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RFlink PCB

  • High-quality RFlink PCB
  • Complete range of top quality RFlink PCB
  • Equipped with expert engineers
  • 24/7 tech support

What Are The RFlink PCB Components?

The most essential components of the Rfink PCB as belows:
●Arduino Mega
●PIN header male
PIN header female
●Print connector
●Dipole antenna
RFlink enclosure

RFlink PCB Components
Different Types Of RFlink PCB

What Are The Different Types Of RFlink PCB?

It provides a huge variation in terms of its use, features, etc. Its meaing types as belows:
●Electronic RFlink PCB
●Remote control PCB
●Quick turn FR4 PCB
●Transmitter PCB
●Multiprotocol PCB
●Multilayer PCB
●Transceiver RFlink PCB

What Are The Applications Of RFlink PCB?

RFIink PCB has took out a great change in the signal transmission system. Its top-notch performance makes it compatible with high frequency PCB applications as belows:

●Home automation&Motion detector&Doorbells
●Alarm&Power consumption system
●Heating system&Switch
●Fire detectors&Gas detectors
●Water thermometer&Moisture sensor&Relay&Weather sensors

Applications Of RFlink PCB

Venture is a professional manufacturer of Rflink PCB in China for more than 10 years. Through the years of providing excellent services and quality rflink PCB, we became the most trusted supplier in China.

All of our Venture rflink PCB is fabricated with quality and functionality. They are equipped with more advanced features that make perfect for your applications.

Your Leading RFlink PCB Supplier in China

If you are looking for numerous types of rflink PCB, then you’ve come to the right place.

Venture PCB manufacturer has a complete solution for your rflink PCB supplies needs. In China, we are one of the top manufacturers and suppliers of rflink PCB for more than 10 years.

As one of the best PCB manufacturers and suppliers, we will let you experience excellent quality rflink PCB and value-driven services.

Venture manufacturer has a wide selection of high-class rflink PCB products. We have a complete solution for your rflink PCB needs. Venture manufacturing company in China is fully dedicated when it comes to PCB manufacturing and focusing on overseas’ market.

Additionally, we can provide excellent services from rflink PCB designing and project plan to production, shipping, and installation.

Here at Venture, we are not only your rflink PCB supplier and manufacturer but also your best PCB business partner.

Venture definitely provides you with marketing and business solutions for rflink PCBs.

Along with our expert engineers, we will make sure that you have an advanced and high-quality artwork of the final PCB projects.

Through the years, Venture manufacturing company has sold a wide array of rflink PCB to most clients.

In fact, we are one of the best and most popular PCB suppliers and manufacturers around the world.

Whether you are a rflink PCB distributor, retailer, or custom factory, Venture Electronics is always the best place.

Aside from rflink PCB, Venture is also expert in manufacturing audio amplifier PCB, bendable PCB, Bluetooth transmitter PCB, Bluetooth module PCB, Bluetooth keyboard PCB, security PCB, and many more.

You can purchase our PCB products based on competitive rates.

Get an instant quote for your next rflink PCB orders now!

RF Link PCB: The Ultimate FAQ Guide


Today, I will help you choose high performance RF link PCB.

I will answer all questions you have been asking about RF link PCB.

So, if you want to learn more, read this guide.

What Is An RF Link PCB?

An RF Link PCB is a radio frequency circuit board that operates at high frequencies exceeding 100 MHz.

RF Link PCBs have circuitry that allows transmission and reception of radio signals such as in cellular phones and radar systems.


RF Link PCB Transmitter

What Are Some Of The Problems Associated With RF Link PCB Design?

You encounter the following problems when working with an RF Link PCB:

Interference Between Digital And Analog Circuit Modules

When an RF circuit of analog nature works separately from that of a digital circuit you observe an almost flawless operation.

However, combining these circuits on the same board with a shared power supply, creates instability.

You find the digital signals regularly swings in shirt intervals between the ground and positive power supply.

Electrical Noise Interference Of Power Supply

You find glitch voltage and high-frequency harmonic waves particularly vulnerable to noise in RF Link circuits.

Modern microcontrollers employ CMOS technology, therefore, you find the majority of current absorbed by the microcontroller inside each internal clock period.

Incorrect Ground Setting

If you configure incorrectly the GND for the RF Link circuit, you may incur odd outcomes.

You find that with RF Link PCBs, even a short ground line might serve in the same capacity as an inductor.

