Your Best HDI PCB Stackup Partner
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Venture HDI PCB Stackup regulates lamination that affects plated-through holes. Venture makes sure that we are producing the best quality HDI PCB Stackup. We are confident of the materials we have been using especially in HDI PCB Stackup. You can always trust Venture when it comes to manufacturing the best performing products, specifically HDI PCB Stackup.
High Density Interconnect PCB is indicated to the value of buried, micro vias and blinds which form compact boards. By choosing Venture HDI PCB Stackup, you will be no more worried about how it lasts, because we provide lasting and reliable types of HDI PCB Stackup.
Your Leading Supplier HDI PCB Stackup in China
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Venture is professional in serving outstanding quality and reliability of HDI PCB Stackup. HDI PCB Stackup is in best signal integrity for the components that are near to each other and stops the signal path length. HDI PCB Stackup removes by stumpy end, reason why it reduces reflections of signal enhance its quality.
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HDI PCB Stack up- The Ultimate FAQ Guide
The HDI PCB stack-up is an important concept in the industry. Little wonder several questions are flooding the internet.
People want answers, and this guide is committed to providing much-needed solutions.
Do you have questions on the ins and outs of HDI PCB stack-up?
Sit tight, follow-through, and this ultimate guide will provide immense enlightenment.
- What Is HDI PCB Stack-up?
- What Are The Types of HDI PCB Stack-up?
- What Are The Things To Consider In The Design Of HDI PCB Stackup?
- What Are The Benefits Of HDI PCB Stackup?
- What Are Vias In HDI PCB Stackup Design?
- What Are The Types Of Vias Used In The Design Of HDI PCB Stackup?
- What Are The Applications Of The HDI PCB Stackup?
- What Is A HDI Layout In Terms Of HDI PCB Stackup?
- What Are The Three Approaches Manufacturers Use To Assemble HDI PCB Stackup?
- How Do I Know A Material Is Fit For The Manufacturing Of HDI PCB Stackup?
- What Is The Structure Of HDI PCB In Relationship With HDI PCB Stackup?
- What is The Future Prospect In Market Value Of HDI PCB Stackup?
- What Is The Concept Of HDI PCB Stackup With BGAs?
- What Are The Difficulties Encountered In HDI PCB Stackup?
- What Is The Difference Between The HDI Board And An Ordinary PCB board as they relate to HDI PCB Stackup?
- What Is The HDI PCB Laminate Structure In Terms Of HDI PCB Stackup?
- What Are The Features Of HDI PCB Stackup?
- What Are The Dos And Don’t Of HDI PCB Stackup?
What Is HDI PCB Stack-up?
First stop: HDI is an abbreviation of High-Density Interconnect. Hence they are printed circuit boards having a higher wiring density than the standard printed circuit boards.
Since we have established the fact above, let’s now see what HDI PCB stack-up is.
HDI PCB stack-up involves the use of micro, buried, and blind vias to form a compact board. It is the underlying substance where the component assembly lies.
HDI PCB Stack-up
What Are The Types of HDI PCB Stack-up?
You have a good range of HDI PCB stack-up to choose from. They are;
0-N-0 (Type I)
In this type of HDI stack-up, The laser micro vias are dominant.
The following procedures are typical with the 0-N-0(Type I) HDI-stack-up
- Lamination of the core by the manufacturer
- Mechanical drilling of the core
- Plating the mechanical drill
- The manufacturer form the laser-drilled vias
- Forming the final through-hole vias
0-N-0 HDI PCB Stack-up
1-N-1 (Type II)
Manufacturers use the buried vias and micro vias in this type of HDI PCB Stack-up. The number” 1″ indicates two HDI layers on either side of the core.
See the process below;
- Lamination of the core
- Mechanical drilling of the core
- Plating the mechanical drill
- The manufacturer creates an inner layer
- The manufacturer adds two more layers through sequential lamination
- The mechanical drill becomes a buried vias
- The manufacturer form the laser-drilled vias
- Forming the final through-hole vias
1-N-1 HDI PCB Stack-up
2-N-2 (Type III)
This comes with micro vias. The number “2” indicates double lamination on both sides of the core. This double lamination adds four copper layers.
