Power Module PCB

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Power Module PCB

Venture is your one-stop manufacturer of industrial and automotive products in China. We enterprise computing solutions for our customers and commercial markets. To maintain our network in the electronics industry. Venture introduces designs, operations, and sales for our power module PCB supplies.  Our power module PCB services include:

  • Power Module Ceramic PCB
  • Encapsulated Power Modules
  • Low Power Amplifier Power Module
  • High Voltage Power Module
  • Reversible Power Module
  • Reversible Polarity and High Stability


Your Leading Supplier Power Module PCB in China

Venture is an experienced manufacturer of power module PCB. Venture power module PCB provides control for circuit elements for several power components.

Power Module PCB

Our power module PCB designed in order to ensure signal integrity and power integrity. Venture power module PCB is often classified by the diode for they share more qualities with diodes.

We featured a power module PCB as a compact module design, high power density, and configuration flexibility to satisfy our customers.

Power Module PCB

Venture power module PCB also provides easy ways to cool the device and connect them to the outer circuit. Venture offers a power module PCB with wide industrial and automotive applications.

Venture power module PCB ideal for use within a wide range of applications such as measuring and testing equipment, process control and portable applications.

Venture prioritize our customer’s needs. To ensure the quality of our product, Venture offers proper product testing while introducing it to you.

Our staffs are respectively and always willing to help and guide you to find your needs. Venture power module PCB comes out with a very simple installation.

Power Module PCB

Venture makes sure all power module PCBs are useful for connecting and another purpose. Venture power module PCB is useful in convenient disconnection.

Venture manufacture power module PCB which controls the physical containment of power semiconductor devices in a secure manner. In short, Venture always makes sure about safety.

If you want more information about Venture, you can Email us!

Power Module PCB: The Ultimate FAQs Guide


If you’re looking for any information about power module PCB, you will find it right here.

It is because this guide will answer all your questions on power module PCB.

Let’s dive right in.

What Is Power Module PCB?

Power Module PCB is a type of printed circuit board responsible for regulating power in electronic devices.

It is a converter.

It transforms an input power to an output that satisfies a circuit, system, or load requirements.

Electronic devices like computers and home appliances require a power module PCB to convert AC to DC energy with reduced noise content.

Power Module PCB

Power Module PCB

What Are The Main Components Of Power Module PCB?

Power supply PCB can be categorized into four major parts, namely:


The transformer is a fixed device responsible for conducting electrical power from the primary source to the secondary source with no frequency interruption. It is also employed in the increase or decrease of input voltage.


A rectifier is an electrical gadget used in the correction process where alternating current changes to direct current. There are two types of rectifiers, namely controlled and uncontrolled rectifiers.


After the rectification process, unfavourable AC is discharged and exposes the load to destruction. Filters are thus put in place to avoid this occurrence.

In essence, the filter polishes the signal and subdues the AC element.

Voltage Regulators

Stable voltage output is necessary for the power module PCB to work efficiently, thus the need for Voltage regulators. The regulators basically modulate the voltage output of the Power supply board.

Which are the Main Properties of Power Supply PCB Material to Consider during Material Selection?

Coefficient Of Thermal Expansion [CTE]

CTE is basically the rate of expansion in the power module PCB. In case the substrate is subjected to heat above the glass transition temperature, a corresponding increase in CTE will also be observed. CTE is measured in [ppm] parts per million.

The difference in CTE between the substrate and the layer of copper becomes a problem when subjected to heat. Due to this, the CTE is maintained to the smallest possible quantity as to the effect of expansion.

Dielectric Constant [Dk].

The Dielectric constant of Power module PCB must be steady to be suitable for appliances with a high frequency. A drop in the Dielectric constant levels will cause a corresponding rise in frequency.

Electrical efficiency of a dielectric constant is influenced by elements such as signal integrity and resistance.

Dissipation Factor [Df].

Also known as Dielectric loss tangent. A decrease in Dissipation factor will result to a decrease of PCB power.

The dissipation factor of power module PCB will rise steadily with frequency. The Dissipation factor is most suitable for signals that are analog and is not a priority in digital circuits.

Thermal Conductivity [K].

The thermal conductivity of a power supply corresponds to the capacity of a PCB to transfer heat. Upon decrease in thermal conductivity, a parallel decrease in heat conduction of the PCB will also be observed.

Thermal conductivity is determined in watts per meter and is denoted in kelvin[k].

Glass Transition Temperature [Tg].

