- R03210 designed by rich-experienced engineers
- More than 10 years of R03210 manufacturing experience
- Full range of superior quality R03210
- Cost-effective rates and hassle-free experience
What is the difference between RO3210 & RO3000™?
RO3210 material is an extension of the RO3000™ family of products and offers improved mechanical stability through the use of glass fabric reinforcement(Refers to the ability of electrical equipment to withstand the action of short-circuit current electrodynamic force without causing permanent deformation and damage to the equipment.)
The dielectric constant (Dk) and loss factor characteristics are extended to a wider range of practical frequencies to provide superior electrical performance.
What stander Copper cladding are there for RO3210 Laminates?
Material manufacturers offer plates with different copper cladding to meet customers’ product needs
●1/2 oz(17μm) electrodeposited foil(HH/HH)
Other Clddings may be available .contact Venture for more informations.
What is the decomposition temperature of RO3210 laminate?
The decomposition temperature (Td) of a PCB laminate is the temperature at which the laminate begins to chemically decompose, and it is the temperature at which the material loses 5% of its original mass
RO3210 PCB laminate is capable of maintaining optimal operation under such stressful, high temperature conditions.
These technologies typically operate at temperatures approximately 30°C higher than traditional lead processing technologies, or approximately 260°C.
Venture manufactures high-quality R03210 that belongs to the RO3000™ series. Our R03210 offers superior and enhanced mechanical stability. We manufacture our R03210 using advanced equipment and accurate tools. Our R03210 is also fabricated by expert designers and engineers. Therefore, you can assure us that our R03210 will suit your specifications and requirements.
Your Leading RO3210 Supplier in China
Venture is a professional Chinese manufacturer of R03210 for over 10 years. Our R03210 laminates are reinforced with woven fiberglass and are ceramic-filled.
Its fiberglass reinforcement allows our R03210 to offer superior mechanical stability. Venture R03210 is also designed with dissipation factors and dielectric constant that provides a useful frequency range.
We also manufacture R03210 that can provide outstanding electrical performance. Because of that, our R03210 can give the following benefits:
- Outstanding dimensional stability for a high production yield
- Suitable for any multilayer epoxy board hybrid designs
- Surface smoothness for a finer line etching tolerance
Aside from that, Venture R03210 is also equipped with features such as:
- Dk of 10.2
- .0027 at 10 GHz dissipation factor
- Useful frequency range up to 40 GHz
Are you looking for superior quality R03210 that will suit your business or projects? Venture is the best manufacturer! We manufacture high-quality R03210!
Venture offers R03210 with the most competitive rates with a very flexible payment term. We also don’t have a minimum order required for every R03210 to support you!
Venture always aims to bring your projects and business in the market trend. Whether you are an electrical engineer or distributor, Venture is your best supplier!
You can always trust our 10 years of experience in manufacturing R03210. We have a friendly customer service team that will provide you their full assistance.
Contact us today for your next R03210 orders!
RO 3210: The Ultimate FAQ Guide
If you have any question about RO 3210 PCB material, you will find the answer right here.
It covers everything including applications, features, fabrication or standard thickness, amongst others.
- What are the Features of RO 3210?
- Why Should You Use RO 3210 PCB Laminate?
- hat Types of Applications Require the Use of RO 3210 PCB Laminates?
- How Does RO 3210 PCB Laminate Compare with RO 3203 Laminates?
- What Is The Difference Between Rogers Laminate and Rogers Prepreg?
- What Are the Benefits of High Dielectric Constant Characteristic of RO 3210 Laminates?
- What Factors Influence the Insertion Loss Characteristics of RO 3210 Laminate?
- Can You Use RO 3210 Laminate to Construct a Multi-Layer PCB?
- What Special Fabrication Processes Does RO 3210 PCB Laminate Require?
- How Can You Determine the Glass Transition Temperature of RO 3210 PCB Laminate?
- What Features Make RO 3210 Laminate Suitable for High-Frequency Application?
- Why is RO 3210 PCB Suitable for Commercial Microwave and Radio Frequency Applications?
- What Factors Determine the Price of RO 3210 Laminates?
- What Do You Need to Consider Before Using RO 3210 Laminate?
