Ventec laminates Expert

I know you’re looking for high-performance Ventec laminates.

Or, you would like to learn more about Ventec PCB material.

That’s why this guide will answer all questions you have been asking about Ventec Laminates.

Keep reading to learn more.

What are Ventec Laminates?

Ventec PCB

Ventec laminates are those fabricated by the Ventec Group for diverse use in printed circuit boards.

The Ventec Group is usually involved in the conceptualization and development of these laminates.

You will see many Ventec laminates with copper cladding.

They use of prepreg material for bonding.

Additionally, you find Ventec laminates to possess impressive quality with enhanced performance capabilities.

What are Some of the Ventec Laminate Types?

There are many types of Ventec laminates that you will find available in the market.

Ventec laminates are divided into subgroups.

They feature common characteristics such as the material used and performance capability.

Common classification of Ventec laminates includes:

• Those made from Standard FR 4 material such as VT-42 and VT-42S.
• Those derived from polyimides such as VT-901, VT-90H, VT-901N, and VT-901HW.
• Ventec laminates with Insulated Metal Substrate (IMS) including VT-4B1 and VT-4B5SP.

What are Some of the Characteristics of Ventec Laminates made from Standard FR-4?

You find that FR-4 material is developed from fiberglass material and furnished with flame-resistant qualities.

Standard FR-4 is typically employed with prepreg for bonding for furnishing laminates with different thicknesses.

You can also employ standard FR-4 with different copper weights allowing usage in applications with both high and low power demands.

Common characteristics of Ventec laminates fabricated with Standard FR-4 are:

• High peel strength and great flexural strength.
• A high temperature of glass transition and decomposition temperature.
• Convenient dielectric constant with an impressive dissipation factor.
• Low coefficient of thermal expansion in the x, y, and z axes provides structural stability to the laminate.

You also find this to greatly enhance the bond formed through soldering even when exposed to high temperatures.

What Materials are used in Ventec Laminates?

You will find Ventec laminates with different material composition for use in many application areas.

The common materials you will find employed for Ventec laminates include Standard FR-4 and Polyimide.

Ventec laminates made from standard FR-4 can be furnished with different temperatures of the glass transition.

You can fabricate Ventec laminates from polyimide materials with different prepreg properties.

Can Ventec Laminates be made with Specific Thermal Requirements?

Yes, they can.

You can fabricate Ventec laminates with different thermal capabilities.

Besides, you can manage this by the material composition you use for your laminates.

Also, you can use non-glass materials and a metal base to alter the thermal performance of your Ventec laminates.

Additionally, using reinforced glass can considerably exhibit changed temperature-related performance.

Ventec PCB Material

Is Signal Integrity an Aspect in Ventec Laminates?

When you talk about signal integrity, you refer to the performance of Ventec laminates regarding signal transmission.

You find this property to be especially in applications requiring a minimal loss of signals.

Besides, you will find Ventec laminates with different aspects of signal integrity depending on the application.

Some Ventec laminates you will find useful in areas where thermal reliability is highly regarded and others halogen-free.

What Copper Weights can be used for Ventec Laminates?

Ventec laminates are fabricated from conductive and non-conductive layer configurations.

Their design achieves a certain overall thickness.

The thickness of copper in circuit board construction is expressed as a weight measure in ounces (oz).

Consequently, you find a single oz of copper is used to express a thickness of 1.4 mils (a thousandth of an inch).

However, you will find different copper weights used for Ventec laminates to achieve the desired total board copper weight.

You can use copper films with weights from as little as a third an oz to as much as six oz.

Moreover, you employ such weights in Ventec laminates used for low power applications with a low overall copper weight need.

Why are Halogen-free Ventec Laminates important?

Halogen-free Ventec laminates are those you find free of halogen traces. The use of halogen in materials used for electrical products is discouraged by the RoHS directive.

The RoHS directive refers to the Restriction of Hazardous Substances in electrical and electronic products of which you find halogen.

Consequently, you find Ventec laminates that are halogen-free present little threat to the environment and health as well.

Are Ventec Laminates suitable for High-Frequency Applications?

High-frequency applications mainly use high-frequency signals ranging into gigahertz.

You can find Ventec laminates fabricated to provide adequate performance at such high frequencies.

There are several procedures you can undertake to modify Ventec laminates such that they support high-frequency use.

A common approach you can use is employing ceramic materials for your laminates.