Consequently, if you exclude GND, you will have long ground wires such that the circuit won’t have the desired properties.

Radiated Interference Induced By The Antenna On Other Analog Circuits

You find any circuit line such as an antenna can transmit or receive RF signals. Therefore, the high-frequency signals transmitted by the RF Link transmitter may end up at the analog input terminal of the ADC.

If you improperly process the ADC’s input terminal, RF waves may become self-excited within the ESD diode of the ADC input. Ultimately, you find this causes ADC deviation.

Where Do You Employ RF Link PCBs?

You find the application of RF Link PCBs stretches across industries from wireless communications, robotics, and sensor and security systems.

Continued improvements in technology have seen the implementation and inclusion of RF Link PCBs in various functions.

Common applications of the RF Link PCB are:

RF Remote Control Car

RF Remote Control Car

Contactless Contact Card

Contactless Smart Card

What Are The Important Properties Of Materials You Use In RF Link PCB?

When selecting the materials for you RF Link PCB, you find the following properties essential:

Loss Tangent

Loss tangent is a difficult phenomenon to deal with that occurs as a result of the material’s molecular structure. You lose a signal as the frequency rises because it is burned up as heat resulting in amplitude loss in analog circuits.

Dielectric Constant

You measure a material’s capacity to hold electrical energy in the presence of an electric field by its dielectric constant. Because it is direction-dependent, the dielectric constant can vary depending on the material’s axis.


Spacing can result in negative RF Link board occurrences such as crosstalk and the “skin effect”.

When the board self-interacts causing signals to flow into surrounding components and unwanted coupling, this is known as crosstalk.

The skin effect occurs when a trace’s resistance rises, resulting in resistive losses and heat generation in the circuit.

Several parameters influence skin effect such as trace width and length, and can become extremely problematic with a frequency rise.

Coefficient Of Thermal Expansion

The coefficient of thermal expansion (CTE) describes how the size of an object changes as the temperature changes.

You can assess a material’s thermal robustness using CTE with it influencing the drill and assembly stages of PCB production.

When you employ materials with different CTEs in a multilayer board, they can respond to temperature changes at different rates.

This causes a problem with alignment when drilling and can ultimately cause a board to break.

Moisture Absorption

The environment in which you employ your gadget is important in determining the material for your RF Link PCB.

Where you employ the board in a controlled atmosphere, the ability of the material to absorb moisture is a non-issue.

However, you consider with high priority where you have the board exposed to the elements that can result in moisture intrusion.

Cost Vs. Performance

Some materials have exceptional characteristics such as impressive dielectric constants and CTEs but come at very high costs.

You need to strike a good balance between cost, thermal durability and more importantly electrical performance.

What Materials Do You Use In An RF Link PCB?

Material you employ in RF Link PCB construction should tolerate operation at high frequency. You can employ the following materials on an RF Link PCB:


Polytetrafluoroethylene (PTFE) is a synthetic derivative of fluoropolymer with implausible versatility.

You find PTFE has great resistant to water and high temperatures with a high density allowing use in various applications.

You can employ PTFE in your RF Link PCB with glass fiber or combining with ceramic material for increased manufacturability.

You can also use PTFE with ceramic and hydrocarbon to further lower your costs.

RF Link PCB Made From PTFE

RF Link PCB Made From PTFE


FR-4 material is relatively cheap when you compare with the PTFE but with lower qualities. Consequently, you only find FR-4 applicable in RF Link PCBs employing low frequency values.


You employ Fluorinated Ethylene Propylene (FEP) and Liquid Crystal Polymers (LCP) as bonding materials for your RF Link PCB.

These materials offer you low temperatures of lamination and re-melt.

Rogers Material

Rogers material are a product of the Rogers Corporation which makes high-performance PCB materials.

For the RF Link PCB, you can employ RO3000 and RO4000 which possess impressive dielectric properties and impedance and thermal control.

RO4350B Gold Coated RF Circuit

RO4350B Gold Plaited RF Circuit

What Are The Design Considerations When Making An RF Link PCB?

