What is a mobile phone PCB?
The Smartphone revolution necessitates the need for printed circuit boards that are manufactured according to the highest industry standards.
A PCB for a mobile phone from Super PCB suits a variety of parts and components
What is a mobile phone circuit board made of?
These different elements of a circuit board are made out of precious metals, including copper, gold, lead, silver, and palladium.
These materials are valuable—especially gold—so they can be extracted during the recycling process and resold.
How many layers is a phone PCB?
For example, mobile phone printed circuit boards can have as many as 12 layers as they are very complex devices.
Due to the versatility of multi-layer PCBs, it is used widely in many devices. There are many benefits of using these printed circuit boards.
If you are looking for a Mobile Phone PCB, be sure to find it at Venture. Venture is a PCB manufacturer and supplier for over more than 10 years.
We are supplying all kinds of PCBs to all over the world. We provide the best and durable Mobile Phone PCB.
You can choose from Venture a high-quality Mobile Phone PCB at a reasonable price.
Your Leading Mobile Phone PCB Supplier in China
As a leading manufacturer of PCBs, we supply the best Mobile Phone PCB. We are supplying PCBs for any type of mobile phone.
We offer a wide range of PCBs to meet our customer’s various demands.
Venture mobile phone PCBs suits a variety of components and parts.
Our PCB products are supplied using the latest technology, new equipment, and high-quality materials so you can assure the performance and quality of our mobile phone PCBs. We are using them so that we can satisfy the needs of our customers.
We can also produce PCBs for mobile phones according to our customer’s requirements. Just send to us your design and we will be happy to provide it.
Purchase now a Mobile Phone PCB from Venture. We are accepting a small or large quantity of orders.
Contact us for your inquiries and our friendly staff will entertain you.
Mobile Phone PCB: The Ultimate FAQ Guide
This guide covers everything you need to know about mobile phone PCB.
From material type, components, benefits, features to specification – it will help you become an expert in the mobile phone PCB industry.
So keep read to learn more.
- What Is Mobile Phone PCB?
- What Are The Advantages Of HDI Smartphone PCB?
- Which Are The Main Components Of Mobile Phone PCB?
- What Is The Role Of Linear IC In Cellphone PCB Assembly?
- Which Are The Common Substrate Materials For Flexible Mobile Phone PCB?
- What Are The Main Concerns During Placement And Routing Of Mobile Phone PCB Components?
- What Is The Role Of Line-Checking In Mobile Phone PCB Repair?
- How Do You Know There Is Shorting In Cellphone PCB?
- What Is The Difference Between Half Shorting Vs. Full Shorting In Mobile Phone PCB?
- How Do You Check Shorting Circuiting In Cell Phone PCB?
- What Is The Best Copper Foil Types For Flexible Smartphone PCB?
- Which Are The Two Important Substrate Material Properties For Efficient Thermal Management In Mobile Phone PCB For 5G Systems?
- What Are The Benefits Of Using High Frequency Rogers PCB Material In 5G Network Systems?
- What Is The Recommended Trace Spacing In Mobile Phone PCB Assembly?
- How Do You Ensure Power Efficiency In Smartphone PCB Design?
- What Are The Key Specifications Of Mobile Phone PCB You Should Communicate To Your PCB Manufacturer?
- Which Are The Connector Systems Used In Mobile Phone PCB?
- When Should You Use FPC Connectors In Smartphone PCB Assembly?
- Which Are The FPC Connector Styles Applicable In Mobile Phone PCB?
- How Do You Prevent EMI In Cellphone PCB Assembly?
- What Are The Main Considerations When Selecting The Microcontroller Of Smartphone PCB?
- How Do You Make Simple Mobile Phone PCB?
- What Is The Price Of Mobile Phone PCB?
- Can You Reuse Android Mobile Phone PCB?
What Is Mobile Phone PCB?
A mobile phone PCB is a non-conductive material onto which conductive pathways are engraved to make a functioning circuit for a mobile phone.
The board provides a platform for mounting electronic components that are connected through pathways to construct a working assembly for a mobile phone.
Mobile Phone PCB
What Are The Advantages Of HDI Smartphone PCB?
High Density Interconnect (HDI) technology is popular because of the advantage of being able to build efficient smartphone PCBs.