Furthermore, you will find the use of ceramic materials used alongside other materials to modify the overall properties.

Some materials you can use with ceramic materials include polytetrafluoroethylene and hydrocarbon thermoset materials.

Is Lead-free Assembly Possible with Ventec Laminates?

Lead-free assembly refers to a process of eliminating lead from materials used in the PCB fabrication process.

Consequently, you require other processes or materials to compensate for the missing lead element.

Lead-free assembly is motivated by the desire to eliminate the use of harmful substances in the manufacture of electrical equipment.

Lead has been found to have adverse health effects on humans over time while being toxic to the environment.

You can fabricate Ventec laminates lead-free to manufacture laminates with a lower temperature of glass transition.

Furthermore, you note that lead-free assembly can result in laminates with a low thermal expansion coefficient.

Can Ventec Laminates be made Flexible?

Flexible laminates are those you can bend without breaking.

These laminates are the direct opposite of rigid laminates which get damaged by breaking apart when bent.

Ventec laminates can be made flexible by the modified use of prepreg material.

You find both no flow and low flow prepreg material can be employed in the manufacture of flexible Ventec laminates.

Moreover, you will also find Ventec laminates with mixed properties of flexibility and rigidity.

Also, you find such laminates described as flex-rigid attributed to their dual structural ability.

Which Applications use Ventec Laminates?

You will find Ventec laminates applied across different industries in the electrical and electronics universe.

You find this is possible due to the different fabrication of Ventec laminates allowing them varying properties.

Common areas in which you will find the use of Ventec laminates include:

• In computers and related devices.
• You can find Ventec laminates in communication equipment.
• Home entertainment devices such as televisions and VCRs contain Ventec laminates.
• Electrical equipment in the automotive industry is fabricated using Ventec laminates.
• Ventec laminates are also present in electronic gaming machines and liquid crystal displays.

What are the Thermal Properties of Ventec Laminates?

Thermal properties of Ventec laminates are those you find related to temperature.

Thermal properties are useful in helping you determine the reliability of a particular Ventec laminate to your application.

Some of the common thermal properties you can use to evaluate your Ventec laminates’ usefulness in an application include:

• Operating temperature.
• The temperature of glass transition.
• Decomposition temperature.
• Thermal stress.
• Coefficient of thermal expansion.

What is the Difference Between the Temperature of Glass Transition and the Temperature of Decomposition in Ventec Laminates?

The glass transition temperature (T_g) and the decomposition temperature (T_d) are thermal properties of a material taken at a point.

They differ from the operating temperature which provides a range within which a material’s integrity can be maintained.

The temperature of glass transition (T_g) is a point where Ventec laminate will begin to exhibit glass properties.

You find that upon reaching this state, the Ventec laminates become soft as their molecular forces get broken down.

Alternatively, the decomposition temperature is a point where a Ventec laminate material changes its physical state.

This is usually when the Ventec material is subjected to increasing temperature values.

Usually, you find the temperature of decomposition to be higher than that of glass transition for many Ventec laminates.

What are the Common Electrical Properties for Ventec Laminates?

 Ventec VT 901

Electrical properties are those properties that affect signal transfer or charge flow in a Ventec laminate.

A laminate’s electrical properties will influence the overall reliability performance of an electronic device.

Electrical properties you consider for Ventec laminates include:

• Dielectric constant
• Electrical strength
• Volume and surface resistivity
• Arc resistance
• Dielectric breakdown
• Comparative tracking index

How do you Measure the Thickness of Ventec Laminate?

Knowledge of the thickness of a Ventec laminate is necessary to meet the space requirements provided in the area of application.

You find that fabricating a Ventec laminate without considering its final thickness can result in fitting issues.

You establish the thickness of a Ventec laminate after carrying out the lamination procedure.

A common approach is to use a micrometer to determine the laminate’s thickness.

Why is the Z-axis CTE important for Ventec Laminates?

The coefficient of thermal expansion is a parameter that describes the physical change of a material when subjected to temperature changes.

You note that materials expand upon exposure to temperature increase leading to a considerable change in size.

The coefficient of thermal expansion allows you to determine to what extent a change in physical size will occur.

Expansion typically occurs in all three axes along the x, y, and z planes.

Expansion in the z-axis is useful in helping you to ascertain what clearances and allowances to use for your application.

When fabricating Ventec laminates, the space requirements in the application area is a critical issue that needs consideration

You find establishing the z-axis CTE assists you to fabricate Ventec laminates with the right fit in their application area.