When manufacturing an RF Link PCB, the following design considerations are essential:

  • Your RF Link layout mustn’t be perfect from the get go as it can succumb to antenna impedance. You can employ a matching network with the antenna in intervention.
  • It is preferable to employ a multilayer design for your RF Link PCB, more so a four-layer design. Use continuous ground features under the conductive traces.
  • Employing a standard characteristic impedance of fifty ohms impedance in your RF Link PCB allows you to easily match.
  • Lay out the conductive traces for your RF Link board first considering they are to carry high frequency signals.
  • Isolate the RF Link trace form the other conduits of high speed signals by employing measures such as via stitching.
  • Ground inductance greatly influences your board performance and keeping inductance low is what you need.
  • Employ gold plating for the components on your RF Link PCB that you etched without closely positioned copper features. You can also ground the copper features, provide via stitching and split the RF planes from others.
  • Use orthogonal orientation when routing sensitive traces while keeping their lengths as short as possible. Additionally, employ traces with minimum length between the crystal and RF Link keeping trace interconnections separate.
  • Where you have an audio or analog circuit close to the RF Link device, do not break the ground plane.
  • Employ integrated components for your RF Link PCB due to their compact nature.

Can You Employ Micro-Vias On An RF Link PCB?

The RF Link circuit board requires connections devoid of electromagnetic interference. Consequently, you find this necessitates the usage of micro-vias.

You have three types of micro-vias:

  • Blind vias, which connect outermost layers to internal layers.
  • Buried vias, which only connect internal layers, and
  • Through-hole via, which encompasses a conductive hole running the length of the board.

Visual Representation Of The Various Vias In a RF Link PCB

Visual Representation of Various Vias in RF Link PCB .The Orange Here Represents Layers of PCB and The Yellow Bars Represent the Vias as They connect The Layers Differently.

Why Is The Principle Of Partitioning Important When Making RF Link PCBs?

Partitioning refers to the separation of various RF Link PCB related aspects. The common types of partitioning are physical partitioning and electrical partitioning.

You find physical partitioning important as it describes component arrangement, orientations, and shielding.

Electrical partitioning includes the following subdivisions: distribution of power, routing of RF system, delicate circuits, signals, and partitioning of ground.

How Do You Power The Decoupling Circuit In An RF Link PCB?

Providing adequate and effective power to the chip decoupling circuit is critical. You find RF noise on the power supply of many linear integrated circuit chips extremely sensitive.

Additionally, an individual chip needs about four capacitors and an inductor for the isolation of power supply. This is in addition to exhaustively filtering out the noise.

An open collector output is common in integrated circuits and amplifiers necessitating the use of a pullup inductor. The inductor provides increased impedance for your RF load while decreasing that of your DC power supply.

Why Do You Need Grounding For Your RF Link PCB?

To guarantee that the lower RF ground is solidly aligned, you need to properly link all components to the main ground. Additionally, this helps you to separate noise and other potential traces.

Furthermore, ensure you adequately couple the VCO to the power supply, since the RF output of the VCO is often high. VCO output signal readily impedes other circuits requiring extra attention.

Keep the digital circuit as far away as feasible from the analog circuit for an RF Link PCB design. Similarly space the public analog ground, as well as the shielding and signal lines ground.

Sometimes you have no RF analog line and the line number of a critical digital signal. In this case employ as copper the RF traces, pads, and assembly connecting them to the main ground.

Isolation is the best option where you have a solid ground on the first level’s surface.

Breaking the ground in isolation attempts is inadequate as some high-speed signals leak through via the broken ground.

What Is The Process Of Manufacturing An RF Link PCB?

Various Parts Of A PCB That Are Important To Consider During Design

Various Parts Of A PCB To Consider During Manufacture Of RF Link PCB

The process of manufacturing an RF Link PCB is an extensive one that entails the following steps:

  i. Design

The design process initiates the manufacturing process with different software allowing you to capture core aspects of your board. You then print your design clearly highlighting the conductive and non-conductive areas of your board.

ii. Creating Substrate And Inner Layers

The substrate constitutes the non-conductive material that binds the laminates. You employ a curing process to form the substrate from epoxy resin and glass fiber.

After furnishing the substrates, and bonding them with copper plates, you print the desired pattern on the inner layers. You employ a photosensitive paper type which develops under an ultra violet light.

iii. Removing Unwanted Copper

You find the ultra violet light hardens parts of the exposed design such that you can remove unwanted copper.

A chemical solution with alkaline tendencies allows you to remove the copper leaving the desired trace.

iv. Inspection And Lamination

When manufacturing an RF Link PCB, you need to consistently inspect the board for issues such as misalignments. You can employ an optical punch to drill through the PCB layers keeping them in line.