- What is the Thermal Coefficient of Dielectric Constant of RO 3210 Laminate?
- What is The Standard Thickness and Size of RO 3210 Laminates?
- Does Copper Cladding Affect the Performance of RO 3210 PCB Laminate?
- What Factors Determine the Thickness of Your RO 3210 PCB?
- How Long Can RO 3210 Laminate Last?
- Can you use RO 3210 for RF PCB?
- How Does RO 3210 compare to FR4 PCB Material?
What are the Features of RO 3210?
Rogers PCB Material
RO 3210 is a premier Rogers PCB laminate that has stable and superior electrical and mechanical properties.
This product possesses all the characteristics of RO 3000 laminates but with enhanced mechanical stability.
RO 3210 laminates have the following feature:
- Low Coefficient of Thermal Expansion along the X, Y-axis
- Excellent dimensional stability
- Uniform mechanical and electrical properties
- Smoother copper and laminate surface
- Enhanced substrate rigidity due to woven glass reinforcement
- Ideal for use in frequency ranger above 40 GHz
- Low insertion loss
- High dielectric constant
- Competitively priced
- Stable dielectric constant over a wide range of temperature and frequency
Why Should You Use RO 3210 PCB Laminate?
RO 3210 PCB laminates offer numerous benefits for applications requiring the use of mechanically rigid materials.
RO 3210 PCB laminates have the following advantages:
- Ideal for use in high-frequency applications that require higher dielectric constant
- Suitable for mobile and portable devices operating under harsh conditions
- Less fragile and easy to handle because of excellent material rigidity
- Delivers higher production yields due to the material’s exceptional dimensional stability.
- Can tolerate finer line etching due to smoother surface
- Ideal for the construction of complex, epoxy, multi-layer boards due to uniform and stable electrical and mechanical properties.
- Suitable for mounting reliable surface assemblies because of low in-plane expansion
hat Types of Applications Require the Use of RO 3210 PCB Laminates?
You can use RO 3210 PCB laminate in various commercial microwave and Radio-frequency applications.
RO 3210 was manufactured as an extension of RO 3010 and has enhanced mechanical stability as a result of woven glass reinforcement.
You can use RO 3210 in the following applications:
- Collision avoidance systems for automotive
- Automotive GPS antennas
- Infrastructure for base stations
- Systems for datalink in cables
- Direct broadcast satellites
- Wireless and LMDS broadband
- Microstrip patch antennas-wireless communications
- Backplanes for power
- Readers for remote meter
- Systems for wireless telecommunication
How Does RO 3210 PCB Laminate Compare with RO 3203 Laminates?
The main difference between these materials is the dielectric constant.
RO 3210 is a high Dk laminate with a dielectric constant of 10.2 whereas RO 3203 is a low Dk and tangent loss material of 3.02 and 0.0016, respectively.
The other electrical, thermal, and mechanical properties only vary slightly.
What Is The Difference Between Rogers Laminate and Rogers Prepreg?
· Rogers Prepreg
You need Rogers prepreg to fabricate Rogers laminate.
Prepregs are also known as bonding sheets.
Prepreg is a short expression of “pre-impregnated” and refers to fabric that has been reinforced (impregnated) with a resin system, epoxy, or polyimides.
The Saturating material is usually not fully cured (reacted) and thus referred to as B-stage.
You can manufacture prepregs using two methods:
i. Solvent Dip Process
You can use this process to produce fabric prepregs only.
Consequently, dissolve the resin in a solvent bath then dip the reinforcing fabric in the resin solution.
Finally, pass the fabric saturated with resin through an oven having a series of temperature-controlled zones to dry the prepreg by the partial reaction.
ii. Hot Melt Process
You can use this method to produce both unidirectional and fabric prepregs.
The process follows two production stages.
In the first stage, you will coat a paper substrate with a thin layer of heated resin and allow them to interact with the prepreg machine.
Finally, impregnate the resin into the fiber by subjecting it to heat and pressure to end up with a final prepreg product.
Rogers laminate is a composite of one or more PCB prepregs with copper or other metal foils on either one or both sides.
You will get the final product after the application of pressure and heat to press, harden, and fully cure the material.