The technology enables manufacturing of smaller, long-lasting, and lighter smartphones that perform faster.
Through HDI technology, maximum exploitation of blind and buried vias by alternating and stacking them with microvias can be achieved.
In so doing, the HDI technology allows for improved performance in smartphone PCBs and reduces stress resulting from heat transfer.
In summary, the benefits of HDI technology in smartphone PCBs are:
- It allows mounting of more components onto smaller boards because both sides of the smartphone PCB can be used.
- Reduced power usage thus increasing the longevity of smartphone batteries.
- It results in a more solid smartphone PCB leading to compact and mechanically strong phones.
- Wearing out due to thermal activity is reduced leading to long life of the smartphone PCBs.
- Leads to high efficiency achieved due to computation and high density transmission within smaller areas leading to smaller smartphone PCBs.
Which Are The Main Components Of Mobile Phone PCB?
The components of a mobile phone PCB can be divided into two major sections which are the power section and the network section.
The network section is located beneath the antenna point but above the power section.
Figure 1 below shows an image showing the various parts of a mobile phone’s PCB.
The parts explained after figure 1 can belong to either the power section or network section.
Mobile Phone PCB Components
It is the point to which the antenna is connected and is normally found at the top of a mobile phone PCB.
It is located in the network section and is merged with the PFO.
PFO is the short for Power Frequency Oscillator. It is located next to the antenna switch.
Network IC can be located either beneath or beside the PFO and antenna switch. In some cases, it is merged with the Central Processing Unit (CPU).
It is the micro-chip found in the power section of your mobile phone PCB.
Even various phones may have different architecture but the power IC is mostly located next to the battery terminals in phones with inbuilt battery.
Power IC has several brown colored capacitors around it. Some mobile phones have two power ICs.
The function of power IC is to supply the required quantities of voltage and current to various parts of the mobile phone PCB.
The purpose of the CPU is to coordinate and control program instructions in the phone and other activities of the phone.
The Central Processing Unit is the largest IC in the mobile phone PCB and it is situated at the power section. There are mobile phones that have two CPUs embedded in their PCBs.
This is the IC found next to the CPU.
It is the IC with 20 legs
It is the IC beside R22 in the power section
It is the IC parallel to the power IC
Read Only Memory (ROM) is where the operating systems software program for the phone is stored.
Random Access Memory is located in the power section. Its duty is to send and receive operating systems command when the phone is being used.
Mobile Phone Coil
Can be found in any section of the mobile phone PCB and it serves to filter and decrease current and voltage.
They are in different shapes and sizes and also found in different colors.
What Is The Role Of Linear IC In Cellphone PCB Assembly?
Linear integrated circuit refers to a very small electronic analog circuit formed on a single piece of a semiconductor material.
Its function is to transform an analog signal so that the output signal varies in accordance with the variable input signal.
Linear integrated circuits are used to filter, amplify, modulate, and demodulate signals in mobile phones.
Which Are The Common Substrate Materials For Flexible Mobile Phone PCB?
Flexible mobile phone PCB is that which has at least some portion of it that can be bent.
In the manufacture of flexible mobile PCBs, the most used materials for the substrate are the polyimide (PI) film and PET (polyester) film.
Polyamide (PI) is preferred due to its high tensile strength, temperature and chemical resistance, good electrical properties, heat resistance, and longevity.
The other substrate material available is polymer film such as PEN, PTFE, and Aramid.
Liquid crystal polymer (LCP) substrate is another substrate material that is becoming popular for manufacturing flexible mobile phone PCBs.
That is because it overcomes the downsides of the PI material while also retaining the desired properties of PI.
Resin is also used to bind copper foil and substrate material together tightly during the manufacture of flexible mobile phone PCBs.
The resin can be acrylic resin, modified epoxy resin, PET resin, and PI resin.
Copper is another top grade material used in making flexible mobile phone PCB.
Copper is used to fill to fill holes, vias, traces, pads, and tracks as a conducting material.
What Are The Main Concerns During Placement And Routing Of Mobile Phone PCB Components?
Component placing and routing should be given due consideration in your mobile PCB manufacturing endeavor.
Like with all other aspects of PCB design, there are durability and performance issues corresponding to component placing and routing.