Therefore there is a total of six layers. In the type III HDI stack-up, the manufacturer plates the micro vias with copper.
2-N-2 HDI PCB Stack-up
What Are The Things To Consider In The Design Of HDI PCB Stackup?
Do you want to design an HDI PCB Stack-up? Please note that you should consider a few things before kick-starting the process.
One edge of the HDI PCB stack-up is quality thermal performance. Hence you should use components that will help the stack-up achieve this feat.
Consider the thermal stability of the micro vias. In the case of high-speed designs, you have to factor in the trace widths.
You to design the stack-up such that impedance does not disturb signal quality. Hence, trace widths, dielectric layer thickness, and spacings should be tolerant within 10%.
Since HDI is suitable for high-speed designs, you should factor in the noise signals.
What Are The Benefits Of HDI PCB Stackup?
The HDI PCB stack-up holds several benefits. Let’s see what they are;
HDI PCB enables you to have all functionalities in one board. Hence you don’t spend as much as having the functions in separate PCBs.
HDI PCB also enhances product performance; therefore, you get a good return on investment.
Lightweight And Flexibility
HDI PCBs have an ideal weight and do not consume much space. Hence they are suitable for congested regions.
HDI PCB stack-up reduces the gap between electrical components on the board. As a result, it boosts the performance of the PCB.
There is better signal integrity with the HDI PCB stack-up. The HDI technology creates shorter signal paths and reduces signal reflection.
Faster To Build
Building the HDI PCB stack-up is quite convenient for manufacturers. Moreover, its processes take minimal time; hence customers can get the product faster.
The HDI PCB comprises vias that make the board resistant to extreme environmental conditions.
What Are Vias In HDI PCB Stackup Design?
Vias are an essential component in the HDI PCB stack-up design.
Vias are holes on the printed circuit boards(PCB). They enable the connection between different layers of the multilayer PCB.
- Barrel: this is a conductive tube that fills the drilled hole
- Pad: connects or joins each end of the barrel to the electrical components
- Antipad: this is a clearance hole between the barrel and no-connect layer
What Are The Types Of Vias Used In The Design Of HDI PCB Stackup?
There are different types of vias that have her application in the design of HDI PCB stack-up.
Types of PCB Vias
Let’s see what they are.
Blind vias are holes the manufacturer creates using a laser or a drill. It connects the external layer to the internal layer of a multilayer HDI PCB design.
This via has the name “blind vias” because it is a hole visible on just one side of the PCB. Blind vias are quite expensive and challenging to construct.
This type of via occurs from the top to the bottom of the PCB. The manufacturer creates it by using a drill or laser.
Since the through-hole vias run from top to bottom, they connect all the multilayer HDI PCB layers.
Through-hole vias prove to be the most inexpensive vias. They are also easy to construct.
The through-hole vias are of two types, namely;
- Non plated through-holes: they do not have copper pads
- Plated through-holes: they have copper pads
As the name implies, they are the smallest vias with a diameter of fewer than 150 microns. They connect one layer of the PCB to its adjacent layer.
The manufacturer creates the micro vias using a laser. As a result of their size, they find relevance in more complex designs requiring denser PCBs.
It is a via inside the PCB that you can’t see from the outside from its name. So, therefore, it has the name buried vias.
Buried vias connect two internal layers of multilayer of HDI PCB. It needs a separate drill since it is an electroplated hole.
What Are The Applications Of The HDI PCB Stackup?
The HDI PCB stack-up has its application in several industries and devices
The HDI PCB stack-up has relevance in the electronic designs for aircraft, missile systems, and other air military defense systems.
This is possible because the HDI CB stack-up is suitable for extreme environmental conditions.