There are different types of laminates based on the resins, metal foil, and reinforcement materials used.
Other than PTFT material that has been filled with ceramics and reinforced with woven glass, you can also produce a laminate using the following materials.
- FR-4 material
- High Tg Epoxy
- BT Epoxy
- Copper Clade Laminates, etc.
The quality of the final product depends on a proprietary process involving the choice and composition of the laminate and variations in press cycles.
What Are the Benefits of High Dielectric Constant Characteristic of RO 3210 Laminates?
The evolution of circuit material used in PCB fabrication now avails numerous options for fabricators to select from.
Today, you can use a high- dielectric constant (Dk) PCB material in large-volume power amplifiers and antennas, rather than the traditional niche applications.
Though high Dk PCB materials possess numerous benefits routed on the provision of power integrity, their use is often overlooked.
Many fabricators prefer low Dk PCB materials to high Dk materials for high-frequency and high-speed applications because they have low loss tangent.
For this article, we will consider any PCB material having a Dk value of more than six as a high Dk material.
The following are some of the benefits of high Dk PCB material:
You can reduce your circuit’s dimension at a given frequency by using a material with a high DK.
The higher the value of your material’s Dk, the lower the circuit’s size at a given frequency.
Materials with high Dk values such as RO 3210 can reduce the phase velocity of electromagnetic waves.
They can also operate with shorter wavelengths and smaller circuits.
Miniaturization has the following benefits:
- Reduced circuit size
- Better coupling
- Smaller transfer impedance
- Reduced higher-order modes
- Lower radiation losses
- The reduced impedance at an optimally sized circuit
- Slow-wave enhancement/signal propagation
- Significantly delays fluctuation between the different PCB components
2. Optimal Economics
You can use high Dk materials to produce hybrid multilayer PCBs where only a few of its layers are critical for the microwave’s operation.
Also, you can use low-cost PCB materials such as FR-4 material in such cases.
You can also use it along with other RO 3200 series laminates to construct multilayer PCBs that can operate in applications with different dielectric requirements.
A high Dk material in a multilayer stack-up is responsible for ensuring separating ground planes and power thus resulting in lower self- and transfer impedance.
The lower Dk material in the stack-up ensures that the signal is efficiently supported on the surface layer and interior layers of a stripline sufficiently encased.
RO 3210 also provides a suitable opportunity for fabricating antennas with reduced element area.
You can use a simple plasma process to navigate through the costs of preparing plated through-holes.
Ensure that you consult with your fabricator on the material’s choice you intend to use alongside a high Dk PCB material in the stack-up before initiating the process.
3. Higher Thermal Conductivity
High Dk materials constructed from ceramic-filled PTFE such as RO 3210 also possess higher thermal conductivity.
In addition to superior heat-sink designs, these materials offer efficient heat transfer from the active devices and components into the heat sinks.
What Factors Influence the Insertion Loss Characteristics of RO 3210 Laminate?
Insertion loss is the total loss of a PCB substrate and includes dielectric, radiation, conductor, and leakage losses.
Radiation loss is the amount of energy your circuit is losing to the surrounding environment and depends on the material’s Dk, thickness, and operating frequency.
However, radiation loss is not a major loss for PCB materials with high Dk such as RO 3210.
The dielectric loss of the RO 3210 is associated with its dissipation factor and is considered low loss material since it falls below 0.005.
The conductor loss is a bit difficult to define because it has numerous variables.
The insertion loss of a laminate will increase with signal frequency and is more pronounced at higher frequencies than lower frequencies.
Insertion loss will affect your signal transmission.
A high insertion loss increases signal attenuation and distortion.
The following factors will affect the total insertion loss of RO 3210 laminate: Factors that determine the conductor loss include:
- Skin depth, that is, the number of conductors consumed by electrical current.
- Conductor’s surface roughness
The leakage losses relate to the semiconductor grade materials and have minimal impact on microwave-based applications.
- Temperature and humidity
- The surface roughness of copper
- The topology of the PCB. These include the effects of vias, length of routing, type and number connectors, back drilling, etc.
- Defects and other variances of the board.