Glass transition temperature is the rate of change when Power module PCB material is subjected to high temperatures. When subjected to high temperatures the PCB material smoothens then solidifies to its former state after heat removal.

Electrical Strength

Electrical strength is the rate at which a power module PCB system can withstand electrical malfunctions. It is established through exposing the power supply system to low pulse and  high voltages maintaining an optimum AC frequency.

It is denoted in Volt/mil and in most cases the PCB is valued between 800v/mil and 1500v/mil.

Which Are The Two Main Types Of Power Module PCBS?

Here are the two main categories of Power Module PCB types:

Linear Power Module PCB

Also known as regulated power module PCB, this type of power module is commonly employed in low-end appliances. As the term linear suggests, this it serves the function of modulating the supply of power, offering optimum voltage output.

Due to its availability through the years, linear powder module PCB offers numerous benefits including low costs and low noise output.

Linear Power Module PCB

Linear Power Module PCB

Switch-Mode Power Supply [SMPS] PCB

Switch-mode power supply PCB is regarded as more complex compared to Linear PCB. It has the ability to provide DC output that is able to power high-end gadgets and appliances.

This is made possible through the AC to DC converter PCB.

Through a switching circuit, the DC output is transformed to high current AC and frequency.

This is later used to control the voltage output needed for efficient operation of the power module PCB device.

What Are The Key Considerations When Designing Power Module PCB?

The power supply system has other functions in addition to AC-DC conversion. This makes power module PCBs prone to integrity issues that can be prevented by employing proper layout techniques and observing some key factors.

These factors include:


The type of PCB regulator is very vital in the design of a Power supply system. Type of regulators include linear and switching regulators.

Linear regulators are most common in low-end gadgets such as mobile phones that consume modest power. Switching regulators employ shielding techniques in cases of high-end machines that may cub integrity issues near circuits.

Other circuits are also laid out on the power module board that aid in power regulation.

Thermal Management

Power supply circuits will often emit heat in the course of converting AC to DC. Thermal management is therefore necessary for the power module device to operate efficiently.

Power module PCBs that are designed on multiple layer circuit boards to ensure heat is dispersed in an even fashion.

The purpose of thermal management is to ensure the heat emitted does not damage the delicate elements of a Power supply PCB.

Fans can also be installed when converting AC to DC through pulse-width modulation to cool the power supply elements.

Power Integrity

Power Integrity issues may occur when Integrated circuits switch resulting to change in voltage levels. This change in voltage levels is known as ground bounce.

Bypassing techniques are used through the use of capacitors to recoup the change in voltage levels. Proper element arrangement when designing PCB’s will ensure this change is compensated and efficient power supply is achieved.

Which Are The Crucial Power Module PCB Design Guidelines For Component Placement And Routing?

Proper placement techniques are very vital in designing power module PCB.

It ensures that the power and signal standard is optimal upon operationn, and is thus considered to be cost-effective.

There are guidelines that have to be observed to ensure proper component placement and routing including:

Circuit Separation

Digital circuits must be isolated from analog circuits in order of there functions. Noise signals should be separate from sensitive signals, ensuring efficient operation of the Power Module PCB.

Seperate The Components From Zones That Discharge Heat

Regulators that are found in high-end appliances tend to discharge heat. As a result of this, thermal hot spots can be created and may damage the power supply.

Therefore, it is necessary to separate the PCB elements from the regulators to ensure efficiency.

Component Orientation

Orientation of elements in a power module PCB is crucial as it influences the cost and time spent designing power supplies.

Similar components are aligned in similar directions, and in turn prevent multiple placement and routing errors.

This leads to a streamlined process when designing power module PCBs.

Give Room For Copper Traces

Copper traces aid in managing heat in power module PCBs. Ample gaps allowing the copper traces to penetrate near components is a requirement.

The width of the copper traces also plays a major role by providing resistance that is low to allow power to pass.

What Are The Features Of A Perfect SMT Solder Joint In Power Module PCB?

Perfect SMT solder joints are crucial in creating an ease in power supply boards operation. Features of a perfect solder joint include;

  • Smooth and clean solder joints.
  • The Solder should not touch the solder mask.
  • No gaps on the solder joint.
  • Solder should entirely cover the pad area.
  • Surplus solder should not cover the elements on the PCB.
  • Adequate wetting.

Solder Joints in Power Module PCB

Solder Joints in Power Module PCB

How Do Large Components And Heavy Copper Tracks Influence Soldering Quality During Assembly Of Power Module PCB?

Most high current and high voltage power module PCB components tend to be massive and heavy, even if they are of SMD type.

