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Motor Driver PCB

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What Are Motor Driver PCB Materials?

The motor driver PCB is made of high quality materials. These materials are usually hydrocarbons that is in combination with glass or ceramic materials, and PTFE material is used here.

FR-4 material does not provide effective thermal conductivity, which is why copper and aluminum are widely used in this motor driver PCB.

As a leading manufacturing company, we supply various motor driver PCBs with high quality materials, we can provide excellent motor driver PCB.


Where Is Motor Driver PCB Used?

Impressive functionality is a key factor for a motor drive PCB to be compatible with many applications. Motor drive PCBs are used in various fields and bring a new dimension to the use of motor drive PCBs in the following applications.

– Autonomous robotics        – Electric vehicles
– Relays                                          – Industrial sector
– Aerospace technology       – Defense sector
– Navigation                                 – Solenoid Switches
– Stepper motors                      – LED lighting

Advantages Of Motor Driver PCB

Motor driver PCBs are the first choice for motor driver circuit designers because:

Long life.It is composed of highly durable materials that can withstand enormous mechanical and thermal stress for extended service life.

Cost effective.Excellent performance of this PCB. It enables circuits due to the constant current and magnetic current, these properties reduce the manufacturing cost.

Flexibility.Motor Driver PCB can be used flexibly for some of applications.

Low-loss operation.It can work in both clockwise and counter-clockwise directions without causing a voltage drop.

Reliable.Its high mechanical stress tolerance and reliability are used in high-load projects.


To achieve the best performance, the PCB design of motor drive systems requires techniques and special considerations. It is not trivial.

Find high-quality motor driver PCB at venture! We guarantee you its durability.

Your Leading Motor Driver PCB Supplier in China

Primarily, due to the I2 R power dissipated in the RDS(ON) of the internal MOSFETs, motor driver ICs are able to deliver large amounts of current and dissipate a significant amount of power.

Generally, this power is dissolute into copper areas on the printed circuit board (PCB). Special PCB design techniques are required to ensure adequate cooling.

The printed circuit board (PCB) designs for motor driver ICs require some techniques and special consideration not required in normal analog and digital circuits to achieve the best performance.

The types of IC provide specific recommendations for designing PC boards that use them and are commonly used for motor driver ICs. PCB design of motor drive systems is not trivial.

The primary factors that designers must consider when laying out a motor drive system are high-speed switching frequency, power efficiency, compact board design, and low-noise jitter.

There are several types of IC packages used for motor driver ICs. Four basic groups of packages are used at monolithic power systems (MPS), which includes TSSOP packages, SOT23 and SOIC packages, QFN packages, and flip-chip QFN packages.

SOT23 package is a small package and is originally designed to house separate devices like transistors. The standard IC package is a SOIC package.

Also, TSSOP packages use two rows of pins and are rectangular in shape. TSSOP packages are used for motor driver ICs and usually, it has a large exposed pad on the underside of the package that helps remove heat from the device.

The pins are connected to the defusing wires attached among the chip and the lead frame, so not much heat is conducted through the leads.

QFN packages are leadless packages. It has pads around the outside edges of the part, as well as a larger pad centered on the underneath of the device. The pads along the edge are connected to the die using wires bonded among the chip and the lead frame.

As a leading manufacturing company, we will supply a wide range of motor driver PCB at a budget-friendly price.

Venture manufactures motor driver PCB using the latest methods. We also supply them globally.

If you want to inquire, please contact us,

Motor Driver PCB: The Ultimate FAQ Guide


In today’s guide, I will explain everything you need to know about motor driver PCB.

This guide will help you choose the right specifications, material type, via, and other vital characteristics.

Keep reading to learn more about the motor driver PCB.

What is a Motor Driver PCB?

A motor driver is a device that you use to generate high power and transforming large currents.

You find the motor driver chip has multiple MOS field-effect transistors whose resistance values determine the overall power.

You note the power generated by the motor driver is delivered to the copper features on the PCB.

The motor driver PCB, therefore, controls the electrical processes of a motor drive component.

You need to include cooling design aspects on your motor driver PCB to mitigate the high power dissipated.

Motot driver PCB

Motor drive PCB

What are some of the Packages used with the Motor Driver PCB?

You can employ several chip packages with the motor driver PCB.

Standard packages that you can use with your motor driver PCB include:

· Small Outline Transistor (SOT)

You find the SOT package to be a small form transistor chip package that is usually surface mounted.

The small outline transistor is employed for switching applications on the motor driver PCB.

· Quad Flat No-leads (QFN)

As the name suggests, this package type has no leads and is flat with four equal sides.

You find instead it is metalized at the bottom around the edges and the center.

You find the centerpiece is useful in heat elimination while the edged parts are wire bonded to the die.