The lamination process combines the multiple layers of prepreg, substrate and copper film into a single structure. You employ a mechanical press to combine the layers under heat which melts the prepreg gluing the layers.

v. Drilling And Plating

Drilling allows you to furnish holes for functions such as interlayer connections and component attachment through the board. You can have some of these holes plated and others left as they are.

vi. Outer Layer Imaging

You need to furnish the outer conductive surfaces I the desired pattern which begins by imaging. You then employ a photoresist layer and ultra violet light to define your surfaces’ features.

   vii. Plating And Etching

To furnish your copper trace pattern, you first deposit a copper film before etching away the undesired areas. The etching process is a subtractive process that you find possible by using special chemical solutions.

viii. Solder Mask And Silkscreen Application

The solder mask is a protective layer you apply over the conductive traces using a special film and epoxy.

The silkscreen which you print over the solder mask provides critical board information for users.

You find the solder mask furnished in a green colour which provides excellent contrast with the silkscreen’s white.

ix. Application Of Surface Finish

A surface finish for your conductive trace protects the copper from deterioration imposed by oxidation and other environmental elements.

You can employ different surface finishes such as hot air solder leveling, electroless nickel immersion gold and organic solderability preservative.

x. Testing And Assembly

Before attaching components, you carry out electrical tests on your board to establish presence of shorts and/or opens.

A successful testing process greenlights the assembly process which attaches components to the board.

Usually, you conduct further board tests on a populated board to ensure the components are position as expected and function alright.

How Do You Carry Out The SMT Assembly Process For RF Link PCB?

When attaching SMT components on an RF Link PCB, the following steps are necessary:

  • Programme the placemen and inspection machines for the process.
  • Apply and thereafter inspect the solder paste on the solder lands.
  • Position the SMT components on their respective lands.
  • Carry out a pre-reflow inspection process using AOI and first article inspection.
  • Carry out reflow soldering which forms an electrical connection between the board and component.
  • Inspect the board after the reflow process using AOI and X-Ray inspection machines.

What Design Elements Does The Substrate Thickness Of Your RF Link PCB Influence?

You find the thickness of your RF Link PCB influences the following design elements:

  • The trace width: which is essential in maintaining the characteristic impedance to a given level.
  • Power Handling Capacity: FR Link boards with thicker substrates have a higher capability of handling power.
  • Stability: the board size stability when employing a thick substrate for your FR Link PCB is impressive unlike thin substrates.
  • Dielectric Breakdown: The chance of dielectric breakdown in your Fr Link PCB is higher when employing a thin substrate.
  • Cost: your FR Link PCB cost increases with the thickness of your substrate.
  • Conformability: when using thin substrates for your FR Link PCB, you can bend them to fit certain structures without destroying them.
  • The mechanical performance: when you furnish circuit son a thin substrate, they are prone to distortion.

Does The Environment Influence The Performance Of An RF Link PCB?

Selection of the substrate material central to the manufacture of printed circuit boards and subject to the operational environment. The following are the most important material performances to consider related to the environment:

  i. Temperature Stability

You need to operate the RF Link PCB within a temperature range that will not negatively affect board performance.

When you exceed the highest and lowest operational and technical temperature, you may incur permanent damage to the board.

ii. Humidity And Chemical resistance

Your substrate materials should take up limited amounts of humidity from the environment to minimize compromise of the board’s electrical qualities.

Where you have a high-humidity environment, you need extra environmental protection solutions such as air conditioning resulting in higher manufacturing costs.

iii. Anti-radiation Performance

You find this is an issue especially for RF Link PCBs you employ in space or nuclear applications. You find that the substrate materials are subject to substantial ionizing radiation when used in this case.

Additionally, even with safeguards on, the cumulative effect affects the circuit board’s effective operating lifespan.

How Do You Inspect An RF Link PCB?

You can carry out the following forms of inspection on your RF Link PCB:

Visual Inspection

Simple tools such as a magnifying glass, a ruler and pair of calipers allow you to carry out a visual inspection. Some of the aspects you check out during visual inspection are:

  • Board dimensions alongside that of assembled components.
  • The integrity of conductive paths
  • The positioning of and states of pads and components
  • The coating quality as well as surface quality.

Electrical Performance Inspection

Electrical performance inspection entails carrying out connecting and insulating performance tests. In a connecting performance test, you use a multimeter to scrutinize the board’s connection aspects such as vias.

For an insulating performance test, you examine the planar insulating resistance to establish the FR Link PCB’s insulating performance.