To realize the best performance, one should consider placing the components in the order below:
- Power circuits
- Precision and sensitive circuits
- Critical circuitry components
Some of the tips for effective components placement in the design of your mobile PCB layout include:
Group Components By Function
See to it that components are grouped according to their functional block. For instance, power management components should not be put together with analog parts.
Components Should Be Kept Away From The Heat Dissipating Area
Avoid placing components too close to the voltage regulator, op-amp, or other heat emitting devices.
Place Board To Wire Connectors Near The Edge Of The Board
This does not only make your mobile PCB look organized but also prevents unnecessary contact with other parts of the PCB.
Have The Components Orientation Standardized
Components such as the ICs should be aligned in the same direction.
That makes the assembly process efficient and reduces chances of making placement mistakes.
Aligning components in the same direction also reduces soldering errors that are some of the most common causes of mobile phone PCB failures.
Provide Space For Copper Traces
As you place your components, ensure you leave sufficient space for copper traces to pass through to make routing efficient and possible.
- Last but not least, avoid placing components directly opposite plated through-hole components on the side of the board that is soldered.
What Is The Role Of Line-Checking In Mobile Phone PCB Repair?
Line-checking is the expression used in the mobile phone repair industry to refer to following tracks to locate broken parts in a PCB.
It is also sometimes referred to as circuit-tracing.
Broken lines is one of the major causes of malfunctioning in parts of PCBs.
Line checking is instrumental in establishing if it’s a component malfunctioning or if it is just a connection.
How Do You Know There Is Shorting In Cellphone PCB?
Shorting here refers to the creation of a low resistance path allowing huge amounts of current to flow in the wrong direction.
The huge currents can be damaging to the components of the cellphone PCB.
The following signs could be an indication of short-circuiting in your phone PCB:
- Your phone goes of automatically a few minutes after turning it on
- Your phone becomes completely dead
- The phone heats up and hangs
- The phone battery discharges too fast (in case of half shorting)
What Is The Difference Between Half Shorting Vs. Full Shorting In Mobile Phone PCB?
Half shorting occurs when the phone PCB draws lots of current from the battery making it to swell and drop in capacity.
Half shorting can sometimes make the phone to be dead.
Half shorting could be as a result of a dry solder on the PCB or a faulty component of the mobile phone PCB.
The faulty components should be removed and replaced with the help of a multi-meter.
Full shorting, in contrast, is the scenario where your phone does not switch on.
To troubleshoot, you may either use a new LCD panel or connect to a DC power supply.
A zero reading when connected to the DC power supply means that the phone is dead.
How Do You Check Shorting Circuiting In Cell Phone PCB?
Either analog or digital multi-meter can be used to locate short circuits in mobile phone PCBs.
DC power supplies cannot sense very small shorts on the motherboard which sometimes lead to shorting in cellphone PCBs.
It is therefore recommended that you use multi-meters to establish which part of your PCB is really short.
Using your multi-meter, follow the following steps to diagnose shorting in your PCB:
- Set your multi-meter on continuity buzzer
- Connect the red probe of the multi-meter to the PCB’s battery connector plus and the black probe to the minus connector.
- If the meter shows no reading in step two, do the opposite. Connect the black probe to the battery plus and the red probe to the battery minus and the multi-meter will show some reading.
Digital multi-meters usually show readings between 300 and 600.
If the multi-meter shows readings in both connections in steps 2 and 3 above then it means there is a shortage.
What Is The Best Copper Foil Types For Flexible Smartphone PCB?
As smartphones evolve to perform many functions, their power demand also rises.
That implies manufactures have to endeavor to come up with corresponding batteries to meet the new power demand.
The challenge associated with increasing a battery’s capacity is that the thickness of the phone has to increase as the battery size increases.
This can be solved by adopting flexible PCBs that are amenable to bending around tight angles to accommodate everything within a small footprint.
Thick copper layers made in the form of mechanically rolled copper foils are ideal for making the flexible smartphone PCBs.
They have the ability to withstand bending pressure more than the electrodeposited copper used in rigid PCBs.
Which Are The Two Important Substrate Material Properties For Efficient Thermal Management In Mobile Phone PCB For 5G Systems?