This is majorly true for high power resistors, capacitors and inductors.

Power module PCB assembly with such big components call for cautious handling during soldering with reflow machines.

The PCB assembly together with all components attached go through preheating zones in the machine prior to actual soldering.

The assembly ought to cool down after completing the soldering process.

Lead-free soldering requires higher temperature for soldering in comparison to leaded soldering. For this matter, the power module PCB assembly must also go through preheating to elevated temperature.

Nonetheless, the existence of components having large mass and volume present a challenge with preheating.

Large components need more heat up time since they have a greater mass.

Till they have sufficiently heated up, the components close to them are deprived of heat.

The shadow impact produced by a big component prevents the surrounding small components to warm up sufficiently, leading to improper soldering.

Heavy copper tracks pose similar challenge as above. Due to the higher mass, the copper needs more heat to attain the needed temperature prior to soldering.

Solder on pads of copper track will fail to melt properly in case the tracks do not attain required preheat temperature.

As a result, the components will not stick to the heavy copper tracks.

Therefore, you need to alter the thermal profile of such power supply PCB assemblies going through the reflow equipment. Make sure the adjustment enables them to heat up suitably before reaching the soldering zone.

This might require mounting thermocouples on distinct location on the power module PCB. You should particularly install them close on the heavy copper tracks and larger components.

The thermocouples monitor the nature of temperature change as they pass through the reflow machine. Appropriate assembly of power module PCBs having large components and heavy copper might need expertise, though it is practical to attain success.

Which Are The Power Module PCB Assembly Testing Techniques To Guarantee Good Solder Joint?

Manual Visual Inspection

Manual visual inspection is conducted to ensure quality solder joins in the PCB. Microscopes are used to check the condition of the solder joints and integrated circuits found in the power module PCB.

Specialised needles are also employed to confirm if the solder joints are complete. This technique is considered cost and time effective.

Automated Optical inspection [AOI]

Automated optical gadgets are used through special photographic lenses and software to determine quality solder joints. This lens operates differently from a normal camera lens.

The software also has the ability to provide measurements of the components and the volume of the solder joints.

X-Ray Inspection

Inspections are done using X-Ray images produced when assembling the Power module PCB. Hidden layers and solder flaws that cannot be depicted by the automation process are revealed aiding in the inspection process.

How Do You Use Power Module PCB Copper Thickness To Enhance Current Flow?

Copper thickness directly corresponds to the current flow in power module PCB. The following are some procedures where copper thickness can be utilised to enhance current flow.

  • Establishing the Optimum voltage and signal power.
  • Establish trace impedance.
  • Account for the anticipated rise in temperature.
  • Calculate the surface area of the copper trace.

How Does Current Loops Influence Performance Of Power Module PCB?

The noise production and operational performance of power module PCB relies greatly on current flow, which happens in loops.

With linear power module, there exists two main loops – the output load loop and the input source loop.

With switched mode power module PCB, there exist two more loops, which are the high current loops of output rectifier and power switch.

The basic design requirement is to maintain the various current loops isolated.

Moreover, you should permit them to go through a short conductor as practical.

Even though the currents within the loops are by a greater extent DC, they do have some AC components.

These AC form part of the conducted EMI.

Keeping a short conductor length permits emission of only a small portion of the AC energy into the environment.

Most current loops in output rectifier and power switch of switched mode power module PCB transfer high peak vibrating DC currents.

These currents have sharp edges and trapezoidal waveforms.

You need to lay out these current loops in such a manner that they encircle a very tiny area and utilizes traces of reasonable width.

Does Trace Width Affect Current Flow In Power Module PCB?

Absolutely, narrow traces exhibit higher inductance and resistance.

This is because the resistance and inductance shown by the trace are inversely proportional to their width.

For that matter, the traces width forming the current loops determine the voltage drops about the loops.

When flowing across high inductance of narrow traces, high peak pulsating DC currents also generate RF radiation.

Nevertheless, current loops having wide traces minimize this tendency. Furthermore, wide traces offer better heat elimination from the output rectifier and power switch of the PCB.

Switched Mode Power Module PCB Layout

Switched Mode Power Module PCB Layout

What Is The Best Way To Place Grounding In Power Module PCB Layout?

The high current loops in power module PCB need isolated grounding to hinder them from affect one another.

This is so since grounds denote return paths having the least potential for currents.

Ground designates the reference potential from where you determine the potential of the remaining signals.

You should consider segments of the ground system independently.

This is because the ground conveys both DC and AC signals from different locations in the power module PCB.