Technological Inspection

In technological inspection, you investigate the FR Link PCBs response to soldering process and adhesion quality during plating. You can use removable demonstration tips for plating adhesion inspection to determine whether they stick or fall off.

Metalized Via Inspection

Inspecting metalized vias is critical especially for multilayer FR Link PCBs, as they are pivotal in the interlayer connectivity. When conducting metalized via inspection, you address the following concerns:

  • The via walls should be smooth and free from surface imperfections such as nodules.
  • You should identify any opens or shorts associated with the vias
  • The via resistance should not exceed ten percent after testing.
  • Determine the adhesive intensity of the via and pad interaction.

What Are Structural Process Test Systems You Use In RF Link PCBs?

Structural process test systems employ light sources in their testing procedures such as UV light, X-rays, laser beams and visible light. Employing structural process systems greatly improves the repeatability and accuracy of the visual inspection process.

Some common structural process test systems include:

Automated Optical Inspection (AOI)

You employ different light sources with this inspection approach including LED lights to highlight fine board aspects such as solder joints. You thereafter capture shots of these features after which you subject them to analysis.

Automatic Laser Test (ALT) Measurement

In this test method, you scrutinize physical aspects of the solder joints and deposits such as height and shape. A laser beam focuses on the desired board features fashioned with detectors identifying their positions.

X-ray Fluoroscopic System

Here, you employ an individual source of light to discharge a ray beam perpendicular to the board surface. The light intensity weakens via solder joint obstruction compared to other materials allowing you to analyze the quality of the joints.

Structural Process Test System

Structural Process Test System

What Is Crosstalk In Relation To RF Link PCBs?

Crosstalk is a critical component of PCB design that requires careful examination in each step of the process.

Crosstalk is the unintended electromagnetic coupling of traces, cables, leads, components, alongside other electronic components susceptible to electromagnetic interference.

You have two common variation of crosstalk in capacitance coupling and inductance coupling.

Capacitance coupling occurs due to positioning a trace over others a reference plane while inductance coupling derives from tightly packing traces.

How Should You Lay Out Components On An RF Link PCB?

When laying out components on an RF Link PCB, consider the following guidelines:

  • You need to prioritize integrated chip components over discrete components. The former offers you the benefits of good packaging, reduced solder joints, and minimal rate of failure.
  • You should arrange components based on their classification. You should separately position incompatible components to prevent their disruptive interaction with one another.
  • You should only solder components weighing more than 15 grams after they are resolved by support. Additionally, you shouldn’t install large, heavy, and heat-generating components on the board, but rather the bottom board of completed box.
  • Furthermore, you need to ensure thermal dissipation keeping the thermally sensitive components away from heat-generating components.
  • Account for the overall system’s structural requirements for adjustable components like potentiometers, micro switches, adaptable inductance coils, and variable capacitors.

Why Is ENIG A Good Surface Finish For An RF Link PCB?

ENIG is an acronym for Electroless Nickel and Immersion Gold. In this surface finish type, you deposit a nickel layer over the copper surface via electroplating before adding a gold layer.

You find use of a nickel and gold layer for your copper trace is widespread for the following reasons:

The ENIG finish has good solderability.

  • The wiring bond performance of ENIG is impressive.
  • ENIG surface finish is compatible with all flux types.
  • You can achieve multiple assembly requirements with ENIG.
  • ENIG offers you a smooth surface for component attachment.
  • Operating ENIG method is simple devoid of technicalities.

Electroless Nickel and Immersion Gold Surface Finish on RF Link PCB

Electroless Nickel and Immersion Gold Finish on RF Link PCB

What Advantages Derive From Making Flexible RF Link PCBs?

You can bend a flexible RF Link PCB without the danger of breaking or disintegrating you observe with such rigid boards.

While the highly versatile flexible RF Link PCBs cost you more, you benefit in the following ways:

  • The increased flexibility allows you to employ the RF Link PCBs in compact devices.
  • With flexible RF Link boards, you achieve better connectivity of board features and components.
  • Flexible RF Link PCBs have lower weights in comparison to rigid ones allowing their use in smaller devices.
  • The ability of flexible RF Link PCBs to effectively absorb physical impacts such as shocks is high making them durable.
  • Such PCBs are highly resistant to physical damage from elements such as heat and chemical agents.

At Venture Electronics, we will help you choose a perfect RF link PCB, depending on your unique requirements and specifications.

Contact us today for all your RF link PCB.

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