Surface Resistivity (ρS)
Surface resistivity (ρS) establishes the insulation or electrical resistance of the Isola IS410 laminate surface.
Similar to volume resistivity, the Isola laminate should also possess very high surface resistivity values.
The surface resistivity of IS410 is8.0 x 106 MΩ after moisture resistance and4.5 x 108 MΩ at elevated temperature.
You realize that temperature and moisture affects it.
· Electrical Strength
Electrical strength determines the capability to resist electrical breakdown within the Z-direction of the Isola laminate.
The electrical strength of Isola IS410 laminate and prepreg is 1100 Volts/mil.
You determine the electrical strength by exposing the laminate to short pulses of high voltage at regular AC power frequencies.
How do you ensure Effective Resin Debris Removal During Drilling of Isola IS410 laminate?
The IS410 PCB materials display greater modulus features due to the resin system’s increased thermal stability.
Formation of debris is different during drilling of Isola IS410 laminate compared to standard FR-4 materials.
Drill debris of the IS410 stays as free particles and won’t affect the relief volumes of drill flute.
This is because of the elevated thermal decomposition characteristics of the resin system.
To make sure there is effective resin debris removal, it is advisable to employ high helix tools and undercut drill geometries.
Furthermore, in thicker and high layer count circuit boards, it may be necessary to apply peck drilling parameters.
Isola PCB material
What are the Advantages of High Glass Transition Temperature of Isola IS410?
Glass transition temperature determines the stability of IS410 when heated.
However, it is not an assurance of better performance beyond Tg.
Theoretically, a high Tg resin properties might adjust more swiftly beyond Tg in comparison to one having a low Tg.
Additionally, the lower Tg Isola material might as well display better properties at elevated temperature.
Nonetheless, in practice, manufacturers favor materials having higher Tg for Isola IS410 laminates.
This is due to the fact that they retain their dimensional stability through a wider range of temperature.
Additionally, in a high Tg laminate, there is lower overall expansion because of temperature to solder reflow temperature.
The reduced overall expansion serves a vital role in decreasing the stress related with copper barrel of a via or thru-hole.
Minimized stress leads to decreased pad lifting, decreasing cracking of copper barrel and inner layer foil.
Moreover, high Tg ensures there is reduced epoxy smear during the process of drilling IS410.
This provides a more reliable outcome requiring less desmearing.
Also during soldering, the laminate will have enhanced resistance to measling destruction because of solder shock.
How Do you Measure Flexural Strength of Isola IS410 Laminate?
Flexural strength refers to the capability of the Isola laminate to resist breakage or deformation when subjected to bending stress.
During flexural bending test, you must comply with IPC-6013C standards for rigid-flex, flex and rigid PCB laminates.
Flexural strength of Isola IS410 solely relies on its maximum strain and stress.
There are two types of flexural bending tests; 3-Point Bending Test and 4-Point Bending Test.
Both tests employ their specific set of standards specified by ASTM.
You perform flexural bending tests until failure of the Isola laminate to evaluate its failure modes.
· 3-Point Bending Test
In three point flexural bending test, the experiment setup is extremely crucial to attain accurate results.
Put a line load right the laminate center while positioning its supports at the ends at equivalent length from center.
There are set of ASTM standards for 3 point bending tests regarding components having different dimensions and materials.
Span to depth ratio is the most essential factor when setting up this flexural strength test.
· 4-point Bending Tests
You can conduct four point bending test through two different methods.
One is for small deflections while the other is for large deflections.
Large deflections technique is mainly instrumental in beams testing at considerably large scale compared to an Isola IS410 laminate.
Therefore, let’s look at technique for small deflections.
Small deflections method entails two different loads.
For that matter, there are as well two different techniques of applying load across laminate length.
The importance of 4-point bending test is to develop lifelike loads to test reliability of the IS410 laminate.
This is due to the fact that there are several possibilities of loading in actual life.