You may have unstable power supply if you interconnect these grounds improperly.

Mainly, you should differentiate the low-level control ground, high-current output ground and high-current input ground.

Ensure you separate these grounds from one another. Normally, the three grounds intersect at a star point close to the input return.

Some power module PCBs feature digital sections, power sections and analog sections within the same circuit board.

Therefore, you need to route the 3 segments independently, do the grounding to the return flank of current sensing resistor.

You must maintain all the PCB traces into and out of current sense resistor both small and broad, or employ kelvin connections.

Hight current traces commonly result in EMI. You minimize the radiation by putting ground planes on opposite edges of PCB and on either traces side.

This effectively encircles the high current traces using ground.

thereby effectively enclosing the high current traces with ground. The wide ground conductor areas act as electrostatic shields.

This traps the emitted energy as eddy currents that drain as heat.

How Do You Manage Heat On Power Module PCB?

Thermal Dissipation

Power module PCB are generally characterised by heat emission during operation. To cub the heat, thermal dissipation is employed for instance by installing a ventilating fan strategically to manage the heat discharged.

Elements that emit heat are also separated from delicate components.

Thermal Distribution

Thermal distribution is exercised when the board is being assembled. It aims at dispensing heat evenly and managing the thermal resistance on the power module PCB.

What Are The Techniques Used To Ensure Adequate Thermal Dissipation In Power Module PCB?

The procedures that ensure adequate thermal dissipation include the following;

Strategically Positioning The Ventilating Vents And Fans That Aid In Cooling Off The Heat-Discharging Components

Thermal vias are mostly installed under heat discharging components as a way of combating heat discharged.

Thermal Pads Attached To Heat-Emitting Sinks

Heat Discharging elements within the power module PCB are attached to heat sinks thereby effectively managing the heat across the circuit board. Ventilating Fans are also employed to expedite this process.

Using Elements With Thermal Insulation Characteristics

Components with good thermal insulation properties can also be utilized to ensure effective thermal dissipation across the Circuit board.

Trace Routing

Copper traces across the Power module PCB aid in thermal heat distribution across the circuit board by maintaining the level of component inductance.

Strategic Component Placement

During power module PCBs assembling process, heat emitting components are placed along the edges of the board to allow for proper heat distribution. Circuit segregation is also a crucial procedure that allow for heat distribution

What are the Causes of EMI in Power Module PCB?

Electromagnetic Interference is transmitted in two ways namely, conduction and radiation. EMI in power module PCB is caused by the following;

Switching Noise

Switching noise emitted when components constituting the Power Module PCB operate is discharged as EMI. This happens in a switching and concurrent fashion and in one direction.

Radiation From Antennas

Antennas are basically a significant metallic layer on the Power Supply Board in basic appliances. During operation, antennas discharge EMI by radiation.

Copper Traces

Electromagnetic Emmisions is a common process during PCB operation. EMI is discharged from the copper traces adjacent to each other due to Electromagnetic Coupling.

Return Current Paths

High speed Signals require efficient Plane pairing to allow the returning of the signal.

Lack of this results to the signal drifting around seeking its source, thus significant electromagnetic Emmisions.

Why Is EMI Filter Necessary In Power Module PCB?

Whenever power leads leave or enter the power module enclosure, they have the probability of discharging EMI.

Therefore, regulatory authorities require the power module PCB to keep its EMI magnitude lower than the maximum level designated in frequency range.

For that matter, you employ EMI filters to decrease the levels of radiation. However, it is not practical to remove the radiation entirely.

The EMI filter design enables it to obstruct the high frequency noise out of the PWM switching that the power module uses. By doing so, it takes the noise back to ground.

It is vital you lay out the filter circuit components correctly.

Proper component layout helps hinder some switching energy out of them to connect into traces linking the components and discharge into the environment.

EMI Filter

EMI Filter

What Is Power Module PCB Thermal Resistance?

Power Module PCB Thermal Resistance is the degree at which a component can counter heat generated during operation of PCB.

Strategic positioning of ventilating fans is factor to thermal resistance.

How Do You Determine Power Supply PCB Thermal Resistance?

The Thermal Resistance of a power module PCB is basically the inverse of the thermal conductivity of the PCB.

Thermal conductivity can be determined in two different ways namely:


Thermal conductivity is determined here by subjecting the circuit board to high temperatures within a specified frequency. The outcome is that components heat at triple frequencies deriving the name 3 Omega.

Thermal Resistance is then derived from the inverse of thermal conductivity attained.