- The dielectric thickness
- The copper density/thickness
- The size and spacing between the traces
Can You Use RO 3210 Laminate to Construct a Multi-Layer PCB?
Yes, RO 3210 PCB laminate is a conducive material for the fabrication of multi-layer PCB.
It also has a low coefficient of in-plane expansion that makes it ideal for the construction of an epoxy multi-layer hybrid PCB design.
Primarily, RO 3210 material has stable mechanical characteristics and electrical performance compatible with other RO 3200 series laminates.
The consistency in mechanical properties also enables you to use materials with different Dk on individual layers without experiencing warpage and incompatibility issues.
You can use it alongside other cheaper materials in multilayer PCB stack-ups to lower the production cost.
Where only a few layers of RO 3210 laminate are required.
What Special Fabrication Processes Does RO 3210 PCB Laminate Require?
You can use the standard fabrication process used for RO 3000 series PCB materials to fabricate RO 3210 laminates.
Similar to most PTFE-based PCB laminates, you have to consider the special requirements demanded preparation of plated trough-holes.
Consequently, you must perform a pretreatment of the RO 3210 laminate using either plasma or sodium treatment before depositing any conductive seed layer.
Failure to perform a pretreatment will cause plated void or poor metal adhesion.
You should also desmear RO 3210 material using a plasma desmear before depositing copper.
Avoid using chemical desmear because highly alkaline chemicals and elevated temperatures can react with fillers and bond ply layers.
How Can You Determine the Glass Transition Temperature of RO 3210 PCB Laminate?
A glass transition temperature (Tg) is the temperature at which RO 3210 laminate transform from a rigid and brittle material to a soft and rubber-like material.
It is not the maximum operating temperature of the material.
But rather a temperature that RO 3210 can tolerate for a short while before starting to deteriorate.
RO 3210 laminate does not exhibit true transitional temperatures just like other PTFE based laminates.
You can use the melt temperature of the product for this transition.
The measurements of Tg will provide a value outside the range of 50 to25OC.
Nevertheless, you can use three different methods to determine the glass transition temperature of RO 3210.
You have to carefully utilize these test methods because they will provide different results.
- Thermal Mechanical Analysis: This technique operates to the specifications of IPC-TM-650 2.4.24 and measures both the Tg ad the thermal expansion along the Z-axis.
- Differential Scanning Calorimetry: You will use this method following the guidelines of IPC-TM-650 2.4.25.
It determines both the Tg and the cure factor.
- Dynamic Mechanical Analysis: Following the specifications of IPC-TM-650 22.214.171.124, the dynamic mechanical analysis will determine both the Tg and Modulus.
It is specifically ideal for materials used in microvias and high-density interconnections.
What Features Make RO 3210 Laminate Suitable for High-Frequency Application?
You can use RO 3210 laminates for high-frequency commercial microwave and radio frequency applications.
Specifically, RO 321O suitability for use in high-frequency applications is a result of the following features:
- Low dissipation factor of 0.0027 at 10GHz
- High Dk of 10.2
- Ideal for use in applications operating beyond 40 GHz
- Excellent dimensional stability along X, Y axis of 0.8 mm/m
- Very low CTE of 13 ppm/°C (in-plane) and 34 (Z-direction) ppm/°C
- Rated V-0 for UL 94 flammability test and is compatible with lead-free processing techniques.
Why is RO 3210 PCB Suitable for Commercial Microwave and Radio Frequency Applications?
RO 3210 PCB
RO 3210 is a high frequency laminates with a high Dk of 10.2.
It is ideal for use in miniaturized circuits.
It also has robust mechanical stability and excellent electrical and mechanical properties that remain stable over a wide range of frequency and temperature.
Consequently, the following factors also make it more suitable for use in radio frequency and microwave applications.
- Has a low moisture absorption percentage
- The total loss of tangent is low
- Has a smooth copper/laminate surface?
- Can tolerate finer line etching
- Has a very low thermal coefficient of dielectric constant
- The thermal conductivity is high
- Low coefficient of thermal expansion
- Low thermal resistivity
What Factors Determine the Price of RO 3210 Laminates?