What Factors should you Consider when Pressing Ventec Laminates?

Ventec laminates are made through a lamination process which usually involves a pressing procedure.

The required layers for a Ventec laminate are arranged like a sandwich before being subjected to pressing under certain conditions.

Common pressing conditions for Ventec laminates include:

• The material’s heat rise.
• The temperature of curing.
• Time for the curing process.
• Vacuuming condition.
• Pressure condition.
• Cold pressing.

How many Layers should Ventec Laminates have?

You will find Ventec laminates with different layer counts that will be dependent on the overall board specifications.

Furthermore, you will also find the layer count in Ventec laminates to be influenced by the copper thickness.

For instance, an overall board thickness of four oz will require at least four layers of one oz copper films.

Ventec PCB Material

What is the use of Aluminium Plates in some Ventec Laminates?

You will find some Ventec laminates fitted with aluminum base plates below the dielectric layer.

From such a configuration, you obtain an improved thermal performance from your circuit board.

With an aluminum plate, such a Ventec PCB material improves the cooling of heat-generating components.

Additionally, you find this design offers physical support to delicate dielectric layers such as ceramics.

Another important aspect you note with a Ventec laminate fitted with an aluminum plate is the improved durability and reliability.

You can credit this feature to the improved thermal performance which hinders laminate failure as a result of thermal strain.

Also important to note is the great physical and structural support that an aluminum backing offers to a Ventec laminate.

Furthermore, aluminum has a low coefficient of thermal expansion resulting in an inconsiderable physical change in high-temperature applications.

Can you use Surface finishes on Aluminium Plates used in Ventec Laminates?

Surface finishing in circuit board construction is usually done for protective purposes and sometimes aesthetics.

You can employ a surface finish on the aluminum backing of a Ventec laminate to prevent surface deterioration.

Furthermore, you can also employ no finish and simply brush the surface using an abrasive to achieve a smooth finish.

However, you can apply a surface finish of your choice on the aluminum backing through anodizing.

You can also apply a finish to improve your aluminum plate’s ability to radiate excess thermal energy.

Also, you find this finish is enabled through a procedure perpetuating high emissivity in the aluminum plate.

How can you conduct Anodizing of Aluminum Plate in Ventec Laminates?

Anodizing is a surface finishing procedure carried out on a Ventec laminate’s aluminum surface for protective purposes.

You realize anodizing provides your surface durability by making it resistant to corrosion through the formation of an anodic oxide.

In Ventec laminates with aluminum backing, the anodizing process results in the formation of an aluminum oxide layer.

You find this layer integrates itself to the aluminum surface below rather than forming an entirely different layer.

You find this structural formation prevents the oxide layer from peeling off while also accommodating ancillary procedures such as painting.

When carrying out an anodizing process, you immerse the aluminum surface into an electrified bath of acid electrolytes.

The metal plate acts as an anode while you insert a cathode terminal in the basin.

You observe oxygens atoms discharged from the solution combining with the aluminum ions on the laminate plate surface.

Consequently, an aluminum oxide layer is integrated into the aluminum plate backing for the Ventec laminate.

You note that the result is essentially an oxidation process that is closely monitored and controlled.

Can you use a Protective Film for your Metal Plate in Ventec Laminates?

You find metal plates such as aluminium employed with some Ventec laminates to improve the thermal performance of the laminate.

However, these metal plates are exposed requiring protection from external infractions such as corrosion.

You find different approaches to offering layer protection for your metal backing in Ventec laminates.

You can employ surface finishes by high emissive action or anodizing or simply employ the use of protective films.

As a result, you will find two common protective films used for the metal backing in Ventec laminates.

The use of a particular film is typically dependent on the working temperatures of the application area.

For Ventec laminates used in applications with standard temperature requirements not exceeding 170 ⁰C, you can consider PET material.

The plastic polymer PET is a contraction of polyethylene terephthalate.

However, you find some Ventec laminates are employed in areas with high-temperature conditions rising to almost 270 ⁰C.

Here, you find the best alternative for the protective film is polyimide which can tolerate high-temperature values.

Are Ventec Laminates used for IC packages?

An integrated circuit (IC) is an arrangement of miniaturized components furnished on a die with a functional singularity.

You find different integrated circuit chips employed in electronic products to serve purposes such as memory storage.

In fact, the architecture of an integrated circuit requires the electrical connection of different components.