Beside frequency and speed requirements, materials selection is another important aspect in preventing signal degradation and maintaining signal integrity in 5G design.
In readiness for the 5G technology, PCB manufacturers are already coming up with PCB substrate materials with lower dielectric constant than FR4.
In contrast to the PTFE laminates, the new materials have less losses at the 5G wireless higher frequencies.
Mobile phone PCBs operating in 5G networks require processors and amplifiers that can withstand high speed and high frequencies.
Variations in the performance of PCB components can be reduced by sound thermal management.
Thermal conductivity and thermal coefficients are the material properties to focus on for efficient thermal management in mobile phone PCBs in 5G network.
High signal speeds associated with 5G technology leads to dissipation of a lot of heat in mobile PCBs.
The materials used to make core substrate for mobile PCBs operating in 5G environment must therefore be able to handle high frequencies.
Poor quality substrate materials could lead to warping, shrinking, copper trace peeling, and delamination leading to deterioration of the mobile PCB.
A material of higher thermal conductivity, good heat transfer, and consistent dielectric constant is ideal for making a mobile PCB for 5G system.
The two thermal properties above are a measure of changes of the dielectric constant of a substrate material with changes in temperature. To explain further;
A substrate material of higher thermal conductivity will easily dissipate heat away from the mobile phone PCB.
Such a material is a better choice for making mobile phone PCBs for 5G system where speed and frequency are needed high.
Thermal Coefficient Of Expansion
Varying dielectric constant can lead to dispersion along an interconnect.
Drastic dispersion may stretch digital pulses and change the speed of propagation of the pulses along the interconnect.
Dispersions may lead to signal reflections along transmission lines in extreme cases.
Despite the material you select, it is important to observe best PCB design practices to maintain constant impedance throughout the interconnects.
What Are The Benefits Of Using High Frequency Rogers PCB Material In 5G Network Systems?
Generally, Rogers material is preferred not only because of its high quality but because it can also deliver best results in challenging environments.
High Frequency Rogers PCB Material
Some of the performance and electrical related properties of Rogers material that makes it superior include:
- There are low electrical signal losses in Rogers PCB material because it has less dissipation factor (DF).
- Rogers material has least moisture absorption making them able to be used in difficult conditions and unstable environment. The less the moisture absorption, the higher the integrity of thermal and electrical properties.
- There are low dielectric losses in Rogers PCB material
- The Rogers material has high thermal management capability
- The Rogers PCB substrate material has widely ranging dielectric constant with DK values, in between 2.55-10, leading to increased impedance stability.
- The outgassing is low for space applications of Rogers material
- Not performance related but using Rogers material in your mobile PCB fabrication is cost-effective
What Is The Recommended Trace Spacing In Mobile Phone PCB Assembly?
The trace routing used to distribute power throughout your mobile phone PCB should be adequate for the current they are carrying.
A minimum trace spacing of 2.5mil is recommended for mobile phone PCBs.
How Do You Ensure Power Efficiency In Smartphone PCB Design?
A power efficient smartphone PCB should have almost zero power fluctuations, low power consumption, and a stable power regulation.
A smartphone that cannot operate for more than an hour cannot compete in the market.
The first and important aspect of designing a power efficient smartphone PCB is selecting components that are power efficient.
The source of power, which is a battery in a smartphone PCB, should also be considered in your power efficiency endeavors.
You should consider how long you would want your battery to run your smartphone before it requires a recharge.
The processing power and memory of your smartphone PCB are also critical in ensuring that your software runs within minimal computational time.
A power efficient smartphone PCB should be one that consumes less energy and dissipates little heat.
The selection of laminate, via hole construction, and how you place components on your printed circuit board determines how efficient it becomes.
The ICs processing information should be selected such that they only consume the power the need to process information.
The data processing, signal processing, and other power intensive components should be designed to sleep when they are not in use.
When in sleep mode, components draw little power as they wait for the next task to be available. Drawing little power contributes to power efficiency.
The components you select for your mobile phone PCB should also be able to provide stable power.
Power stability implies power integrity thus leading to power efficiency.
Solving all the power efficiency requirements in your mobile phone PCB lies in making the right design decisions including stack up design, routing, and layout.