The following factors will determine the cost of RO 321O laminates:
- Size and thickness
- Type and thickness of copper-clad used
- The electrical and mechanical properties
- Copper thickness
- Any custom or special requirements
- Cost of freight
What Do You Need to Consider Before Using RO 3210 Laminate?
You should consider the following factors when selecting RO 321O laminates for your PCB project:
- Panel size and thickness
- Type and size of copper-clad used
- Compatibility with your application’s requirements
- The size of installation space
- Component compatibility
- Impedance control
- Manufacturability and equipment capability
- Turnaround time
- Any additional cost
What is the Thermal Coefficient of Dielectric Constant of RO 3210 Laminate?
The Thermal Coefficient of Dielectric Constant (TCDk) of RO 3210 laminate is -459 ppm/°C for a temperature range of 0-100°C.
This electrical property is determined through the specifications of IPC-TM-650 126.96.36.199 standards.
The TCDk shows how the dielectric constant of RO 3210 changes with changing temperature.
RO 3210 laminate has a very stable TCDk and its dielectric constant will remain stable when exposed to a wide range of temperatures.
Excellent stability of the Dk over a wide range of temperature makes RO 3210 laminate enables it to deliver stabilized circuit impedance and system performance.
Therefore, you will be able to use RO 3210 laminate in a wide range of applications operating at different temperatures.
What is The Standard Thickness and Size of RO 3210 Laminates?
RO 3210 laminates are manufactured in two dimensions of standard thickness and also two dimensions of panel sizes.
The thinner RO 3210 laminate measures 0.025″ (0.64mm).
Also, the thicker laminate measures 0.050″ (1.28mm) in thickness.
Similarly, you can use the small size panel that measures 12” X 18” (305mm X 457mm) or the large size panels, measuring 24” X 18” (610mm X 457mm).
Does Copper Cladding Affect the Performance of RO 3210 PCB Laminate?
Rogers offers different copper foils for PCB laminates that possess different characteristics.
Standard RO 3210 laminates have electrodeposited (ED) foils with different thicknesses, ranging from ½ oz. to 2 oz. though you can get other types upon request.
Electrodeposition treatment increases adhesion between dielectric interlayers and copper during the lamination process.
It also slows down copper oxidation by acting as an anti-tarnish agent.
The type of copper cladding chosen can affect the electrical performance of the laminate.
Also, the profile can lead to an increase in effective laminate Dk.
It also affects the insertion loss, especially at higher frequencies.
Effects on electrical performance depend on the type of copper profile and the size of the copper cladding.
Copper cladding also affects the mechanical properties of the laminate.
Specifically, ED copper can exhibit cracks from thermal stress under extreme rapid thermos-cycling conditions.
It also affects the foil adhesion and efficiency of how it bonds to the stripline assemblies.
What Factors Determine the Thickness of Your RO 3210 PCB?
Though there is no standard PCB thickness, the industry has specific sizes that simplify the designing process.
It also minimizes cost and leverage manufacturing equipment.
Nevertheless, you can still fabricate your RO 3210 PCB to the desired thickness.
Two main factors influence the thickness of a PCB; design factors and manufacturing factors.
· Design Factors
You should consider design factors at the PCB design phase.
They mostly concentrate on the board’s functionality and purpose.
· Weight, Size, and Flexibility
Depending on your system requirements, you can use either thinner and lightweight boards or thicker and heavier boards.
Thin laminates are more flexible but also prone to breakage.
On the other hand, a thick board offers better structural integrity but less suitable for lightweight applications that have small installation spaces.
· Copper Thickness
RO 3210 laminates come in three standard copper thickness.
They include: ½ oz. (17µm), 1 oz. (35µm) and 2 oz. (70µm).
However, you can adjust the copper thickness appropriately to entail all the board’s unique requirements.
The choice of a particular thickness relies on the amount of current you need to push through the PCB.
Using thicker copper also makes the final board thicker.
· Board Material
The materials you select to construct your RO 3210 PCB significantly impact the service life and thickness of your board.
Other than RO 3210 laminate, you also need to select an appropriate substrate, solder mask, and silkscreen to use.
The thickness of the substrate and laminate is of at most importance and significantly determines how thick your PCB board will be.