Due to the small size of IC chips, using a printed circuit board allows for easy electrical connection.

Consequently, you find Ventec laminates useful in the fabrication of packages for integrated circuit chips.

Thin laminates are usually employed to reduce the size of the chips economizing onboard space.

Ventec PCB Laminate

Ventec laminates can be used for IC packages with ball grid arrays and dual in-line packages.

BGA packages connect to the board via their base whereas DIP packages have connecting pins along the long parallel edges.

What is the Shelf Life of Ventec Laminates?

Ventec laminates are separately manufactured before assembly to form a complete printed circuit board.

Consequently, for Ventec laminates, a shelf life within which the laminates should be used to prevent deterioration is set.

The conditions under which you store your Ventec laminates will determine their shelf life.

You identify temperature and relative humidity as the two important factors in determining the shelf life of a Ventec laminate.

Additionally, you find the construction of the Ventec laminate to also influence its shelf life.

Some Ventec laminates are made water-resistant with UV radiation blocking allowing them a longer shelf life than regular laminates.

Therefore, the shelf life of a Ventec laminate will differ from one construction to another.

Additionally, the conditions of temperature and relative humidity under which the Ventec laminates are stored will significantly influence shelf life.

Can you use a Heat Sink with Ventec Laminates?

A heat sink is a feature of thermal management that allows you to efficiently disseminate dissipated heat from your board.

In large power applications, you find heat sinks fixed to the exposed bottom surface of the board.

Heat sinks are an effective way of managing your board’s thermal conditions preventing build-up that could result in thermal strain.

Thermal strain can be catastrophic to your board causing failure by interrupting signal transfer and creating hotspots.

Heat sinks can be fitted on Ventec PCB laminates for use in PCB applications requiring highly efficient thermal management systems.

You find heat sinks useful in Ventec laminates used for high power applications such as satellite systems.

 Ventec VT-47

Is Panelization used for Ventec Laminates?

Fabrication of Ventec laminates can be done for large scale productions and even prototypes.

This allows for flexibility in the fabrication process.

Where large productions are needed, you find panelization commonly used to reduce individual board costs and hasten production.

Panelization is the fabrication of Ventec laminates as large pieces called panels.

This allows for multiple laminates on a single piece.

Later, you can separately cut out individual Ventec laminates from the panel obtaining the desired individual size.

You can cut the Ventec laminates from the panels by using groves apportioned along the borders or employing laser cutting.

Laser cutting involves the use of a machine with guided laser radiation that extracts a required laminate in the desired shape.

Are Surface Treatments use for Ventec Laminates?

Yes, they are.

You can apply surface finishes on the copper layer of Ventec laminates to offer surface protection from deterioration.

Ventec laminate surfaces can deteriorate through corrosion initiated by the oxidation process.

Additionally, applying surface finishes over the conductive layer of the Ventec laminate provides a good surface for solderability.

There are several finishes you can use on Ventec laminates including OSP, HASL, and ENIG.

Different types of surface finishes

· Organic Solderability Preservative (OSP)

Organic Solderability Preservative (OSP) is an environmentally friendly approach that employs water-based azole compounds which are organic.

You note these compounds adhere to the surface of the copper film-forming dipolar bonds creating a thick protective film.

· Hot Air Solder Levelling (HASL)

The Hot Air Solder Levelling (HASL) process involves the overlaying of the copper film with molten solder by bathing.

Thereafter, the board is transferred through knives of the hot air which level the surface and remove excess solder.

You note that to effectively carry out a HASL procedure, you need to bake the Ventec laminate beforehand.

· Electroless Nickel Immersion Gold (ENIG)

You can use Electroless Nickel Immersion Gold as a finish for your Ventec laminate albeit at a higher cost.

You find the ENIG process achieves a smooth finish with impressive solderability by applying a two-fold surface treatment procedure.

Nickel is electrolessly applied over the copper film before being immersed in a gold solution to apply a gold layer.

You find that while nickel forms a smooth surface over the copper film, it is easily oxidized.

The gold layer formed through an immersion process serves to protect the nickel surface from oxidation.

How is the Metallization Process carried out on Ventec Laminates?

The metallization process is useful in enabling the deposition of the copper film over the dielectric layer for your Ventec laminate.

You find metallization is the final layering procedure before undertaking the lamination process.

You can carry out the metallization process in two ways:

i. By Direct Deposition

Directly depositing copper over the dielectric layer in the fabrication of a Ventec laminate is an additive process.