HDI technology is important in the medical field and other related healthcare sectors. For example, you can find HDI PCBs in devices such as hearing aids, peacemakers, X-rays, etc.
Consumer Gadgets Or Devices
You can use the HDI PCB stack-up for consumer devices such as computers, smartphones, home appliances, tablets, etc.
Other applications of the HDI PCB includes;
- Smart clothing
- VR headsets
- Smartwatches etc
What Is A HDI Layout In Terms Of HDI PCB Stackup?
The HDI layout is the mode of arrangement of high-density components of the printed circuit board. It is a set of techniques that enables all parts to fit into the HDI board.
An HDI layout involves the following;
- Thinner traces
- Smaller vias
- Lower signal levels
- Higher layer count
What Are The Three Approaches Manufacturers Use To Assemble HDI PCB Stackup?
There are three approaches manufacturers use to assemble the HDI PCB stack-up.
Let’s see what they are;
Sequential lamination is when a manufacturer inserts a dielectric between two copper layers along with a laminated sub-composite.
Manufacturers use the buried vias, bling plated-through, and blind vias for the sequential lamination.
The regular lamination involves fabricating successive layers of the HDI material. Then, the manufacturer goes further to bind the layers.
The idea behind lamination is to prevent copper from accidentally conducting signals. The plated through-hole is dominant for this approach.
Lamination build up with micro vias
This is still the lamination process, but this time using micro vias.
How Do I Know A Material Is Fit For The Manufacturing Of HDI PCB Stackup?
A wrong choice of PCB material puts the whole HDI process in jeopardy. Therefore, manufacturers should answer some key questions to get suitable materials for the task.
- Will the material meet the thermal needs? If yes, then it is fit for the process.
- Is the dielectric compatible with the core substrate material? Whatever dielectric you use must be compatible with the core substrate material.
- Are the micro vias reliable?
- Is the material resistible to thermal shocks
- Does the dielectric have good plated copper adhesion?
What Is The Structure Of HDI PCB In Relationship With HDI PCB Stackup?
An HDI PCB is a circuit board having the following;
- Multiple layers
- 127mm micro via diameter
- 35mm pad diameter
- 10mm line space
Experts have it that the structure of HDI PCB is symmetrical. The HDI PCB being symmetrical means that it has both inner and outer layers.
The inner layers are perfectly symmetrical, and the buried vias penetrate this inner symmetrical axis.
On the other hand, the outer layer brace the inner layer, and the blind vias separate them.
The symmetrical structure of the HDI PCB plays a vital role. The following problems may arise if the HDI PCB is unsymmetrical.
- The board may bend due to differences in stresses and temperature
- Places of higher concentration of copper wires will have more resins
- There will be uneven thickness leading to higher cost
What is The Future Prospect In Market Value Of HDI PCB Stackup?
The introduction of HDI technology to PCBs has given it a great boost in the market.
The fact is unarguable as HDI PCB gains application in the electronic sector, automotive, and IT/communication sectors.
The vast application of the HDI PCB creates outstanding potential market growth.
Report linker has it that the market analyst projects the HDI technology to reach a market value of 16.4 billion dollars by 2025. This shows a compound annual growth of 6%-8% between 2020-2025.
The drivers for the HDI PCB market include;
- Lesser weight and smaller size of components
- Its high performance
- Rising demand for high efficiency
- Pacy growth of consumer electronic market
What Is The Concept Of HDI PCB Stackup With BGAs?
BGA is an abbreviation for Ball Grid Arrays. It is a chip carrier for integrated circuits.
Manufacturers use BGAs to mount electronic components on the PCB permanently.
The concept which brings HDI PCB stack up and BGAs together is the BGA escape routing.
BGA escape routing talks about component placement (pins) to facilitate the connection between board layers.
BGAs increase the chance of moving to any layer of the HDI PCB stack-up.
What Are The Difficulties Encountered In HDI PCB Stackup?
The following are the challenges of the HDI PCB stack-up.