· Number of Layers
The number of PCB layers significantly influences how thick a PCB can become.
You can fabricate a PCB within the range of 2 to 6 layers and easily fit it within the standard board thickness.
However, an 8-layer and above PCB will exceed the standard PCB thickness.
Though using thinner boards will reduce the overall thickness of a PCB, it will greatly affect its performance.
· Signal Type
The type of signal transmitted by the PCB determines the choice of materials to use and the final board thickness.
For instance, you will use thicker boards having wider traces and thicker copper to fabricate a PCB that carries high power signals than lower power signals.
· Vias Types
Different types and densities of vias demand varying board thickness to efficiently operate to the specifications.
For example, micro vias are typically small in size and will therefore suitably fit well on thinner boards used for high-density connections.
Different operating environments require boards with different thickness because it contributes to the PCB resistance and conductivity.
For instance, thick copper traces are not ideal for high-current and thermally variable environments because they are not thermally stable.
Similarly, using a thin laminate will deliver suboptimal performance in rugged operating environments.
These factors influence how well the fabrication process is suited for the work.
Equipment for Drill Holes
The board’s thickness can limit the capabilities of fabricator’s machines and lasers to drill holes of specified depths and diameters.
Also, the limitation is expressed as an aspect ratio and is the ratio between the hole depth and its diameter.
The standard aspect ratio is 7:1 and should be achieved by all fabricators.
Higher ratios are possible, depending on the capabilities of your fabricator’s equipment, and will cost you more.
Therefore, drilling thicker boards will limit the manufacturer’s ability to produce small-size holes.
The thickness of copper traces depends on the process of plating/etching, which also relies on the thickness of the internal copper layer.
Therefore, using a thick copper layer will significantly impact the design, manufacturability, and cost of your PCB.
Number of Layers
Manufacturing PCBs with more layers is very difficult and therefore limits their potential to fit with the standard PCB sizes.
However, specialty fabricators can achieve standard PCB thickness by using very thin laminate layers but at extremely higher prices.
You should always consult your manufacture to inquire whether they can manage to deliver the desired PCB thickness and number of layers before finalizing the design.
The majority of the manufacturers use large panels to produce OCBs then separate them into individual PCBs.
Consequently, the thickness of the panel used will significantly impact the depanelization method to use.
Consult your manufacturer beforehand on how to best alter the design for optimal depanelization.
How Long Can RO 3210 Laminate Last?
The storage period of RO 3210 laminates directly depends on the storage conditions.
You can store this product indefinitely under ambient conditions.
Besides, you should also avoid conditions that would cause mechanical damages such as dents, scratches, and pits.
You can ensure this by keeping the surface of the storage shelf and laminate very clean, smooth, and free of debris.
Also, you can caution the laminate’s surface by interleaving them with soft, non-abrasive separating sheets.
However, storage under oxidative and corrosive environments will significantly reduce the service life of the laminates.
Specifically, avoid storing your RO 3210 laminates at elevated temperature and humidity.
In the case of laminate discoloration that may arise from oxidation, you can use chemical exposure (micro etch) or mechanical (debur) to remove oxidation.
For faster material tracking, use the first-in, first-out (FIFO) inventory record-keeping system.
Can you use RO 3210 for RF PCB?
How Does RO 3210 compare to FR4 PCB Material?
The following are the key similarities and differences between RO 3210 and FR-4 material.
- RO 3210 material has a high Dk value of 10.2 while standard FR-4 has a Dk value of 4.5
- You can use RO 3210 materials for an application operating beyond 40GHz while FR-4 material is more suited for use in frequencies below 1GHz.
- Whereas the moisture absorption of rRO3210 material is below 0.1%, that of FR-4 material range between 0.15 and 0.25%.
- The decomposition temperature of RO 3210 material is 500C while that of FR-4 material is 305C
- The flammability rating of both materials is v-0 according to UL 94 standards
- RO 3210 has higher material rigidity and mechanical strength compared to FR-4 material.
- The Dk of RO 3210 material is very stable over a wide variety of temperature and frequencies unlike that of FR-4 material
As you can see, there are many aspects to consider when choosing RO 3210 material.