What Are The Key Specifications Of Mobile Phone PCB You Should Communicate To Your PCB Manufacturer?
In order to ultimately end up with the mobile PCB that fits your needs, you should capture the following details while placing your order to your manufacturer:
- Type Of The Board – whether rigid or flexible
- Material Selection – specify the substrate material. It could be FR4, high frequency board, CM1, or CM3.
- The Number Of Layers you require
- The Shape Of The Board – whether it should be round, rectangular, complex, or irregular. You should also provide details of slots and cut-outs
- Cutting – Tab routed, shear, or V-score.
- The Thickness Of The Board – this could range from 0.2mm to 4.0 mm. The regular thickness is 1.6mm.
- Copper Thickness – ranges from 0.5 to 4oz. Regular is 1oz
- Solder Mask – could be yellow, green, blue, red, or any other.
- Silk Screen – black, white, or any other desired color
- Silk Screen Minimum Line Width – can be 0.006 inches or 0.15mm
- Minimum Trace Or Gap – minimum is 0.1mm or 4mils
- The Minimum Dimeter Of The Holes To Be Drilled – the minimum is 0.1 inches, 0.25mm, or 10mils
- Surface Finish – OSP, HASL, ENIG, and many more
Since every board can be unique in its own way, try to give the manufacturer as lots of details as you can, including ones not captured above.
Which Are The Connector Systems Used In Mobile Phone PCB?
Some of the most common PCB connector products used for mobile phone PCBs are:
- Board-to-Board Connectors
- Flex-to-Board Connectors
- Wire-to-Board Connectors
- Battery Connectors & Holders
- Card Edge Connectors
- Memory Card Connectors
- FPC Connectors
When Should You Use FPC Connectors In Smartphone PCB Assembly?
FPC connectors are normally used in scenarios when small centerline spacing renders larger wire-to-board interconnects impractical.
As the demand for slim smartphones becomes high, FPC connectors have been customized to meet the demands of that expanding market.
The FPCs help in realizing lighter interconnect solutions, smaller center line or pitch spacing, and lower profile heights.
Which Are The FPC Connector Styles Applicable In Mobile Phone PCB?
The Flexible Printed Circuit (FPC) connector style options applicable on mobile phone PCBs are:
- ZIF Connector Style – use an actuator to secure the flex cable
- Non-ZIF Connector Style – use friction in securing the flex cable
- Actuator Styles – uses a flip lock actuator for greater printed circuit retention
- Contact Style – could have bottom contact, top contact, or dual contact design
How Do You Prevent EMI In Cellphone PCB Assembly?
Electromagnetic interference (EMI) in mobile phone PCBs refers to the electromagnetic energy that interferes with signaling in the phone through induction or radiation.
In order to prevent such interferences, the mobile phone PCB should be deigned to be EMI resistant.
Some of the design techniques employed to make cellphone PCBs EMI resistant include:
Ground plane is the copper foil used to reduce noise caused by electromagnetic interference in PCB.
The ground plane can be effectively used to reduce EMI in the mobile phone PCB in the following ways:
Use Of Multi-Layered Board
With more than one layer used in making your mobile phone PCB, crosstalk can be re-directed to the inner layers to absorb noise.
Cautious Use Of Split Ground Planes
Avoid using split ground unless you really have to because they can act as slot antennas thus releasing radiations leading to interference.
Connect Ground Planes Only At A Single Point
Using more than one ground connection increases the likelihood of loopholes leading to higher chances of radiation.
Connect Bypass Or Decoupling Capacitors To The Ground Plane
This reduces current path hence reducing radiations.
For the trace layout, observe the following practices:
- Avoid sharp right-angle bends because capacitance increases at the sharp bends leading to reflections. Round bends can be used instead.
- Isolate low speed signals from the high speed ones to minimize chances of interference occurring.
- Use vias sparingly because they add their own inductance and capacitance effects which may lead to reflections resulting from changes in characteristic impedance.
- Avoid using vias in differential traces and keeping return paths short.
- Keep differential traces as close as possible.
Arrangement Of Components
How components are arranged in the mobile phone PCB also has an impact on EMI. Some of the best practices in arranging components include:
- DC circuits should be separated from AC circuits using shield or separate grounds to avoid crosstalk
- High frequency components such as processors can be isolated from the low frequency ones using shielding and filtering to avoid interference.