When connecting the QFN package to the motor driver PCB, you solder the centerpiece to the board.

· Thin Shrink Small Outline Package (TSSOP)

The TSSOP package is oblong with the leads on two parallel edges.

You use wire bonding to attach the die to the chip’s leads reducing the heat experienced on the metalized connections.

The heat generated by a motor driver PCB is significant, requiring incorporating thermal design to your TSSOP package.

You can connect a heating pad connected to the die at the package bottom to eliminate excess heat by convection.

You can attach this heat pad to the ground layer of the motor driver PCB.

You find this possible due to the heat pad usually being at a potential identical to the ground.

· Small Outline Integrated Circuit (SOIC)

You find the SOIC package to be a surface mounted chip package with a rectangular design with two leaded edges.

You can design this package by employing lumps of copper or solder to attach the die to the leads.

With this design, you note a heat transfer path is formed between the die, leads, and motor drive PCB.

Typically, you find wire bonds are employed for die attachment with this package type.

How do you Remove Heat from SOT and SOIC Packages on a Motor Driver PCB?

You note the SOT and SOIC packages’ design lacks a pad employed for heat elimination in other packages.

However, the removal of heat from the motor driver PCB is conducted via the packages’ leads.

For these packages, you can employ a design where the leads are appended to extended copper features.

This design allows you to eliminate the power dissipated by the large currents through the leads via the copper features.

Given that, you observe a significant improvement in the thermal performance of the packages.

It is common to find the package’s pin structure affixed to the copper features to aid power transfer.

Usually, you connect the power, ground, and output to a distinct copper feature.

Moreover, you find this copper feature connected to another copper pour on the reverse board side via thermal vias.

You secure the connection between the package pins and the copper to eliminate the manifestation of thermal relief.

Thus, you achieve an impressive thermal performance ensuring maximum heat is successfully eliminated.

You can also use vias with large holes for the PCB to minimize the thermal resistance observed.

You find this possible due to the impracticality of locating in-pad vias on SOIC and SOT packages.

Can you Employ Flip-Chip QFN Package on a Motor Driver PCB?

Yes, you can.

You can have the flip-chip Quad Flat No-lead package in different designs for use on your motor driver PCB.

You find standard designs to include heat pads with an asymmetrical shape or in extended parallel formation.

You identify a significant notable difference between the flip-chip QFN package with the standard QFN package.

You employ several heat pads for heat elimination with the flip-chip QFN rather than a single pad in the QFN.

You find the presence of many pads on a single package complicates the package design.

For such a design, you find all the individual pads with contrasting signals require connection to the determinate copper features.

What Signals are Transferred by Pins in QFN Packages for Motor Driver PCB?

You note that different pads carry different signals for the QFN package used on a motor driver PCB.

You find three common signals transferred via these pads: power, ground, and output.

You can find a package with multiple pads depending on the type and application needs.

Using a motor driver PCB with multiple layers, you can employ vias within the pads to connect the layers.

You note that the pins will be connected to their respective planes in the case of several layers.

For instance, a pad employed for ground signal transfer will be connected to the ground plane by a via.

Can you Connect the Package Pads Directly to the Copper Area on a Motor Driver PCB?

You can directly connect the pads on a package to your copper features from where the heat will be dispersed.

You can furnish a copper area around the chip location to ensure the increased surface area for heat dissemination.

With this design, you can use different areas on the copper features for connecting the pads.

You can divvy up the area into two halves for connecting the power and output pads, respectively.

You can still employ vias for the ground pads when using a direct connection.

You find this useful where the copper feature for the ground is located on the circuit board’s underside.

Servo motor PCB controller

Servo motor PCB controller

What Happens when you Cannot Place Vias on Motor Driver PCB Chip Pads?

Many motor driver PCBs allow you to fabricate vias in the pad locality.

Some circuit boards have pads that can support up to six vias for each pad.

However, sometimes the PCB layout is such that furnishing in-pad vias are unlikely.

You find such an instance where surface-mounted technology is used, limiting the constitution of the pad.

In this case, you can provide a connection between the pad and the vias by carrying out a routing procedure.

You find this approach to significantly lower the effectiveness of thermal management compared to using in-pad vias.

However, this methodology has the advantage of eliminating the occurrence of solder wicking, which increases thermal resistance that hampers performance.

 Types of vias

Types of vias

Why are Padded Packages Preferred in Motor Driver PCB?

You identify padded packages with a centered pad at their underside attached to the base of the die.

The pad collects the heat generated by the chip via the die before transferring it to the copper features.

You provide the connection between the copper features and the pad by soldering.

Soldering provides a conductive path for thermal energy from the chip’s pad to the copper area from whence it’s dispersed.