What are some of the Best Practices During Storage and Packaging of Isola IS410?
It is advisable you apply best practices during storage and packaging, as highlighted below, to minimize hazard during lead-free assembly.
To have the most reliable lead-free performance, make sure the Isola IS410 laminate is dry before packaging.
For some sophisticated, high reliability designs, you can perform baking before applying solder mask.
This helps in ensuring maximal floor life during assembly processing.
There is need to protect boards fabricated for high temperature PCB assembly from Isola IS410 that need extended shelf life.
Use a Moisture Barrier Bag (MBB) having a Humidity Indicator Card to protect boards.
Moreover, ensure that there is sufficient drying desiccant in the MBB to hinder moisture absorption during long-term storage and shipment.
On opening the MBB, you should process the boards within 168 hours
Upon opening the MBB, you must process the boards within 168 hours.
Make sure to perform the processing when maximal conditions are at less than 30 degrees Celsius/60 percent RH.
In addition, you need to reseal MBB bags opened for inspection immediately to prevent absorption of moisture by the boards.
How do you Perform 3-Point Etch back of Isola IS410?
True 3-point “etch back” makes bare the interior layer “post” found on all 3 sides for succeeding plating procedures.
This will need a more vigorous approach in comparison to simple desmear.
Simple desmear is only useful in removing resin smear out of the upright surface of the “posts” of inner layer interconnect.
You should not use permanganate chemistry only to achieve a total 3-point etch back of Isola IS410.
You can readily etch back the resin of IS410 using plasma.
Standard plasma gas combinations and procedure cycles designed for traditional FR-4 epoxy resin are sufficient.
Use it as starting step for etch back process.
However, it is advisable to follow the plasma procedure with a chemical procedure instead of plasma alone.
This helps in removing plasma ash residues and increasing hole wall texture.
If plasma is lacking, you must perform chemical etch back for 3-point interconnections on IS410 with utmost care to reduce copper wicking.
But remember to consult your chemical supplier for suitable conditions.
What Determines the Cure Time During Lamination of Isola IS410?
The multilayer package you are producing will determine the time duration at cure temperature.
It also, to some degree, determine the actual cure temperature of Isola IS410.
Boards of greater thickness will need a prolonged cure time to guarantee optimum material performance.
Which are the Different Types of treatments for Isola IS410?
It is possible to use both oxide alternatives and reduced oxides successfully manufacturing IS410 multilayer PCB.
You need to ensure that the oxide or oxide alternative displays a consistent and even dark color.
In case you employ reduced oxides, consult your chemical supplier on post oxide baking parameters.
This is because excessive baking might result in reduced pink ring resistance.
Perform post-oxide baking in racks with the Isola IS410 laminates positioned vertically.
It is advisable to do mild bake of oxided inner layers for 15-30 minutes at 80-100 degrees Celsius.
In conveyorized oxide alternatives, an effective dryer at the conveyor line end should eliminate all moisture out of inner layer surface.
Nevertheless, the best practice is drying the layers for at
least 30 minutes at 100 degrees Celsius or higher.
This is particularly appropriate for IS410 boards undergoing lead-free processes.
Moreover, it is preferable to carry out the drying in racks.
However, peel strengths of IS410 might be modestly lower in comparison to FR-4 laminates.
This is because of the higher modulus features of the epoxy resin system.
For that matter, you can utilize DSTFoil to boost the bond strength.
It increases the bond strength by about 1 to 1.5 lbs in comparison to non-DSTFoil copper foil.
When you use immersion tin adhesion treatments, test the coating to ensure there is sufficient bond strength with Isola IS410 prepreg.
What are the Available Techniques of Desmearing Isola IS410 Laminate?
Here are the two main desmearing methods for IS410:
· Chemical Desmear
To ensure vigorous hole cleaning, employ permanganate desmear processes using cyclic amine (NMP) conditioners instead of glycol ether-based conditioners.