Guarded Plate

A hot plate and guard are employed to establish the thermal conductivity in Power Module PCB. It is considered the easiest way of determining thermal conductivity.

The temperatures of both sides of the PCB are measured to determine thermal conductance, thus thermal resistance.

How Can You Manage Thermal Resistance In Power Module PCB?

Power Module PCBs can only function appropriately when heat emitted is distributed evenly across the circuit board. The determinant of this factor is known as thermal resistance.

Thermal resistance in PCBs can be managed by following relevant procedures as detailed below;

Segregate Components With High Power

During the assembling process, separation of elements that discharge heat is key as it aids in reducing harsh temperatures during PCB operation.

This technique will in turn manage the thermal resistance in power supply circuit boards.

Components Chosen In Order Of Their Temperature Characteristics

It is necessary to employ components that are characterized by temperatures that favour thermal resistance. This is hence an effective way of managing thermal resistamce in Power Module PCB’s.

Apply Thermal Dissipation Techniques

Thermal dissipation techniques ensure heat is distributed evenly across the PCB. Practices like installing vias and ventilating fans aid in cooling the components thus managing the thermal resistance in power module PCB’s.

What Is The Role Of Bypassing Capacitor And Decoupling Capacitor In Power Module PCB?

Here is explanation of the role of the two capacitor types in power module PCB assembly:

Bypassing Capacitor

This capacitor is responsible for noise prevention from the PCB through by transmitting it to the ground.

It is attached between Ground pins and voltage supply to lower the noise and voltage alteration

The role of bypassing capacitor is to provide a path with favourable impendance, allowing the PCB to counter noise frequencies.

Decoupling Capacitor

Decoupling capacitor is an element equipped with restricted energy storage capabilities and is most commoly placed parrallel to each other across the PCB. The capacitor links the Integrated circuit and power supply in a kindred fashion.

It basically provides the energy needed to maintain the voltage Output to a steady level. It provides DC, preventing instant variations in voltage thereby securing integrated circuits and also reserves energy across the Power Module PCB.

Why Is It Important To Guarantee The Power Integrity Of Power Module PCB?

Power Integrity of Power Module PCB refers to the regulation of voltage power that allows for efficient operation of power supply PCB. It is of great importance that power integrity is guaranteed in PCB due to the following reasons;

Ensures Efficient PCB Operation

Power integrity correlates with regulation of voltage power and noise reduction during PCB operations, and in turn provides efficiency.

Voltage Regulation

 Power Module PCB frequently used in present-time constitutes of circuits that require voltage maintenance, preventing fluctuations in power and signal levels. This is subject to Power Integrity.

Regulation of Electrmagnetic interference [EMI]

Power integrity aims at reducing the noise produced in the power delivery network. This effect leads to better signal quality and in turn electromagnetic emissions are also regulated.

What Are The Characteristics Of EMC Compliant Power Module PCB Design?

Electromagnetic compatibility is the measure of a device to operate at a level that is satisfactory.

The characteristics of EMC Compliant Power Module PCB includes the following;

  • Non-interference with other elements.
  • No sensitivity during emissions from other elements.
  • Non-interference within the PCB itself.

Power Module PCB Assembly

Power Module PCB Assembly

What Is The Difference Between EMI And EMC In Power Supply PCB?

Electromagnetic Interference occurs when power is being transferred between devices either by radiation or conduction leading to signal interruption. This occurrence may damage the device.

Electromagnetic compatibility on the other hand is the measure of a Power Module PCB to counter electromagnetic emissions as a result of EMI.

The difference is seen where EMI is subject to radiation while EMC is the measure of a power supply PCB.

How Do You Prevent EMI In Power Module PCB?

EMI can be prevented by implementing the following Procedures;

Component Positioning

A well-structured PCB in terms of placing the components in an orderly fashion ensures quality power and signal integrity.

Delicate Components prone to noise discharge are segregated and maintained to a low level to allow for the routing of traces.

Bypassing Capcitors are also employed and placed near each other in High end gadgets to facilitate power spikes absorption.

Routing Of Traces

Routing the trace directly corresponds to an efficient placing of the components.

High-speed signals and Impedance signals are layered allowing them to utilize planes as return paths.

Any obstructions to this process should be weeded out as well as avoiding 90-degree corners.

Reference Planes

Stack-up Layers should be layered adequately allowing the signals to have ample return paths. This is a major factor during PCB manufacturing process and is considered cost-effective.

Depending on your unique requirements and specifications, Venture offers perfection solution in the power module PCB industry.

Talk to us now for competitive prices on power module PCBs.

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