Furthermore, you can fabricate several vias on the pads to reduce the overall thermal resistance and increase performance efficiency.

The vias offer a connection between the pads and the ground layer where sufficient heat removal is undertaken.

You are better placed employing vias with reduced hole size to minimize the occurrence of solder wicking.

Therefore, to achieve a large performance via hole, you employ as many vias as can be accommodated.

Can you Employ Vias Within and Without the Pad of a Chip on a Motor Driver PCB?

You can employ vias within a chip’s pad as well as outside the pad area.

You are not limited to only one via design configuration finding the flexibility to use both for increased thermal performance.

You can observe the ability to employ both in-pad vias and outside vias on a TSSOP package.

You find this package type to support a broad copper base on which extra vias can be furnished.

Furnishing vias outside the pad area allows you to increase the paths of thermal conductivity.

Thus, you note a vastly improved thermal management system when you employ vias on both the pad area and outside.

How is the Copper Area of a Motor Driver PCB Designed?

You find the conduction property of copper concerning heat and an electrical charge is impressive.

Consequently, you find the use of copper on your motor driver PCB to be effective in determining its heat performance.

You have the choice of using either thick copper or thin copper features on your motor driver PCB.

You can expect better thermal management with thick copper, but at a higher cost than thin copper.

Furthermore, when designing the motor driver PCB’s copper area, thick copper is challenging due to the space constraints.

You find thick copper to have large size and weight dimensions, which makes manipulation difficult.

You find the determination of thick or thin copper is based on the copper weight.

Copper weighing three ounces and above is referred to as thick copper; below that is thin copper.

You can furnish the motor driver PCB copper area in multiple layers to achieve the desired thickness.

1 oz copper is typically employed for the motor driver PCB; however, you can also use half-ounce copper.

Why are Vias Employed in Motor Driver PCBs?

You achieve efficient heat spreading when you employ a copper layer for your motor driver PCB.

However, with a multilayer construction, having these layers located internally traps the heat.

You have to eliminate the trapped heat to prevent build-up, which can result in thermal-induced strain.

You can use vias to effectively address the accumulation of heat on an internal layer surface.

Vias are plated through-holes that offer you interlayer connectivity on your motor driver PCB.

You can use vias for electrical signal transfer and heat conduction as thermal vias.

When you have dense circuitry with a high population, especially for double-sided boards, you find thermal management becomes difficult.

You can design your board to include copper pours connected with vias to manage the heat on both board sides.

DC brushless motor drive

DC brushless motor Drive

What is Thermal Resistance in Motor Driver PCB Vias?

You use thermal vias in transferring heat between the layers of a motor driver PCB.

However, when employing thermal vias, you need to consider several issues related to their fabrication for adequate thermal performance.

You find thermal resistance to be a prominent issue in the fabrication of thermal vias.

When heat is conducted through vias, thermal resistance is exhibited by falling temperature.

You observe thermal resistance to be a demonstration of an ineffective thermal via and needs to be addressed.

A practical approach to managing thermal resistance is fabricating large vias and filling them up with copper.

However, you note many thermal vias on motor driver PCBs are contained in-pad to afford the board direct heat transfer.

Consequently, fabricating these vias in large designs is ineffective due to the likelihood of solder wicking.

How can you address solder wicking in a motor driver PCB?

Solder wicking is a result of fabricating large thermal vias located within pads used for direct heat transfer.

Solder wicking occurred when the thermal via fills up with solder meant attaching the chip to the board.

Solder wicking causes your intended joint for chip-to-board attachment to weaken, which could potentially result in chip detachment.

You can employ a tent mechanism or reduced thermal via holes to address solder wicking.

Using a via with a reduced hole size ensures you record little solder entry when solder wicking occurs.

One limitation is you observe an increase in a single via’s thermal resistance due to the reduced hole size.

You note that the increase in thermal resistance reduces the effectiveness of the small via’s thermal performance.

However, you can mitigate this issue by using multiple small-hole vias to compensate for the performance levels.

What is Tenting in a Motor Driver PCB?

Tenting the vias at the flipside is a practical approach in helping you address solder wicking.

Here, you block the exit hole for the via on the reverse board side using a solder mask.

You find this approach to be especially useful when using vias with small holes.

Using a solder mask corks the via exit preventing the solder from trickling through.

A limitation you observe with this approach is its tendency to accumulate flux in the via cavity.

Solder paste usually contains flux whose conductive capability is reduced, resulting in partial heat transfer through the via.

Partial heat transfer is a demonstration of thermal relief, which is a reliability dampener in thermal vias.

Additionally, you find some flux compositions to be harsh to the via causing corrosion.

What Trace Width is Suitable for a Motor Driver PCB?