It will also ensure surface topography performance on Isola IS410.
Also, the temperatures and dwell times applied for most types of high Tg, high performance epoxy resin systems are sufficient.
But, you should inquire from your chemical supplier about recommended conditions.
· Plasma Desmear
If available, you can as well use plasma with or minus a sole permanganate pass.
Plasma desmearing tend to enhance general quality of hole, specifically in boards having high aspect ratio or greater thickness.
Utilizing standard plasma gas blend and cycles are adequate to achieve satisfactory result.
How do you Ensure Dimensional Stability During Processing of Isola IS410?
The net IS410 laminate dimensional movement after the etching, oxiding and lamination processes is often shrinkage.
This shrinkage is because of stresses relaxation induced during pressing of laminate coupled with shrinkage due to resin system.
You will realize majority of the movement in the laminate’s grain direction.
There are mechanisms that have been instrumental in minimizing the shrinkage extent in grain against fill direction.
These comprise of cross-plying the grain direction of the laminate to that of IS410 prepreg and autoclave pressing.
Although both of these techniques have their benefits, you must distinctly characterize material movement.
What is the Coefficient of Thermal Expansion of Ordinary IS410 Multilayer Board?
The final CTE of the Isola multilayer PCB constructed using IS410 material will depend on:
- Modulus of every composite structure components
- Effectiveness of the components physical and chemical bond to each other
- Degree of transfer of stiffer materials modulus into the resin system
- Volume ratio of every material within the composite.
Typically, an Isola IS410 multilayer PCB has a Coefficient of Thermal Expansion of 16 to 18 ppm per degrees Celsius.
Moreover, a rigid double-sided board might feature a lower CTE from 12 to 14 ppm per degrees Celsius.
The least CTE for any type of resin/fiber system will nearly usually be that having the least resin content.
This makes it practical to fabricate Isola laminates having very low CTE, however, it will not produce an acceptable PCB.
Laminates having very low CTE are not favorable because of resin starvation, causing inadequate resin flow to fill internal layer copper patterns.
Therefore, you must use the least acceptable resin content that varies for different reinforcement materials.
Why is the CTE always Greater in the Z-Axis than X and Y Axes of Isola IS410 Laminate?
Also referred to as Thermal Coefficient of Expansion (TCE), CTE describes a characteristic thermo-mechanical attribute of IS410 laminate.
It refers to the tendency of the Isola PCB material to expand as you heat it.
The materials expansion is volumetric in essence.
However, based on laminate construction, you need to independently look at X- and Y-direction expansion (in-plane) and Z-direction expansion (out-of-plane).
Neat epoxy resin system would expand isotropically (equal in all directions) if the Isola laminate had no restraining fabric.
The reinforcing fabrics have high modulus values and lower CTE compared to resin, which limit in-plane expansion of the IS410.
Nonetheless, the volumetric expansion of resin system is basically incompressible.
This implies that the resin expansion will be in the comparatively unconstrained Z-direction.
It does so since the high strength fiberglass reinforcement constrains resin movement in the X- and Y-direction of the laminate.
The Z-direction CTE increases by up to fourfold above the Tg of the resin system of the Isola laminate.
In standard systems, this implies rising from 50 to 200 ppm per degrees Celsius above the Tg.
Coefficient of Thermal Expansion in the X- and Y-directions normally decreases modestly above the Tg.
This is due to the fact that the modulus falls and the constraining capability of the reinforcement gets stronger.
Temperature changes negligible affect the modulus.
Which some of the Industrial Approvals for Isola IS410?
You should make sure that your Isola IS410 Laminate and Prepreg system comply with the following quality standards:
- ASTM Standards
- RoHS Standards
- IPC Standards
- UL Standards
- BSI Standards
- CE Standards
- FCC Standards
With the information in this guide, you can definitely choose a perfect Isola IS410 PCB material.
However, if you have any question, feel free to contact Venture Electronics team.