- Vias holes tend to be sensitive. This is because they are important materials for HDI PCB stack-up but may be prone to high thermal stress.
- Manufacturers have no option but to use the appropriate materials. There is no room for managing material or improvisions.
- Plating problems: Manufacturers must adhere to the aspect ratios to yield plating integrity
- The equipment for HDI PCB are quite expensive
- When manufacturers use pre-pregs, the glasses in the pre-pregs tend to change laser direction. The change in direction results in poor shape quality of laser via holes
What Is The Difference Between The HDI Board And An Ordinary PCB board as they relate to HDI PCB Stackup?
The HDI board differs from ordinary PCB in the following areas.
The ordinary PCB has a large aspect ratio, while the HDI board possesses a small aspect ratio
The ordinary PCB has numerous layers, but the HDI PCB has lesser layers
The ordinary PCB has average or minimal component density. In contrast, the HDI PCB has a high component density.
Mechanical drilling is relevant to the ordinary PCB, while manufacturers employ laser drilling in the HDI PCB.
The HDI PCB provides enhanced performance compared to the ordinary PCB with average performance.
The ordinary PCB tends to be heavy, while the HDI PCB is lightweight.
Low Pitch Packages
The ordinary PCB is not compatible with low pitch packages. On the other hand, the HDI PCB works perfectly with low pitch packages.
What Is The HDI PCB Laminate Structure In Terms Of HDI PCB Stackup?
Laminates are subcomposites (sublayers) of the HDI PCB.
They have different structures, so let’s see a few of them.
- One layer HDI PCB: this is one layer of six layers PCB which has a laminate structure of 1+4+1
- Primary HDI 6-layer board with laminate structure (1+N+1) where N is even number and N is greater or equal to 2.
- Secondary 8-layer board with structure (1+1+N+1+1) where N is an even number and N is greater or equal to 2.
What Are The Features Of HDI PCB Stackup?
The HDI PCB has its unique features. They include;
- Extremely small vias. The industry calls them micro vias. Manufacturers drill the micro vias with laser, and they have an aspect ratio of 1:1
- Buried vias are another feature of the HDI PCB stack-up. The buried vias connect the inner layers of the stack up together.
- Blind vias are also present in the mix. They connect outer layers to the inner layers. The blind vias make the connection without invading the entire board.
- Presence of Elic, which are stacked copper–filled micro vias which joins the different layers of the PCB
What Are The Dos And Don’t Of HDI PCB Stackup?
The dos and don’t of HDI PCB point out the best practices a manufacturer must adopt in handling HDI PCN stack-up.
What Manufacturers Should Do
Below are the good practices in terms of HDI PCB stack up.
- The thickness of signal layers must correlate with that of the prepegs, ground layers, power, and core. Therefore, any shift from this instruction will make the thickness counterbalance the trace calculations and micro via.
- Double-check on your HDI PCB design. Then place the ground layers and power layers closely. Next, perform the same action with inner power layers and signal layers.
- For high-speed layers, route them on the thinnest microstrips.
- Use multiple grounded power layers to minimize ground impedance
- Check fabricator’s specifications. Ensure that all you want to design and achieve with the PCB does not exceed the fabricator’s abilities. Things to consider should include trace width, copper weight, etc.
- You can improve the assembly shield by adding perimeter guard traces and board level shield.
- Good communication with fabricators is vital. It would be awesome if you asked the fabricator questions for clarity in case you are unsure about anything.
- You can boost the HDI power integrity by placing the ground layers and power layers adjacent to each other.
- Try to use the same material for all HDI layers. The action minimizes delamination.
Things Manufacturers Should Not Do
- Use a stack–up type that suits your design. For example, please do not use a type II stack-up for a design which a type I stack-up best fits.
- Only use type IV, V, VI for more complex designs
- Do not put two signal layers at adjacent positions to each other.
- Do not neglect the fabricator’s guide or flow process
For all your HDI PCB stack up requirements, contact Venture Electronics now.