In this case, you employ thermal energy in the deposition of melted copper metal to the dielectric layer.

ii. Using Electroless Copper Plating

In electroless copper plating, you use a reducing agent to initiate the process of copper deposition.

Here, you dip the required surface in a solution with copper ions and the reducing agent initiates an autocatalytic action.

You note that the electroless copper plating being a chemically guided process results in a smooth metal surface.

You realize this result is unlike direct deposition which can be encumbered with surface unevenness.

How is the Desmearing of Ventec Laminates Carried out?

Desmearing is an essential process in the fabrication of Ventec laminates that follows the drilling process.

Drilling of Ventec laminates allows for the fixation of board components and other parameters through the drilled holes.

The desmearing process is a cleaning procedure that seeks to remove the board residues from the walls of the drilled holes.

For Ventec laminates, you can use alkaline permanganate to clean the holes or via plasma treatment.

Why is Surface Cleaning required before Lamination when making Ventec Laminates?

When making Ventec laminates, you find that surface cleaning of the layers is carried out before the lamination process.

Surface cleaning ensures the surface is free of any matter like contaminants that can cause an uneven bond upon lamination.

You note that the lamination requires special conditions including high temperature and pressure to bond the individual layers together.

The presence of contaminants such as dust particles causes an uneven bond providing avenues for the development of thermal strain.

Thermal strain especially along bonded surfaces or joints can lead to catastrophic failure of the laminate and the PCB.

You can employ chemical solutions such as isopropyl alcohol to clean your layer surfaces before undertaking the lamination process.

How is the Flammability of Ventec Laminates Determined?

Flammability is the ability of a material to combust and sustain the state of combustion over a given period.

You find determining the flammability of Ventec laminates to be important due to their use in high-temperature applications.

When used in applications with large power demands, Ventec laminates can be ignited as a result of the large heat dissipations.

You use the UL 94 test to establish the flammability of Ventec laminates.

The UL 94 test was developed by the Underwriters Laboratory to be performed on plastic materials employed in electronic products.

You find this test seeks to establish the tendency of plastic materials to combust or extinguish when ignited.

The UL 94 test consists of three burning tests designated horizontal, vertical, and thin material vertical burning tests.

Thereafter, a six-tier classification system identifying the least to the most flame-retardant is used to label the material.

What are the Mechanical Properties of Ventec Laminates?

Mechanical properties of Ventec laminates demonstrate the response of the laminate when subjected to separating forces.

Ventec laminates are formed through a lamination process that bonds different layers under pressure and can be forcefully separated.

You find the peel strength and the flexural strength of Ventec laminates as common mechanical properties.

These mechanical properties allow you to determine the performance of your laminate when subjected to directional forces.

You describe peel strength as the force required to strip or separate individual layers from a laminate.

You can determine the peel strength of a Ventec laminate under normal conditions and also when subjected to thermal stress.

With flexural or bending strength, you determine a material’s ability to sustain bending forces.

Flexural strength will allow you to establish the maximum stress at which the Ventec laminate will tolerate before yielding.

You find flexural strength is useful in case of applications where warping can be experienced.

Additionally, the bending strength of a Ventec laminate will suggest to you the appropriate material for use in filling.

What are the Quality Standards of Ventec Laminates?

Standards are employed to guide the manufacture of products ensuring they are of decent quality to sustain their application.

Ventec laminates are subject to the following standards:

· IPC-TM-650

You find this standard describes a method of determining the peel strength of laminates with metal cladding at a raised temperature.

· BS-ISO-1172

You find specifications provided for laminates composed of plastics reinforced with fiberglass.

The specifications describe the prepreg and molding combinations of the laminates.

· IPC-4101D/41

In this standard, the specifications for the laminate materials including dielectric and prepreg are provided.

The specification applies for laminates to be employed in rigid circuit boards and those with multilayer configuration.

· JIS-C-6483

This standard describes guidelines for laminates with epoxy resin base and synthetic fiber used to make copper-clad laminates.

· IPC-TP-346

You use this standard for laminates based on FR-4 to determine their inability to tolerate thermal-induced shock.

· IPC-TR-483

Provision for the test procedures for determining the dimensional stability of thin laminates is narrated in this standard.

At Venture Electronics, we help you design and fabricate all your Ventec Laminates.

In case you have any questions or inquiries about Ventec Laminates, fee to contact the Venture Electronics team.