Faraday cage technology can be used to shield components that produce radiations to prevent them from interfering with signals.
What Are The Main Considerations When Selecting The Microcontroller Of Smartphone PCB?
Before you instruct a manufacturer to produce your smartphone PCBs, you have to make design considerations such as the suitable microcontroller to use.
Some of the factors you should consider when settling on a microcontroller for your smartphone PCB include:
You can go for a microcontroller with only internal memory or one that can communicate with external devices.
You may also choose to have a reprogrammable microcontroller or one that is only programmed one time.
Your choice of programming option will depend on the intended application.
In case your smartphone PCB microcontroller will use in-built peripherals then you should seek to know which ones they are.
It is recommended that you use external parts to install desired functionalities if possible.
You should gauge your RAM requirements and consider expansion possibilities using external RAM.
This includes the architecture of the PCB, hardware, and software programming tools that are necessary to set up the microcontroller.
How Do You Make Simple Mobile Phone PCB?
The first step in making a simple mobile phone PCB is assembling the right materials and tools.
Also, the tools you will need include a soldering gun, hand drill, a laser printer, latex gloves, protective eyewear, and a flat iron.
The necessary materials are tweezers, a fine-tipped marker, a bare PCB board, and an etching solution.
You will also need mobile PCB components as will be specified in design.
You should then purchase a PCB software after gathering the materials and tools you need.
The best software solution should offer you a wide array of design features.
Go for a design software with library creation tools, a schematic editor, and 3D viewing. Good software solutions also offer electronic engineering tutorials.
You should then proceed to design your mobile phone PCB and produce layouts.
A smartphone is wireless so it will require an antenna on its PCB to function.
Your design should therefore include an antenna. It is recommended that you use a high frequency antenna in your mobile PCB design to end up with an efficient phone.
Once your design is complete, test the manufacturability of your mobile PCB.
This step is crucial because it helps in noting errors that could occur so that you can correct them.
After choosing the right bare PCB board, create the required pathways on the board and do away with the unnecessary copper.
The track creation process is accomplished using an etching solution such as ferric chloride.
A photographic method is used so as to come up with the right pattern of tracks. Copper on the bare PCB board is covered with a thin layer of photo-resist.
The bare board is then exposed to light through a photo mask that has the details of the pattern required.
The image of the track patterns will then be passed over to the photo-resist.
The photo-resist can then be placed on the board to guide in marking out the pathways. The bare board is then placed in chloric acid to eliminate the sections where no track or copper is required.
A hand drill can then be used to make holes on the board at the appropriate positions.
Once the tracks have been etched, the PCB components can be soldered onto the board as outlined in the design.
What Is The Price Of Mobile Phone PCB?
The price of a mobile phone PCB ranges from $0.50 to about $8.00 per piece depending on specifications.
The higher the specifications, the higher the price.
You could pay less per mobile phone PCB if you buy in bulk.
Can You Reuse Android Mobile Phone PCB?
Up to 80% of the parts of a mobile phone can be reused including plastics and metals.
Parts of the mobile phone PCB such as metals can be melted and remolded for other uses.
Scrap mobile phone PCB has got considerable amount of copper that can be extracted for reuse.
The amount silver, tin, or gold may be negligible and might not be worth recycling.
The substrate material which forms the bulk of the mobile phone PCB is not reusable.
It is therefore generally copper that is recyclable in the bare mobile phone PCB.
Moreover, mobile phone PCBs should be gathered in quantities as big as 100kg for recycling them to make economic sense.
The cost of freight will otherwise be higher than the value of scrap recovered from the PCBs.
Unpopulated PCBs can be recycled for other uses such as making picture frames and beer mats. This can only be done at a small scale though.
Components of the mobile phone PCB such as capacitors can be extracted if still in good shape for use in other projects.
Re-using them doesn’t make economic sense though because the components easily get damaged.
The recycled components also have to be tested to confirm if they still function resulting, still, in more expenses.
Besides, the recycled parts will also be of poor quality and the cost of labor recycling them could be almost enough to buy you new ones.
At Venture Electronics, we help you find the best PCB for your electronics.
Contact us today for all your mobile phone PCBs.