 PCB trace width

PCB trace width

You note the current through a motor driver PCB can exceed ten amperes.

Therefore, you need to furnish your board with a trace pattern of a suitable width to accommodate the sizeable current transfer.

When you use a motor driver PCB with a wide trace, you experience reduced resistance to the current flow.

The high resistance you observe in narrow trace results in considerable power dissipation that results in large heat generation.

You can use the current rating and copper weight of your PCB to determine an appropriate PCB trace width.

With this approach, you can confidently establish what current amount will be transferred with the least heat generation.

You can employ PCB traces with narrower widths, albeit for only short lengths.

You find the reduced path of current flow mitigates the deficiency of a narrow width.

However, when you employ PCB trace with such parameters, extended copper features are necessary.

These copper features take up heat sinks, allowing the heat produced to be conducted away adequately.

How do the Internal and External Layer Trace Widths of a Motor Driver PCB compare?

You realize the importance of having wider trace widths in heat conduction due to their low resistance exhibition.

Consequently, it is essential to furnish a motor driver PCB with a trace that is as wide as possible.

Furthermore, you can have narrow traces but for shorter PCB lengths to reduce the path of resistance.

Consequently, when power is dissipated, it is only to a small extent resulting in a reduced temperature rise.

Internal traces are those located on the surfaces of internal layers in a multilayer motor driver PCB construction.

Contrariwise, external PCB traces are located on the outermost surfaces of the circuit board.

During heat dissipation, you find the external traces provide much better performance due to their direct exposure to open space.

Alternatively, you find the internal layer’s position sandwiched between substrates that are poor conductors to hamper thermal performance.

As a result, you need to fashion the internal PCB traces at wider widths to compensate for their positional deficiency.

You will commonly find these internal traces made at double the width of the external traces.

Why are Package Pads Soldered to the Motor Driver PCB?

There are various chip types you can use on the motor driver PCB with different packages.

You find the base of these packages with pads that are joined to the base of the die.

You find these pads useful in eliminating heat from the component, necessitating their attachment to the PCB.

Therefore, you find pads soldered to the motor driver PCB to provide a direct heat transfer path.

The size of the pad will depend on the amount of power dissipated and the expected temperature rise.

Before soldering, you apply solder paste to the pads using a stencil to guide the application process.

You determine the shape of the solder pad and the amount of solder paste you intend to use.

A large stencil opening will result in more solder paste used, resulting in chip lifting on attachment.

Chip lifting results from the melting solder’s change in surface tension that weakens the joint created.

What is Solder Voiding in Motor Driver PCB Chip Attachment?

When attaching chips to the motor driver PCB, you use the soldering process to bond with the board.

However, you can experience some inadequacies when soldering, such as lifting and solder voiding.

You observe solder voiding to be the manifestation and presence of voids within your solder.

You find these cavities are a result of impulsive flux behavior contained in the solder paste.

Errant flux behavior is exhibited by its vaporization or boiling when the solder paste is melted to form the connection.

When this happens, you can observe the solder being ejected from its landing resulting in cavity formations.

You can address solder voiding by carefully applying the solder paste on the pads.

You need to apply the solder over small areas in small regular shaped deposits.

With a large solder pad, you make several small deposits rather than blankly applying a single lump and spreading it.

Using this approach, you provide room for impulsive flux behavior allowing breaks out to interfere with the solder position.

Eight channel motor drive

8 channel motor drive

What Guides the Placement of Components on Motor Driver PCB?

When attaching components to the motor driver PCB, you adhere to the general PCB guidelines for component placement.

As is typical, you furnish the signal trace on the top layer of the motor driver PCB.

Furthermore, your position bypass and bulk capacitors adjacent to each other and close to the board terminals.

Additionally, you need to position pump capacitors close to the motor driver PCB’s integrated circuit chips.

You find vias useful in creating interlayer connections for motor driver PCBs with multilayer configuration.

Consequently, you can create a signal path involving the different capacitors (bulk, bypass, and charge pump) when located on multiple layers.

What are Some of the Characteristics you can Find for a Motor Driver PCB?

You will find different motor driver PCBs with different parameters that will depend on the manufacturer.

You find these characteristics useful in determining the suitability of a particular board to your application.

Common features include:

  • An input voltage range of between 12-48 V.
  • An uninterrupted current flow of about nine amperes (9 A).
  • A maximum power rating of two hundred watts (200 W).
  • An operating temperature range between -10 0C – 70 0
  • A high-efficiency rate at over ninety percent.

Depending on your unique requirements and specifications, we offer a range of motor drive PCB according to your needs.

We have many types of PCB material which meet the dynamic needs of every application.

Contact us today for all your motor drive PCB needs.

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